Abstract: An anti-peep display device includes a display module and an anti-peep module disposed on the display module. The anti-peep module includes the following features. The first light incident surface faces the display surface, the second and third light incident surfaces are located on opposite sides of the first light incident surface, the first condensing portion is disposed corresponding to the second light incident surface and the first light source, the second condensing portion is disposed corresponding to the third light incident surface and the second light source, the first and second condensing portions convert beams of the first and second light sources into anti-peep beams with a beam angle less than 10 degrees, and the optical microstructures reflect the anti-peep beams and exit the anti-peep beams from the light guide plate. The present invention also provides an anti-peep method applicable to the anti-peep display device.

Abstract: First fire operations for an ovonic threshold switch (OTS) selector is provided. A first fire operation includes setting a peak amplitude of a voltage pulse, and performing at least one cycle, including: providing the voltage pulse to the OTS selector; sensing an output current passing through the OTS selector in response to the received voltage pulse; comparing a peak amplitude of the voltage pulse with a maximum peak amplitude ensuring initialization of the OTS selector; ending the first fire operation if the peak amplitude reaches the maximum peak amplitude; comparing the output current with a target current indicative of initialization of the OTS selector if the peak amplitude is lower than the maximum peak amplitude; ending the first fire operation if the output current reaches the target current; and setting another voltage pulse with a greater peak amplitude if the output current is lower than the target current.

Abstract: The present disclosure provides a semiconductor structure and a method of manufacturing the same. The semiconductor structure includes a sensing device, a solar cell, and an interconnecting structure. The solar cell is disposed above the sensing device and is electrically connected to the sensing device. The interconnecting structure is disposed between the sensing device and the solar cell and has a first surface facing the solar cell and a second surface facing the sensing devices. The interconnecting structure comprises a first energy storage component and a second energy storage component. The first energy storage component is disposed closer to the first surface of the interconnecting structure than the second energy storage component.

Abstract: Techniques and apparatuses directed to component shielding are described in this document. A first aspect relates to a system including a printed circuit board (PCB) oriented along a first plane, a device on the PCB, and a component shield having a wall structure oriented perpendicular to the first plane and a cover structure connected to the wall structure. The system includes a housing structure oriented along a second plane that is substantially parallel to the first plane. The first and second planes define a shielded space within which the component shield and the device reside. The system further includes a shielding layer residing at least partially between the cover and housing structures. The shielding layer has an irregular cross-section along a fourth plane perpendicular to at least one of the first or second planes and a third plane. The irregular cross-section includes a protrusion that extends from the third plane.

Abstract: The present invention provides a latching guide structure arranged inside a door of semiconductor carrier. The latching guide structure comprises an upper latching part, a lower latching part, at least one elastic unit and a driver. Moreover, a first guiding portion of the upper latching part is matched with a second guiding portion of the lower latching part, therefore to define the installation space for the at least one elastic unit. On the other hand, the driver simultaneously actuates an upper actuating unit of the first guiding portion and a lower actuating unit of the second guiding portion to linearly move in reverse direction therebetween. The range of the linear motion of the upper actuating unit and the lower actuating unit represents the compression or extension of the at least one elastic unit, determining to control the open/close status of the upper latching part and the lower latching part.

Abstract: The present invention provides a latching guide structure arranged inside a door of semiconductor carrier. The latching guide structure comprises an upper latching part, a lower latching part, at least one elastic unit and a driver. Moreover, a first guiding portion of the upper latching part is matched with a second guiding portion of the lower latching part, therefore to define the installation space for the at least one elastic unit. On the other hand, the driver simultaneously actuates an upper actuating unit of the first guiding portion and a lower actuating unit of the second guiding portion to linearly move in reverse direction therebetween. The range of the linear motion of the upper actuating unit and the lower actuating unit represents the compression or extension of the at least one elastic unit, determining to control the open/close status of the upper latching part and the lower latching part.

Abstract: An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

Abstract: A semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber. In embodiments in which the deposition process is a sputtering process, the electromagnetic field may be modified by adjusting a distance between a first coil and a mounting platform. In other embodiments, the electromagnetic field may be adjusted by applying or removing power from additional coils that are also present.

Abstract: The image sensing structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes at least one first unit. The at least one first unit includes a plurality of first interconnects adjacent to the top side of the first semiconductor device, a row selector, and an analog-to-digital converter (ADC) connected to the row selectors. The second semiconductor device includes at least one second unit. The at least one second unit includes a photodiode facing the top side of the second semiconductor device. The photodiode is configured to receive the light incident on the top side of the second semiconductor device. The top side of the first semiconductor device is bonded to the bottom side of the second semiconductor device.

