Abstract: The present application discloses a beamforming antenna device and a method for operating a beamforming antenna device. The beamforming antenna device includes a plurality of antenna elements and a plurality of sub-arrays. The plurality of sub-arrays are coupled to the plurality of antenna elements. Each of the sub-arrays is coupled to its adjacent sub-arrays of the plurality of sub-arrays, and at least a portion of the plurality of sub-arrays form a sub-array chain.

Abstract: A method of making a semiconductor device includes etching an insulating layer to form a first opening and a second opening. The method further includes depositing a conductive material in the first opening. The method further includes performing a surface modification process on the conductive material. The method further includes depositing, after the surface modification process, a first liner layer in the second opening, wherein the first liner layer extends over the conductive material and the insulating layer. The method further includes depositing a conductive fill over the first liner layer, wherein the conductive fill includes a different material from the conductive material.

Abstract: An imaging system and an imaging method are provided for photographing samples in a non-complete plane arrangement. With using the imaging system and the imaging method, a clear image of each point of the sample can be obtained under a high-magnification microscope lens, and the steps of fixing and embedding the sample in advance can be simplified.

Abstract: A composite electrode structure and a method for manufacturing the same are provided. The composite electrode structure is used as a back electrode of a perovskite solar cell. The composite electrode structure includes a first conductive layer and a second conductive layer. The first conductive layer is used to connect with an electron transporting layer or a hole transporting layer. A material of the first conductive layer is a first light transmitting conductive oxide. The second conductive layer is disposed on the first conductive layer. A material of the second conductive layer is a second light transmitting conductive oxide or a conductive metal.

Abstract: A perovskite solar cell and a method for manufacturing the same are provided. The method includes: sputtering a compact layer onto a light transmitting electrode, in which the compact layer has a thickness ranging from 20 nm to 120 nm, and a material of the compact layer is titanium dioxide; sputtering a roughened layer onto the compact layer, in which the roughened layer has a thickness ranging from 20 nm to 30 nm, and a material of the roughened layer is titanium dioxide; disposing a perovskite layer onto the roughened layer; disposing a hole transporting layer onto the perovskite layer; and disposing a back electrode onto the hole transporting layer.

Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.

Abstract: The present invention relates to a reaction platform, which comprises: a machine body with a bottom plate for placing non-porous substrates; and a coater module configured on the top of the machine body and capable of maintaining a preset of a predetermined height for moving along the surface of non-porous substrate, wherein the coater module has one or more slits, and a target liquid can be directly injected or sucking in from the outside of the coater module through the slit, and spreading the target liquid onto a surface of the non-porous substrate while moving along the non-porous substrate; wherein the surface of the non-porous substrate has a target to be coated. The reaction platform of the present invention can not only save time, labor and cost, but also have accurate and reproducible experimental results, showing better results than traditional methods.

Abstract: A device includes a first semiconductor fin, a second semiconductor fin, a source/drain epitaxial structure, a semiconductive cap, and a contact. The first semiconductor fin and the second semiconductor fin are over a substrate. The source/drain epitaxial structure is connected to the first semiconductor fin and the second semiconductor fin. The source/drain epitaxial structure includes a first protruding portion and a second protruding portion aligned with the first semiconductor fin and the second semiconductor fin, respectively. The semiconductive cap is on and in contact with the first protruding portion and the second protruding portion. A top surface of the semiconductive cap is lower than a top surface of the first protruding portion of the source/drain epitaxial structure. The contact is electrically connected to the source/drain epitaxial structure and covers the semiconductive cap.

Abstract: A semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber. In embodiments in which the deposition process is a sputtering process, the electromagnetic field may be modified by adjusting a distance between a first coil and a mounting platform. In other embodiments, the electromagnetic field may be adjusted by applying or removing power from additional coils that are also present.

Abstract: A light sensor structure and the manufacturing method thereof are disclosed. The light sensor structure includes a substrate with a first surface and a second surface opposite to each other. A light sensing element including a light sensing area is disposed on the first surface. A reflection layer is disposed on the second surface. The reflection layer covers a portion of the second surface aligning with the light sensing area.

Abstract: A RF shielding socket, including a first tab shield portion on a first side of the socket; a second tab shield portion on a second side of the socket; an extension shield portion extending along a first direction between the first tab shield portion and the second tab shield portion, the extension shield portion including a plurality of clips, each of the clips protruding from the extension shield portion in a second direction traverse to the first direction; a plurality of pins positioned on a third side of the socket, the third side extending between the first side and the second side, a subset of the plurality of pins include a tabbed feature protruding from a body of the respective pin, wherein the tabbed feature of each of the subset of the plurality of pins is in contact with at least one of the clips of the plurality of clips.

