Abstract: A portable electronic device and a movable lens-shutting module thereof are provided. The lens-shutting module includes a first magnetic assembly, a second magnetic assembly and a movable shielding assembly. The first magnetic assembly includes a fixed magnetic field generator and a movable magnetic structure including a matching portion. The second magnetic assembly includes a fixed magnetic structure, a flexible structure and a movable magnetic field generator including a limiting portion. The movable shielding assembly includes a lens shielding portion corresponding to a lens module, a matching opening matching with the matching portion, and a limiting opening corresponding to the limiting portion.

Abstract: A portable electronic device and a customized image-capturing module thereof are provided. The customized image-capturing module includes a carrier substrate, an image-capturing chip, and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads, and a plurality of second conductive pads. The image-capturing chip is disposed inside a concave space of the carrier body, and the image-capturing chip includes a plurality of conductive chip pads. The second conductive pads are exposed from a bottom side of the carrier body, the conductive chip pads are electrically connected to the second conductive pads through the first conductive pads, respectively, so that when the customized image-capturing module is partially disposed inside a receiving space and positioned between two electronic elements, the second conductive pads can be electrically connected to conductive substrate pads of a circuit substrate through soldering materials, respectively.

Abstract: A portable electronic device and an image-capturing module thereof are provided. The image-capturing module includes a circuit substrate, an image sensing chip, a rigidity reinforcing structure, and a lens assembly. The circuit substrate has a plurality of conductive substrate contacts. The image sensing chip is disposed on the circuit substrate and electrically connected to the circuit substrate. The image sensing chip includes an image sensing region, and a plurality of conductive chip contacts respectively and electrically connected to the conductive substrate contacts. The rigidity reinforcing structure is disposed on the circuit substrate. The lens assembly includes a lens holder and a lens structure disposed on the lens holder, and the lens structure corresponds to the image sensing region. A perpendicular projection of each of the conductive substrate contacts and a perpendicular projection of each of the conductive chip contacts can be shown on the rigidity reinforcing structure.

Abstract: A portable electronic device and a movable lens-shutting module thereof are provided. The lens-shutting module includes a first magnetic assembly, a second magnetic assembly and a movable shielding assembly. The first magnetic assembly includes a fixed magnetic field generator and a movable magnetic structure including a matching portion. The second magnetic assembly includes a fixed magnetic structure, a flexible structure and a movable magnetic field generator including a limiting portion. The movable shielding assembly includes a lens shielding portion corresponding to a lens module, a matching opening matching with the matching portion, and a limiting opening corresponding to the limiting portion.

Abstract: A portable electronic device and a customized image-capturing module thereof are provided. The customized image-capturing module includes a carrier substrate, an image-capturing chip, and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads, and a plurality of second conductive pads. The image-capturing chip is disposed inside a concave space of the carrier body, and the image-capturing chip includes a plurality of conductive chip pads. The second conductive pads are exposed from a bottom side of the carrier body, the conductive chip pads are electrically connected to the second conductive pads through the first conductive pads, respectively, so that when the customized image-capturing module is partially disposed inside a receiving space and positioned between two electronic elements, the second conductive pads can be electrically connected to conductive substrate pads of a circuit substrate through soldering materials, respectively.

Abstract: A heat dissipation module including a fins-assembly and a fixing frame is provided. The fins-assembly has at least an air outlet. The fixing frame has at least three fixing posts. The fins-assembly is disposed between the fixing posts. In addition, the heat dissipation module is obliquely disposed on a heat source of an electronic device.

Abstract: A connecting structure for connecting a pipe-shaped element including a base and at least a lock element is provided. The base includes a first clamper, a second clamper and a spacer. The first clamper and the second clamper are connected together on one side while a gap is maintained between the first clamper and the second clamper on the other side to form a groove that connects with the spacer. One end of the pipe-shaped element is disposed inside the spacer. The first clamper has at least a lock hole and the second clamper has at least a corresponding second lock hole. The pipe-shaped element disposed inside the spacer is tightly assembled to the base by the lock element through the first lock hole and the second lock hole. Furthermore, a connecting method for connecting the pipe-shaped element is also provided.