Abstract: A pixel array includes octagon-shaped pixel sensors and a combination of visible light pixel sensors (e.g., red, green, and blue pixel sensors) and near infrared (NIR) pixel sensors. The color information obtained by the visible light pixel sensors and the luminance obtained by the NIR pixel sensors may be combined to increase the low-light performance of the pixel array, and to allow for low-light color images in low-light applications. The octagon-shaped pixel sensors may be interspersed in the pixel array with square-shaped pixel sensors to increase the utilization of space in the pixel array, and to allow for pixel sensors in the pixel array to be sized differently. The capability to accommodate different sizes of visible light pixel sensors and NIR pixel sensors permits the pixel array to be formed and/or configured to satisfy various performance parameters.

Abstract: A turbine vane in a gas turbine engine includes an inner platform, an outer platform, and a vane airfoil positioned therebetween. The vane airfoil includes a first cooling passage extending between the outer platform and the inner platform, and a second cooling passage extending between the outer platform and the inner platform. The second cooling passage is arranged downstream of the first cooling passage with respect to a flow direction. The turbine vane includes a jumper tube disposed between the second cooling passage and the inner platform. The jumper tube includes an inlet, an outlet, and a tube wall enclosing a hollow interior. The inlet is positioned a distance within the second cooling passage. The outlet is positioned at least partially through an aperture of the inner platform.

Abstract: An object storing and finding method and system integrating human sensor into lamp and working together with mobile device to perform object storing and finding operations of storage object in storage environment includes an object storing procedure that sets an identification code for the storage object, installs a human sensor to each lamp, and sets up Beacon host systems in the storage environment, and after detected by the human sensor, the Beacon host systems are triggered to send out coordinate value of the lamp located at position of the storage object and integrate coordinate value with the identification code to complete object storing operation; and an object finding procedure that inputs the identification code of the storage object by the mobile device and obtains the corresponding coordinate value, such that the corresponding lamp shows luminous change provided for user to visually observe and determine the position of the storage object.

Abstract: A high-speed connector includes an insulating housing, and a first terminal assembly mounted in the insulating housing. The first terminal assembly includes a plurality of first terminals, a first base body and a first conductive film. The plurality of the first terminals include at least two first grounding terminals and at least two first signal terminals. At least one portion of a bottom of the first base body extends downward to form at least one first protruding portion. The at least two first signal terminals penetrate through the at least one first protruding portion. The first conductive film is covered to the at least one first protruding portion. The first conductive film has a first metal layer. The first metal layer is electrically connected with the at least two first grounding terminals to form a grounding structure.

Abstract: A wrapper layer over a target interface receives requests from client devices over a different interface, converts the requests into a format that is compatible with the target interface, and transmits each converted request over the target interface for processing by a service. The wrapper layer also processes a request by a client device to subscribe to a certain type of update made via the target interface by verifying that the client device is authorized to access a resource associated with that type of update and creating a subscription that identifies the client device and the type of update. When the wrapper layer subsequently receives a request corresponding to that type of update, the wrapper layer matches attributes of the request to the subscription by the client device and transmits a message notifying the client device of the request.

Abstract: A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching a side of the second build-up layer located away from the first build-up layer to a core layer, and removing the carrier from the first build-up layer, where the first circuits are finer than the second circuits.

Abstract: A battery module and an operation method thereof are provided. The battery module includes multiple battery cells and a controller. Each of the battery cells has a power voltage terminal and a reference voltage terminal. The power voltage terminals of the battery cells are commonly coupled to a power voltage line of the battery module. The reference voltage terminals of the battery cells are commonly coupled to a reference voltage line of the battery module. Electrical energy of the power voltage line and the reference voltage line is used to supply power to a load system outside the battery module. The controller is coupled to the power voltage line and the reference voltage line to monitor charging and discharging operations of the battery cells.

Abstract: A method or a system for validating digital ownership in immutable databases via physical devices. The system receives a request for accessing a secure resource from a client device of a user of an immutable database, and requests a wallet address associated with a wallet of the user from the client device of the user. Responsive to receiving the wallet address, the system requests an identifier (ID) token from the immutable database based on the wallet address, the ID token containing a first set of identity data of the user. The system also requests a second set of identity data from the client device. The system compares the first set of identity data with the second set of identity data to determine whether there is a match. Responsive to determining that there is the match, the system grants the user a permission to access the secure resource.

Abstract: A hand-eye calibration method and a hand-eye calibration device for a robot arm are provided. The method includes following steps. A first mapping relationship between a base of the robot arm and a terminal of the robot arm and a second mapping relationship between a camera and a target object are obtained. Based on a scale, a third mapping relationship between the terminal of the robot arm and a tool set mounted on the terminal and a fourth mapping relationship between the camera and the base in each dimension are updated to minimize an error between a position of the target object in an image captured by the camera and a position of the tool set. In response to the error being convergent and the scale being less than or equal to a scale threshold, the third mapping relationship and the fourth mapping relationship calibrated by the scale are output.