Abstract: A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.

Abstract: A heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end connected to the vapor chamber; at least one partition disposed inside the heat pipe to partition the inside of the heat pipe into a first channel and a second channel isolated from each other; and a heat dissipation fin set disposed on the vapor chamber and partially covers the heat pipe. The vapor chamber is filled with a liquid working medium that absorbs the heat of the heat source and then gasifies into a gaseous working medium. The gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set, so the gaseous working medium is liquefied into the liquid working medium, and then the liquid working medium flows back into the vapor chamber.

Abstract: A motion simulator includes a base plate, a motion platform, a first actuator, a base, a second actuator and a carrying platform. The motion platform is arranged on the base plate and movably connected to the base plate. The first actuator is arranged on the motion platform, movably connected to the motion platform. The base has a base body extending in a length direction and a base extension surface extending in a width direction. The first actuator is movably connected to the base extension surface. The second actuator is movably arranged on the base. The carrying platform is movably connected to the second actuator. Through a connection relationship between the base and the second actuator, the first actuator performs a left-right movement of the carrying platform relative to the motion platform and the second actuator performs the forward-backward movement of the carrying platform relative to the motion platform.

Abstract: A light sensor structure and the manufacturing method thereof are disclosed. The light sensor structure includes a substrate with a first surface and a second surface opposite to each other. A light sensing element including a light sensing area is disposed on the first surface. A reflection layer is disposed on the second surface. The reflection layer covers a portion of the second surface aligning with the light sensing area.

Abstract: A fan structure includes a fan impeller, a fan seat and a hollow shaft rod. The fan impeller has a circumferential section and a top section. The circumferential section has multiple fan blades. The fan seat has a bearing cup. A light-emitting unit and a photoconductive component are received in the bearing cup. The hollow shaft rod has a first end, a second end and a through hole. The through hole axially passes through the hollow shaft rod between the first and second ends. A first end of the hollow shaft rod is inserted in the top section of the fan impeller. A second end of the hollow shaft rod is inserted in the bearing cup of the fan seat and assembled with the photoconductive component. The fan structure improves the shortcoming of the conventional light-emitting fan that the light can be hardly fully projected.

Abstract: A fan structure includes a fan impeller, a fan seat and a hollow shaft rod. The fan impeller has a circumferential section and a top section. The circumferential section has multiple fan blades. The fan seat has a bearing cup. A light-emitting unit and a photoconductive component are received in the bearing cup. The hollow shaft rod has a first end, a second end and a through hole. The through hole axially passes through the hollow shaft rod between the first and second ends. A first end of the hollow shaft rod is inserted in the top section of the fan impeller. A second end of the hollow shaft rod is inserted in the bearing cup of the fan seat and assembled with the photoconductive component. The fan structure improves the shortcoming of the conventional light-emitting fan that the light can be hardly fully projected.

Abstract: In a disassembling tool and method for disassembling a circuit board from a housing, and in an assembly of a circuit board, a housing and the disassembling tool, the disassembling tool is used to remove the circuit board mounted in the housing. The circuit board has a board edge blocked by a stop protrusion on the housing. The disassembling tool has a rod section, and first and second protrusions projecting radially from the rod section and spaced apart from each other with one on top of the other. The first protrusion of the disassembling tool is used to push the stop protrusion of the housing away from the board edge of the circuit board to free the circuit board from being blocked by the stop protrusion, whereas the second protrusion of the disassembling tool is used to support the circuit board for removing the circuit board from the housing.

Abstract: In a disassembling tool and method for disassembling a circuit board from a housing, and in an assembly of a circuit board, a housing and the disassembling tool, the disassembling tool is used to remove the circuit board mounted in the housing. The circuit board has a board edge blocked by a stop protrusion on the housing. The disassembling tool has a rod section, and first and second protrusions projecting radially from the rod section and spaced apart from each other with one on top of the other. The first protrusion of the disassembling tool is used to push the stop protrusion of the housing away from the board edge of the circuit board to free the circuit board from being blocked by the stop protrusion, whereas the second protrusion of the disassembling tool is used to support the circuit board for removing the circuit board from the housing.