Patents by Inventor Chieh YEH

Chieh YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation structure
    Patent number: 12787153
    Abstract: A heat dissipation structure including a circuit board, a heat component, a metal component, a heat dissipation medium, and a heat sink is proposed. The heat component is connected to one side of the circuit board. The metal component is connected to another side of the circuit board and has a first concave-convex surface. The heat dissipation medium is connected to the metal component. The heat sink is connected to the heat dissipation medium and has a second concave-convex surface. The heat component, the circuit board, the metal component, the heat dissipation medium, and the heat sink are connected in sequence. The shape of the first concave-convex surface corresponds to the shape of the second concave-convex surface. One side of the heat dissipation medium is connected to the first concave-convex surface, and another side of the heat dissipation medium is connected to the second concave-convex surface.
    Type: Grant
    Filed: June 7, 2024
    Date of Patent: November 3, 2026
    Assignee: WISTRON NEWEB CORPORATION
    Inventor: Chieh Yeh
  • HEAT DISSIPATION STRUCTURE
    Publication number: 20250133651
    Abstract: A heat dissipation structure including a circuit board, a heat component, a metal component, a heat dissipation medium, and a heat sink is proposed. The heat component is connected to one side of the circuit board. The metal component is connected to another side of the circuit board and has a first concave-convex surface. The heat dissipation medium is connected to the metal component. The heat sink is connected to the heat dissipation medium and has a second concave-convex surface. The heat component, the circuit board, the metal component, the heat dissipation medium, and the heat sink are connected in sequence. The shape of the first concave-convex surface corresponds to the shape of the second concave-convex surface. One side of the heat dissipation medium is connected to the first concave-convex surface, and another side of the heat dissipation medium is connected to the second concave-convex surface.
    Type: Application
    Filed: June 7, 2024
    Publication date: April 24, 2025
    Inventor: Chieh YEH