Patents by Inventor Chieh-Ping WANG
Chieh-Ping WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12283485Abstract: A gate stack can be etched to form a trench extending through the gate stack, the trench removing a portion of the gate stack to separate the gate stack into a first gate stack portion and a second gate stack portion. A dielectric material is deposited in the trench to form a dielectric region, the dielectric region having an air gap in the dielectric material. The air gap may extend upward from beneath the gate stack to an area interposed between the end of the first gate stack portion and the end of the second gate stack portion. Contacts to the first gate stack portion and contacts to the second gate stack portion may be formed which are electrically isolated from each other by the dielectric material and air gap formed therein.Type: GrantFiled: July 25, 2022Date of Patent: April 22, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Gang Chen, Wan-Hsien Lin, Chieh-Ping Wang, Tai-Chun Huang, Chi On Chui
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Publication number: 20250125150Abstract: A gate stack can be etched to form a trench extending through the gate stack, the trench removing a portion of the gate stack to separate the gate stack into a first gate stack portion and a second gate stack portion. A dielectric material is deposited in the trench to form a dielectric region, the dielectric region having an air gap in the dielectric material. The air gap may extend upward from beneath the gate stack to an area interposed between the end of the first gate stack portion and the end of the second gate stack portion. Contacts to the first gate stack portion and contacts to the second gate stack portion may be formed which are electrically isolated from each other by the dielectric material and air gap formed therein.Type: ApplicationFiled: December 26, 2024Publication date: April 17, 2025Inventors: Ting-Gang Chen, Wan-Hsien Lin, Chieh-Ping Wang, Tai-Chun Huang, Chi On Chui
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Patent number: 12255205Abstract: A semiconductor device with isolation structures of different dielectric constants and a method of fabricating the same are disclosed. The semiconductor device includes fin structures with first and second fin portions disposed on first and second device areas on a substrate and first and second pair of gate structures disposed on the first and second fin portions. The second pair of gate structures is electrically isolated from the first pair of gate structures. The semiconductor device further includes a first isolation structure interposed between the first pair of gate structures and a second isolation structure interposed between the second pair of gate structures. The first isolation structure includes a first nitride liner and a first oxide fill layer. The second isolation structure includes a second nitride liner and a second oxide fill layer. The second nitride layer is thicker than the first nitride layer.Type: GrantFiled: May 27, 2022Date of Patent: March 18, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chieh-Ping Wang, Tai-Chun Huang, Yung-Cheng Lu, Ting-Gang Chen, Chi On Chui
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Publication number: 20250006560Abstract: A method for forming a semiconductor device includes: forming a gate structure over a fin, where the fin protrudes above a substrate; forming an opening in the gate structure; forming a first dielectric layer along sidewalls and a bottom of the opening, where the first dielectric layer is non-conformal, where the first dielectric layer has a first thickness proximate to an upper surface of the gate structure distal from the substrate, and has a second thickness proximate to the bottom of the opening, where the first thickness is larger than the second thickness; and forming a second dielectric layer over the first dielectric layer to fill the opening, where the first dielectric layer is formed of a first dielectric material, and the second dielectric layer is formed of a second dielectric material different from the first dielectric material.Type: ApplicationFiled: September 9, 2024Publication date: January 2, 2025Inventors: Chieh-Ping Wang, Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui
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Publication number: 20240413150Abstract: A semiconductor device with isolation structures of different dielectric constants and a method of fabricating the same are disclosed. The semiconductor device includes fin structures with first and second fin portions disposed on first and second device areas on a substrate and first and second pair of gate structures disposed on the first and second fin portions. The second pair of gate structures is electrically isolated from the first pair of gate structures. The semiconductor device further includes a first isolation structure interposed between the first pair of gate structures and a second isolation structure interposed between the second pair of gate structures. The first isolation structure includes a first nitride liner and a first oxide fill layer. The second isolation structure includes a second nitride liner and a second oxide fill layer. The second nitride layer is thicker than the first nitride layer.Type: ApplicationFiled: July 31, 2024Publication date: December 12, 2024Applicant: Taiwan Semiconductor Manufacturing Company , Ltd.Inventors: Chieh-Ping Wang, Tai-Chun Huang, Yung-Cheng Lu, Ting-Gang Chen, Chi On Chui
