Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: Methods of forming line-end extensions and devices having line-end extensions are provided. In some embodiments, a method includes forming a patterned photoresist on a first region of a hard mask layer. A line-end extension region is formed in the hard mask layer. The line-end extension region extends laterally outward from an end of the first region of the hard mask layer. The line-end extension region may be formed by changing a physical property of the hard mask layer at the line-end extension region.

Abstract: Some implementations described herein a provide a multi-die package and methods of formation. The multi-die package includes a dynamic random access memory integrated circuit die over a system-on-chip integrated circuit die, and a heat transfer component between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, which may correspond to a dome-shaped structure, may be on a surface of the system-on-chip integrated circuit die and enveloped by an underfill material between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, in combination with the underfill material, may be a portion of a thermal circuit having one or more thermal conductivity properties to quickly spread and transfer heat within the multi-die package so that a temperature of the system-on-chip integrated circuit die satisfies a threshold.

Abstract: Integrated circuit packages and methods of forming the same are discussed. In an embodiment, a device includes: a package substrate; a semiconductor device attached to the package substrate; an underfill between the semiconductor device and the package substrate; and a package stiffener attached to the package substrate, the package stiffener includes: a main body extending around the semiconductor device and the underfill in a top-down view, the main body having a first coefficient of thermal expansion; and pillars in the main body, each of the pillars extending from a top surface of the main body to a bottom surface of the main body, each of the pillars physically contacting the main body, the pillars having a second coefficient of thermal expansion, the second coefficient of thermal expansion being less than the first coefficient of thermal expansion.

Abstract: A semiconductor device includes a first fin field effect transistor (FinFET) device, the first FinFET device including a plurality of fins formed in a substrate, an epitaxial layer of semiconductor material formed on the fins forming non-planar source/drain regions, and a first gate structure traversing across the plurality of fins. The semiconductor device includes a second FinFET device, the second FinFET device including a substantially planar fin formed in the substrate, an epitaxial layer of the semiconductor material formed on the substantially planar fin and forming substantially planar source/drain regions, and a second gate structure traversing across the substantially planar fin.

Abstract: A semiconductor device includes a first fin field effect transistor (FinFET) device, the first FinFET device including a plurality of fins formed in a substrate, an epitaxial layer of semiconductor material formed on the fins forming non-planar source/drain regions, and a first gate structure traversing across the plurality of fins. The semiconductor device includes a second FinFET device, the second FinFET device including a substantially planar fin formed in the substrate, an epitaxial layer of the semiconductor material formed on the substantially planar fin and forming substantially planar source/drain regions, and a second gate structure traversing across the substantially planar fin.

Abstract: A holder assembly for holding a displaying device is disclosed. The holder assembly includes a body, a first arm, a second arm and a base. The body includes an outer surface and an inner surface. An accommodating space is formed by the inner surface. A first opening is formed on the body and connected to the accommodating space. A first connecting portion and a first pivoting portion are disposed on two ends of the first arm. A second connecting portion and a second pivoting portion are disposed on two ends of the second arm. The first and second connecting portions are connected to the displaying device. The first and second pivoting portions are pivotally disposed on the outer surface. The base includes a sliding portion and a plurality of supporters. The sliding portion is slidably connected to the inner surface. The supporters are pivotally disposed on the sliding portion.

Abstract: A holder assembly for holding a displaying device is disclosed. The holder assembly includes a body, a first arm, a second arm and a base. The body includes an outer surface and an inner surface. An accommodating space is formed by the inner surface. A first opening is formed on the body and connected to the accommodating space. A first connecting portion and a first pivoting portion are disposed on two ends of the first arm. A second connecting portion and a second pivoting portion are disposed on two ends of the second arm. The first and second connecting portions are connected to the displaying device. The first and second pivoting portions are pivotally disposed on the outer surface. The base includes a sliding portion and a plurality of supporters. The sliding portion is slidably connected to the inner surface. The supporters are pivotally disposed on the sliding portion.

Abstract: A cover device is adapted for use with a casing which has an open top end, and a confining wall which confines an interior that is divided into a plurality of cell compartments by partition plates. The cover device includes a lower cover body with a top wall and a surrounding wall which confines a cavity that is divided into a plurality of chambers by means of dividers. Each of the dividers has a bottom edge that is adapted to be mounted sealingly on a top edge of a respective one of the partition plates to prevent fluid communication among the cell compartments below the top wall. The top wall has a vent area that is formed with a plurality of vent holes for communicating an upper side of the top wall with the chambers, respectively, and a plurality of upwardly projecting annular lips around the vent holes, respectively. Each of the annular lips is formed with a notch unit, and has a pressure cap sleeved movably thereon for covering the respective vent hole.