Abstract: A method includes measuring a first thickness at a first location of the polishing pad and a second thickness at a second location of the polishing pad; obtaining a first reference thickness at the first location of the polishing pad, wherein the first reference thickness is an average thickness of multiple thicknesses at the first location; obtaining a second reference thickness at the second location of the polishing pad, wherein the second reference thickness is an average thickness of multiple thicknesses at the second location; calculating a first thickness difference; calculating a second thickness difference; modifying a conditioning parameter value at the first location of the polishing pad; and sweeping a conditioner across a surface of the polishing pad; and applying a downforce or a sweeping speed to the conditioner that urges the conditioner against the first location of the polishing pad according to the modified conditioning parameter value.

Abstract: A method is provided and includes: measuring a surface profile of a polishing pad; obtaining a reference profile of the polishing pad; comparing the surface profile of the polishing pad with the reference profile to generate a difference result; determining a conditioning parameter value according to the difference result; and conditioning the polishing pad using the conditioning parameter value.

Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

Abstract: A method is provided and includes: measuring a surface profile of a polishing pad; obtaining a reference profile of the polishing pad; comparing the surface profile of the polishing pad with the reference profile to generate a difference result; determining a conditioning parameter value according to the difference result; and conditioning the polishing pad using the conditioning parameter value.

Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.

Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.

Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.

Abstract: A detachable chair includes a first frame member including two first side rails having a lengthwise slit, front first cross rails, and rear second cross rails; a second frame member including two second side rails, first seat rails having either end portion projecting laterally out of the second side rail, and a second seat rail disposed rearward of the first seat rails and having either end being about flush with an outer surface of the second side rail; and a backrest including two side sheaths adapted to insert through the slits and fastened by rods. Inserting the second frame member through a gap between one second cross rail and one first cross rail until being stopped by the first frame member with the second side rails rested upon one first cross rail will assemble the inclined frame members as a chair.

Abstract: A detachable ladder is disclosed that includes a lower frame including two substantially trapezoidal legs, a first board interconnected tops of the legs, and one or more crosspieces interconnected the legs; and an upper frame including two side units each including a substantially trapezoidal upper element having its forward end pivotably secured to a top front end of the leg, and a lower support extended downward from the upper element, a second board interconnected bottoms of the upper elements, a third board interconnected tops of the upper elements, and one or more fourth boards interconnected intermediate portions of the upper elements. Pivoting the upper frame about the lower frame until the tops of the upper elements rest upon a supporting ground will convert the ladder into a chair.

Abstract: An assembly is provided for mounting a monitoring device on a license plate of a vehicle. The assembly comprises a frame and a fixing device. The frame comprises a hole surrounding a monitoring device. The fixing device is for fixing the frame on the license plate to position the monitoring device on and adjacent to the boundary of the license plate. The assembly may further comprise a spacer between the hole and the rear of the vehicle.