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Publication number: 20240371875Abstract: A semiconductor device includes first transistor having a first gate stack and first source/drain regions on opposing sides of the first gate stack; a second transistor having a second gate stack and second source/drain regions on opposing sides of the second gate stack; and a gate isolation structure separating the first gate stack from the second gate stack. The gate isolation structure includes a dielectric liner having a varied thickness along sidewalls of the first gate stack and the second gate stack and a dielectric fill material over the dielectric liner, wherein the dielectric fill material comprises a seam.Type: ApplicationFiled: July 12, 2024Publication date: November 7, 2024Inventors: Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui, Chieh-Ping Wang
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Patent number: 12119268Abstract: A method for forming a semiconductor device includes: forming a gate structure over a fin, where the fin protrudes above a substrate; forming an opening in the gate structure; forming a first dielectric layer along sidewalls and a bottom of the opening, where the first dielectric layer is non-conformal, where the first dielectric layer has a first thickness proximate to an upper surface of the gate structure distal from the substrate, and has a second thickness proximate to the bottom of the opening, where the first thickness is larger than the second thickness; and forming a second dielectric layer over the first dielectric layer to fill the opening, where the first dielectric layer is formed of a first dielectric material, and the second dielectric layer is formed of a second dielectric material different from the first dielectric material.Type: GrantFiled: August 1, 2023Date of Patent: October 15, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chieh-Ping Wang, Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui
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Patent number: 12087775Abstract: A semiconductor device includes first transistor having a first gate stack and first source/drain regions on opposing sides of the first gate stack; a second transistor having a second gate stack and second source/drain regions on opposing sides of the second gate stack; and a gate isolation structure separating the first gate stack from the second gate stack. The gate isolation structure includes a dielectric liner having a varied thickness along sidewalls of the first gate stack and the second gate stack and a dielectric fill material over the dielectric liner, wherein the dielectric fill material comprises a seam.Type: GrantFiled: September 1, 2021Date of Patent: September 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui, Chieh-Ping Wang
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Patent number: 11955370Abstract: A system and methods of forming a dielectric material within a trench are described herein. In an embodiment of the method, the method includes introducing a first precursor into a trench of a dielectric layer, such that portions of the first precursor react with the dielectric layer and attach on sidewalls of the trench. The method further includes partially etching portions of the first precursor on the sidewalls of the trench to expose upper portions of the sidewalls of the trench. The method further includes introducing a second precursor into the trench, such that portions of the second precursor react with the remaining portions of the first precursor to form the dielectric material at the bottom of the trench.Type: GrantFiled: September 18, 2020Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo-Cyuan Lu, Ting-Gang Chen, Sung-En Lin, Chunyao Wang, Yung-Cheng Lu, Chi On Chui, Tai-Chun Huang, Chieh-Ping Wang
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Publication number: 20230386931Abstract: A method for forming a semiconductor device includes: forming a gate structure over a fin, where the fin protrudes above a substrate; forming an opening in the gate structure; forming a first dielectric layer along sidewalls and a bottom of the opening, where the first dielectric layer is non-conformal, where the first dielectric layer has a first thickness proximate to an upper surface of the gate structure distal from the substrate, and has a second thickness proximate to the bottom of the opening, where the first thickness is larger than the second thickness; and forming a second dielectric layer over the first dielectric layer to fill the opening, where the first dielectric layer is formed of a first dielectric material, and the second dielectric layer is formed of a second dielectric material different from the first dielectric material.Type: ApplicationFiled: August 1, 2023Publication date: November 30, 2023Inventors: Chieh-Ping Wang, Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui
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Patent number: 11823955Abstract: A method for forming a semiconductor device includes: forming a gate structure over a fin, where the fin protrudes above a substrate; forming an opening in the gate structure; forming a first dielectric layer along sidewalls and a bottom of the opening, where the first dielectric layer is non-conformal, where the first dielectric layer has a first thickness proximate to an upper surface of the gate structure distal from the substrate, and has a second thickness proximate to the bottom of the opening, where the first thickness is larger than the second thickness; and forming a second dielectric layer over the first dielectric layer to fill the opening, where the first dielectric layer is formed of a first dielectric material, and the second dielectric layer is formed of a second dielectric material different from the first dielectric material.Type: GrantFiled: May 13, 2022Date of Patent: November 21, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chieh-Ping Wang, Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui
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Publication number: 20230369452Abstract: Methods of forming a semiconductor device structure are described. In some embodiments, the method includes forming fins from a substrate, forming a dummy gate stack over portions of the fins, forming epitaxial source/drain regions adjacent the dummy gate stack, depositing a first inter-layer dielectric (ILD) over the epitaxial source/drain region, replacing the dummy gate stack with a first gate stack, forming a trench through the first gate stack and into an isolation region under the first gate stack, and forming a dielectric layer in the trench by an atomic layer deposition process, wherein the dielectric layer is non-conformal.Type: ApplicationFiled: May 13, 2022Publication date: November 16, 2023Inventors: Chieh-Ping WANG, Ting-Gang CHEN, Tai-Chun HUANG
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Publication number: 20230008494Abstract: A semiconductor device includes first transistor having a first gate stack and first source/drain regions on opposing sides of the first gate stack; a second transistor having a second gate stack and second source/drain regions on opposing sides of the second gate stack; and a gate isolation structure separating the first gate stack from the second gate stack. The gate isolation structure includes a dielectric liner having a varied thickness along sidewalls of the first gate stack and the second gate stack and a dielectric fill material over the dielectric liner, wherein the dielectric fill material comprises a seam.Type: ApplicationFiled: September 1, 2021Publication date: January 12, 2023Inventors: Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui, Chieh-Ping Wang
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Patent number: 11532479Abstract: A gate stack can be etched to form a trench extending through the gate stack, the trench removing a portion of the gate stack to separate the gate stack into a first gate stack portion and a second gate stack portion. A dielectric material is deposited in the trench to form a dielectric region, the dielectric region having an air gap in the dielectric material. The air gap may extend upward from beneath the gate stack to an area interposed between the end of the first gate stack portion and the end of the second gate stack portion. Contacts to the first gate stack portion and contacts to the second gate stack portion may be formed which are electrically isolated from each other by the dielectric material and air gap formed therein.Type: GrantFiled: April 1, 2020Date of Patent: December 20, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ting-Gang Chen, Wan-Hsien Lin, Chieh-Ping Wang, Tai-Chun Huang, Chi On Chui
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Publication number: 20220359206Abstract: A gate stack can be etched to form a trench extending through the gate stack, the trench removing a portion of the gate stack to separate the gate stack into a first gate stack portion and a second gate stack portion. A dielectric material is deposited in the trench to form a dielectric region, the dielectric region having an air gap in the dielectric material. The air gap may extend upward from beneath the gate stack to an area interposed between the end of the first gate stack portion and the end of the second gate stack portion. Contacts to the first gate stack portion and contacts to the second gate stack portion may be formed which are electrically isolated from each other by the dielectric material and air gap formed therein.Type: ApplicationFiled: July 25, 2022Publication date: November 10, 2022Inventors: Ting-Gang Chen, Wan-Hsien Lin, Chieh-Ping Wang, Tai-Chun Huang, Chi On Chui
