Abstract: A pipe coupling includes a coupling body comprising a first coupling segment and a second coupling segment, each of the first and second coupling segments defining a first end and a second end opposite the first end; a fastener mounted to the coupling body and configured to tighten the pipe coupling from an untightened configuration to a tightened configuration; and an installation indicator arranged between the first end of the first coupling segment and the first end of the second coupling segment, wherein the installation indicator is clamped between the first and second coupling segments in the tightened configuration.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer being ring-shaped and disposed on an inner surface of the light-permeable layer, and a package body that is formed on the substrate. A projection region defined by orthogonally projecting the shielding layer onto a top surface of the sensor chip surrounds a sensing region of the sensor chip. A portion of the shielding layer in contact with the light-curing layer defines a ring-shaped arrangement region that has at last one light-permeable slot. The sensor chip, the light-curing layer, the light-permeable layer, and the shielding layer are embedded in the package body that exposes at least part of the light-permeable layer.

Abstract: An airflow generating package includes a base, a covering structure and a film structure. The film structure is disposed between the base and the covering structure, and includes a flap pair including a first flap and a second flap. The flap pair operates at an ultrasonic rate so that the airflow generating package produces an airflow. A first air opening is formed on the covering structure.

Abstract: An electronic device includes an operational component, a heat conductive component and an airflow generating package. The operational component produces a heat while operating. The heat conductive component is configured to conduct the heat generated by the operational component, wherein the operational component is disposed on the heat conductive component. The airflow generating package is disposed by an edge of the electronic device. The airflow generating package includes a film structure, the film structure includes a flap pair, and the flap pair includes a first flap and a second flap. The flap pair operates at an ultrasonic rate to produce an airflow. The heat conductive component extends toward the airflow generating package, such that the airflow generated by the airflow generating package flows through the heat conductive component, so as to dissipate the heat generated from the operational component through the heat conductive component.

Abstract: A driving head-changeable tool is provided, including: a main body, including a chamber and an assembling end, the chamber including concave portions and convex portions alternatively arranged circumferentially, the chamber further including at least one receiving hole each receiving a blocking member; an outer sleeve, disposed around the main body, including a recess and a projection protrusive, the outer sleeve being slidable relative to the main body; wherein when the outer sleeve is located in a first position, the projection urges the blocking member to project within the chamber to retain the polygonal ball joint in the chamber; when the outer sleeve is located in a second position, the blocking member is retractable in the recess to be not protrusive within the chamber so that the polygonal ball joint is disengageable from the chamber.

Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.

Abstract: A driving circuit includes a driving transistor, first to second capacitors and first to third switching transistors. The driving transistor is configured to control a driving current provided to a light emitting element to emit light. The first capacitor includes a first terminal coupled to a gate terminal of the driving transistor. The first switching transistor coupled between a second terminal of the first capacitor and a driving voltage terminal. The second switching transistor includes a first terminal coupled to a gate terminal of the first switching transistor and a second terminal coupled to a first reference voltage terminal. The third switching transistor coupled between a gate terminal of the second switching transistor and a second reference voltage terminal. The second capacitor includes a first terminal coupled to a gate terminal of the third switching transistor and a second configured to receive a sweep signal.

Abstract: A brace clamp includes a first jaw; a second jaw pivotably coupled to the first jaw, wherein a clamp channel is defined between the first jaw and the second jaw, the clamp channel configured to receive a sway brace pipe therethrough; and a clamp fastener coupled to the first jaw; w the brace clamp is configurable in a disengaged configuration and an engaged configuration; and wherein, in the disengaged configuration, the first jaw is pivoted away from the second jaw and the clamp fastener is disengaged from the second jaw, and in the engaged configuration, the first jaw is pivoted towards the second jaw and the clamp fastener is engaged with the second jaw.

Abstract: The present application provides a mold for making a waveguide lens and a waveguide lens, relating to the technical field of electronic products. The mold for making a waveguide lens comprises: a first mold comprising a first slot defined on one side, the first slot being configured to accommodate an optical waveguide assembly with optical assist function; a second mold configured for molding with the first mold, the second mold comprising a second slot defined on a side of the second mold facing the first mold, wherein the second mold is close to a first surface of the optical waveguide assembly, and the second slot is configured for molding a first lens on the first surface. The present application can reduce the thickness of the waveguide lens while reducing the process of preparing the waveguide lens.

Abstract: A method of facilitating content selection includes generating benchmark queries for a particular category. Generating the benchmark queries includes applying a text prompt as input to a language model trained on a knowledge base. The text prompt requests search queries indicative of user interest in the particular category. The method also includes selecting, responsive to new search queries entered by users, content items associated with the particular category for delivery to client devices of the users. Selecting the content items includes determining whether the new search queries correspond to the particular category at least in part by comparing the new search queries to a query set that includes the benchmark queries.

