Abstract: A vapor chamber is provided to include shell, capillary tissue, working fluid, heat-absorbing section and heat-releasing section. A hollow chamber is formed in the shell. The capillary tissue is arranged and accommodated in the hollow chamber. The working fluid is injected into and filled in the hollow chamber. Two corresponding surfaces of the shell at the heat-releasing section are respectively a non-planar shape. Because the two corresponding surfaces of the shell at the heat-releasing section are respectively a non-planar shape, the structure strength of the vapor chamber is higher and the anti-deforming ability is superior, thereby the using life of the vapor chamber being prolonged. In addition, the vapor chamber can be combined with cooling fins to become a cooling device.

Abstract: A heat-dissipating device includes a vapor chamber shown as a flat long plate, a heat-dissipating plate superposed on the vapor chamber, and a first fin set. The middle portion of the vapor chamber is designed as a heated section, two sides of which respectively have a condensing section. Two curvedly extending sections are respectively disposed between the heated section and the condensing sections. Each condensing section is extended to a higher position of the heated section through the bending of each extending section. The heat-dissipating plate is horizontally attached onto the two condensing sections, thus that a section-differential space formed between the heat-dissipating plate and the heated section accommodates the first fin set thermally contacted with the heated section of the vapor chamber.

Abstract: A panel heat-dissipating device includes a heat-conducting base, a vapor chamber, and at least one fin assembly. The heat-conducting base has a heat-conducting surface for allowing the vapor chamber to be thermally connected thereon. The vapor chamber forms extending portions toward the lateral of the heat-conducting base. The extending portion of the vapor chamber toward the lateral of the heat-conducting base allows the fin assembly to be disposed thereon. The fin assembly and the heat-conducting base are located to the same side of the vapor chamber. Via this arrangement, the heat-dissipating device occupies less space in the height.