Abstract: An electronic device is provided, including a display module, an input module, a hinge module, and an antenna. The hinge module connects the display module and the input module and has a first side and an opposite second side. The antenna is disposed in the hinge module and is situated on the first side. When the display module is rotated with respect to the input module, the hinge module forces the antenna to move from the first side to the second side.

Abstract: An electronic device is provided, including a display module, an input module, a hinge module, and an antenna. The hinge module connects the display module and the input module and has a first side and an opposite second side. The antenna is disposed in the hinge module and is situated on the first side. When the display module is rotated with respect to the input module, the hinge module forces the antenna to move from the first side to the second side.

Abstract: An airflow guiding and heat dissipating assembly is mounted in an electronic device and has a base and at least one baffle being mounted on the base. Multiple electronic components are mounted on the base and are arranged in a line. Airflow flows along one electronic component upstream, past the baffle and then over the other electronic component downstream to take away heat from the electronic component. The baffle prevents the airflow from becoming turbulent and, therefore, temperatures of the electronic component are lowered efficiently.

Abstract: A liquid cooled heat sink has a thermal conduction plate and a liquid cooling module. The liquid cooling module is attached securely to the thermal conduction plate and has a distribution tank, a collection tank and a pipe assembly. The pipe assembly has multiple pipes of at least two different gauges and each pipe has a pipe inlet and a pipe outlet respectively secured to the distribution tank and the collection tank. Since a sum of the gauges is increased and each pipe need not to be coiled, an extra strong pumping system is not needed and design complexity is reduced.

Abstract: An airflow guiding and heat dissipating assembly is mounted in an electronic device and has a base and at least one baffle being mounted on the base. Multiple electronic components are mounted on the base and are arranged in a line. Airflow flows along one electronic component upstream, past the baffle and then over the other electronic component downstream to take away heat from the electronic component. The baffle prevents the airflow from becoming turbulent and, therefore, temperatures of the electronic component are lowered efficiently.