Abstract: The embodiments of the disclosure provide a method for dynamically controlling shooting parameters of a camera and a tracking device. The method includes: determining a plurality of time frames, wherein the time frames include a plurality of first time frames and a plurality of second time frames; controlling the camera of the tracking device to shoot a first image with a first exposure parameter in each of the first time frames and accordingly performing an environment detection; controlling the camera of the tracking device to shoot a second image with a second exposure parameter in each of the second time frames and accordingly performing a first specific detection, wherein the second exposure parameter is lower than the first exposure parameter.

Abstract: A semiconductor device includes a substrate, an upper layer disposed over the substrate and comprises an upper electrical pattern and an alignment mark pattern electrically insulated from the upper electrical pattern, and a lower layer disposed between the substrate and the upper layer and including a lower electrical pattern and a dummy pattern electrically insulated from the lower electrical pattern, wherein the alignment mark pattern overlaps the dummy pattern from a top view, the alignment mark pattern has an optical contrast in relation to the dummy pattern, and the optical contrast is substantially equal to or greater than 50.

Abstract: A cantilever structure includes an anchor portion and a film structure. The film structure covers over a cavity and vibrates within the cavity. A length of the film structure is less than a width of the film structure. The anchor portion includes at least one protrusion protruding toward the cavity, and the film structure is anchored on the anchor portion with the at least one protrusion.

Abstract: A substrate for a semiconductor package includes an array of bonding pads on a first surface of the substrate, and a plurality of raised structures adjacent to at least some of the bonding pads on the first surface of the substrate. The raised structures may be configured to control the height of solder balls contacting the array of bonding pads when the package substrate is mounted onto a support substrate. The raised structures may compensate for a deformation of the package substrate so that the co-planarity of the solder balls may be improved, thereby providing an improved solder connection between the package substrate and the support substrate.

Abstract: A method of operating a memory device is provided. A clock signal is received. Each clock cycle of the clock signal initiates a write operation or a read operation in a memory device. A power nap period is then determined. The power nap period is compared with a clock cycle period to determine that the power nap period is less than the clock cycle period of the clock signal. A header control signal is generated in response to determining that the power nap period is less than the clock cycle period. The header control signal turns off a header of a component of the memory device.

Abstract: Embodiments provide metal features which dissipate heat generated from a laser drilling process for exposing dummy pads through a dielectric layer. Because the dummy pads are coupled to the metal features, the metal features act as a heat dissipation feature to pull heat from the dummy pad. As a result, reduction in heat is achieved at the dummy pad during the laser drilling process.

Abstract: The disclosure provides an electronic device including a housing, a light-emitting element and a light diffusion structure. The housing includes a first light-transmitting hole and a second light-transmitting hole. The light-emitting element is disposed in the housing, and is aligned with the first light-transmitting hole. The light diffusion structure includes a first light diffusion layer and a second light diffusion layer. The first light diffusion layer is disposed between the housing and the light-emitting element, and comprises a first semi-transparent region and a first light-shielding region. The first semi-transparent region corresponds to the first light-transmitting hole, and the first light-shielding region surrounds the first semi-transparent region. The second light diffusion layer is disposed between the housing and the light-emitting element, and comprises a second semi-transparent region and a second light-shielding region.

Abstract: A polymer and a coating material are provided. The polymer is formed by polymerizing a plurality of monomers. The monomers include a first monomer, a second monomer, and a third monomer. The first monomer is itaconic acid. The second monomer is C1-4 alkyl methacrylate, styrene, isobornyl acrylate, di(C2-4 alkyl) itaconate, or a combination thereof. The third monomer is 2-octylacrylate, C9-12 alkyl acrylate, or a combination thereof. The coating material includes the polymer.

Abstract: A virtual image display system and a control method thereof are provided. The virtual image display system includes a virtual image display device and an accessory. The accessory is disposed on a hand of a user and coupled to the virtual image display device. The virtual image display device is configured to: perform a gesture tracking action of the hand of the user according to positional information of the accessory; create a virtual pen and a virtual desktop according to gesture tracking information; decide whether to generate a virtual handwriting by determining a positional relationship between a pen tip of the virtual pen and the virtual desktop.

Abstract: A restraint verification platform may obtain video data video data of a passenger in a passenger seat. The restraint verification platform may analyze the video data using one or more machine learning models trained to detect passengers in passenger seats and passenger restraints of the passenger seats. The restraint verification platform may detect, using the one or more machine learning models and based on analyzing the video data, the passenger in the passenger seat and a passenger restraint of the passenger seat. The restraint verification platform may determine, based on analyzing the video data, that the passenger restraint is not properly securing the passenger. The restraint verification platform may perform an action based on determining that the passenger restraint is not properly securing the passenger.