Patents by Inventor Chien-Cheng Chuang

Chien-Cheng Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210057517
    Abstract: The present disclosure relates to an apparatus that includes a bottom electrode and a dielectric structure. The dielectric structure includes a first dielectric layer on the bottom electrode and the first dielectric layer has a first thickness. The apparatus also includes a blocking layer on the first dielectric layer and a second dielectric layer on the blocking layer. The second dielectric layer has a second thickness that is less than the first thickness. The apparatus further includes a top electrode over the dielectric structure.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Ting CHEN, Tsung-Han Tsai, Kun-Tsang Chuang, Po-Jen Wang, Ying-Hao Chen, Chien-Cheng Chuang