Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.

Abstract: The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing.

Abstract: The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: La3(1?x)Ga1?yGe5(1?z)O16: 3xA3+, yCr3+, 5zB4+, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.

Abstract: The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: La3(1?x)Ga1?yGe5(1?z)O16: 3xA3+, yCr3+, 5zB4+, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.

Abstract: The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

Abstract: The invention provides a light emitting sensing device and a manufacturing method thereof. The light emitting sensing device comprises: a non-translucent substrate having a first surface with at least one recess formed on the first surface; a light emitting element disposed in the at least one recess; a light sensing element disposed on the first surface; a first transparent material disposed in the at least one recess and covering the light emitting element; and a second transparent material disposed on the first surface and covering the light sensing element. The light emitting sensing device provided in this embodiment solves the problem in the prior art, the infrared light emitted by the light emitting chip irradiates into the sensing chip and causes the sensing chip to be interfered by the light of the light emitting chip resulting in reduced sensing accuracy.

Abstract: The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing.

Abstract: A light emitting device including a first work circuit and a second work circuit is provided. The first work circuit includes a first LED chip and a first bonding adhesive. The first LED chip and the first bonding adhesive are electrically connected in series. The second work circuit includes a second LED chip. When an operation current of the first work circuit and an operation current of the second work circuit are the same, the first work circuit has a first voltage VW1 and the second work circuit has a second voltage VW2, wherein VW1?VW2.