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Publication number: 20220293596Abstract: A semiconductor device with isolation structures of different dielectric constants and a method of fabricating the same are disclosed. The semiconductor device includes fin structures with first and second fin portions disposed on first and second device areas on a substrate and first and second pair of gate structures disposed on the first and second fin portions. The second pair of gate structures is electrically isolated from the first pair of gate structures. The semiconductor device further includes a first isolation structure interposed between the first pair of gate structures and a second isolation structure interposed between the second pair of gate structures. The first isolation structure includes a first nitride liner and a first oxide fill layer. The second isolation structure includes a second nitride liner and a second oxide fill layer. The second nitride layer is thicker than the first nitride layer.Type: ApplicationFiled: May 27, 2022Publication date: September 15, 2022Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.Inventors: Chieh-Ping WANG, Tai-Chun Huang, Yung-Cheng Lu, Ting-Gang Chen, Chi On Chui
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Publication number: 20220278000Abstract: A method for forming a semiconductor device includes: forming a gate structure over a fin, where the fin protrudes above a substrate; forming an opening in the gate structure; forming a first dielectric layer along sidewalls and a bottom of the opening, where the first dielectric layer is non-conformal, where the first dielectric layer has a first thickness proximate to an upper surface of the gate structure distal from the substrate, and has a second thickness proximate to the bottom of the opening, where the first thickness is larger than the second thickness; and forming a second dielectric layer over the first dielectric layer to fill the opening, where the first dielectric layer is formed of a first dielectric material, and the second dielectric layer is formed of a second dielectric material different from the first dielectric material.Type: ApplicationFiled: May 13, 2022Publication date: September 1, 2022Inventors: Chieh-Ping Wang, Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui
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Patent number: 11348917Abstract: A semiconductor device with isolation structures of different dielectric constants and a method of fabricating the same are disclosed. The semiconductor device includes fin structures with first and second fin portions disposed on first and second device areas on a substrate and first and second pair of gate structures disposed on the first and second fin portions. The second pair of gate structures is electrically isolated from the first pair of gate structures. The semiconductor device further includes a first isolation structure interposed between the first pair of gate structures and a second isolation structure interposed between the second pair of gate structures. The first isolation structure includes a first nitride liner and a first oxide fill layer. The second isolation structure includes a second nitride liner and a second oxide fill layer. The second nitride liner is thicker than the first nitride liner.Type: GrantFiled: April 30, 2020Date of Patent: May 31, 2022Inventors: Chieh-Ping Wang, Tai-Chun Huang, Yung-Cheng Lu, Ting-Gang Chen, Chi On Chui
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Patent number: 11335603Abstract: A method for forming a semiconductor device includes: forming a gate structure over a fin, where the fin protrudes above a substrate; forming an opening in the gate structure; forming a first dielectric layer along sidewalls and a bottom of the opening, where the first dielectric layer is non-conformal, where the first dielectric layer has a first thickness proximate to an upper surface of the gate structure distal from the substrate, and has a second thickness proximate to the bottom of the opening, where the first thickness is larger than the second thickness; and forming a second dielectric layer over the first dielectric layer to fill the opening, where the first dielectric layer is formed of a first dielectric material, and the second dielectric layer is formed of a second dielectric material different from the first dielectric material.Type: GrantFiled: September 17, 2020Date of Patent: May 17, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chieh-Ping Wang, Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui
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Publication number: 20210407807Abstract: A method for forming a semiconductor device includes: forming a gate structure over a fin, where the fin protrudes above a substrate; forming an opening in the gate structure; forming a first dielectric layer along sidewalls and a bottom of the opening, where the first dielectric layer is non-conformal, where the first dielectric layer has a first thickness proximate to an upper surface of the gate structure distal from the substrate, and has a second thickness proximate to the bottom of the opening, where the first thickness is larger than the second thickness; and forming a second dielectric layer over the first dielectric layer to fill the opening, where the first dielectric layer is formed of a first dielectric material, and the second dielectric layer is formed of a second dielectric material different from the first dielectric material.Type: ApplicationFiled: September 17, 2020Publication date: December 30, 2021Inventors: Chieh-Ping Wang, Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui