Abstract: A pivoting mechanism for a spring hinge includes a pin and at least one cap assembly. The pin defines an axial direction and is configured to be disposed through a barrel portion of the spring hinge. The at least one cap assembly is disposed on an end of the pin and includes a cap body, a restricting member and an engaging member. The cap body includes a first abutting wall lateral to the axial direction, a first circumferential wall extending around the axial direction and connected with the first abutting wall and a groove recessed on an inner surface of the first circumferential wall. The restricting member is embedded within the groove and radially protrudes beyond the inner surface. The engaging member surrounds the pin and is disposed between the restricting member and the first abutting wall.

Abstract: A pivoting mechanism for a spring hinge includes a pin and at least one cap assembly. The pin defines an axial direction and is configured to be disposed through a barrel portion of the spring hinge. The at least one cap assembly is disposed on an end of the pin and includes a cap body, a restricting member and an engaging member. The cap body includes a first abutting wall lateral to the axial direction, a first circumferential wall extending around the axial direction and connected with the first abutting wall and a groove recessed on an inner surface of the first circumferential wall. The restricting member is embedded within the groove and radially protrudes beyond the inner surface. The engaging member surrounds the pin and is disposed between the restricting member and the first abutting wall.

Abstract: A vehicle water-cooling heat sink plate having fin sets with different fin pitch distances is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

Abstract: A liquid-cooling heat dissipation structure having a nonlinear fin array and a method for manufacturing the same are provided. The liquid-cooling heat dissipation structure includes an upper plate, a lower plate, and a flow guide member. The upper plate has an accommodating groove of which an inner side has an upper joint area formed thereon. The lower plate has a lower joint area. The flow guide member disposed between the upper plate and the lower plate includes a heat dissipation plate body having a first surface and a second surface, and a plurality of heat dissipation columns integrally disposed on the second surface. The upper brazing area is connected to the lower brazing area, and two ends of the flow guide member are respectively connected to the upper joint area and the lower joint area to form an enclosed cavity for accommodating the heat dissipation columns.

Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.

Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.

Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.

Abstract: A vehicle water-cooling heat sink plate having fin sets with different surface areas is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

Abstract: A vehicle water-cooling heat sink plate having fin sets with different fin pitch distances is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

Abstract: Disclosed are a chip power consumption analyzer and an analyzation method thereof. The analyzation method includes the following. Design information of a circuit is received. A plurality of clock arriving times of a plurality of circuit cells in the circuit are calculated based on the design information, and a base cell type is set among a plurality of cell types according to the clock arriving times. Base demand current information of the base cell type is established, and a plurality of demand current information of the circuit cells is obtained. A plurality of demand peak currents of a plurality of bump current sources are predicted according to the demand current information and a plurality of position information of the circuit cells.

Abstract: A grouping method based on machine type communication (MTC), used in a communications system, including: broadcasting, by a base station, grouping requests to a plurality of user equipments (UEs) in an area; determining, by the base station, whether there is at least one group leader among the UEs; and receiving, by the base station, a grouping report from the group leader when determining that there is a group leader among the UEs, wherein the grouping report records UE identifiers of the UEs in a group corresponding to the group leader.

Abstract: A Machine Type Communication (MTC) device including a wireless transceiver and a controller is provided. The wireless transceiver performs wireless transmission and reception to and from a service network. The controller receives a paging message including a timer update flag from the service network via the wireless transceiver, transmits a Service Request message to the service network via the wireless transceiver in response to the paging message including the timer update flag, and receives a downlink (DL) Information Transfer message including a value for a periodic update timer from the service network via the wireless transceiver.

Abstract: An apparatus includes a body and a surface for receiving a semiconductor wafer carrier is provided. A nozzle and a venting hole are provided on the surface. The semiconductor wafer carrier has at least one selectively closable capped opening at a bottom, top and/or side surface thereof. The capped opening is configured to couple to, and be accessible by, the nozzle and receive gas output from the nozzle so as to create a substantially oxygen free environment within the semiconductor wafer carrier. The vent hole is configured to allow gas to flow out of the semiconductor wafer carrier. In addition, the apparatus includes a sensor and a controller. The sensor is configured to monitor an ambient condition in the semiconductor wafer carrier, and the controller is configured to adjust a control valve based on the ambient condition so as to control the gas flow or output from the nozzle.

Abstract: Scan flip-flop and associated method are provided. The scan flip-flop includes a data input terminal, a scan input terminal, a flip-flop circuit, a first transistor and a plurality of second transistors. A gate of the first transistor is coupled to the scan input terminal, gates of the second transistors are commonly coupled to an enabling signal, drains and sources of the first transistor and the second transistors are serially coupled to the flip-flop circuit, so as to increase a delay between the scan input terminal and the flip-flop circuit.

Abstract: A grouping method based on machine type communication (MTC), used in a communications system, including: broadcasting, by a base station, grouping requests to a plurality of user equipments (UEs) in an area; determining, by the base station, whether there is at least one group leader among the UEs; and receiving, by the base station, a grouping report from the group leader when determining that there is a group leader among the UEs, wherein the grouping report records UE identifiers of the UEs in a group corresponding to the group leader.

Abstract: A Machine Type Communication (MTC) device including a wireless transceiver and a controller is provided. The wireless transceiver performs wireless transmission and reception to and from a service network. The controller receives a paging message including a timer update flag from the service network via the wireless transceiver, transmits a Service Request message to the service network via the wireless transceiver in response to the paging message including the timer update flag, and receives a downlink (DL) Information Transfer message including a value for a periodic update timer from the service network via the wireless transceiver.

Abstract: Scan flip-flop and associated method are provided. The scan flip-flop includes a data input terminal, a scan input terminal, a flip-flop circuit, a first transistor and a plurality of second transistors. A gate of the first transistor is coupled to the scan input terminal, gates of the second transistors are commonly coupled to an enabling signal, drains and sources of the first transistor and the second transistors are serially coupled to the flip-flop circuit, so as to increase a delay between the scan input terminal and the flip-flop circuit.

Abstract: Scan flip-flop and associated method are provided. The scan flip-flop includes a data input terminal, a scan input terminal, a flip-flop circuit, a first transistor and a plurality of second transistors. A gate of the first transistor is coupled to the scan input terminal, gates of the second transistors are commonly coupled to an enabling signal, drains and sources of the first transistor and the second transistors are serially coupled to the flip-flop circuit, so as to increase a delay between the scan input terminal and the flip-flop circuit.

Abstract: An apparatus includes a body and a surface for receiving a semiconductor wafer carrier is provided. A nozzle and a venting hole are provided on the surface. The semiconductor wafer carrier has at least one selectively closable capped opening at a bottom, top and/or side surface thereof. The capped opening is configured to couple to, and be accessible by, the nozzle and receive gas output from the nozzle so as to create a substantially oxygen free environment within the semiconductor wafer carrier. The vent hole is configured to allow gas to flow out of the semiconductor wafer carrier. In addition, the apparatus includes a sensor and a controller. The sensor is configured to monitor an ambient condition in the semiconductor wafer carrier, and the controller is configured to adjust a control valve based on the ambient condition so as to control the gas flow or output from the nozzle.

Abstract: Scan flip-flop and associated method are provided. The scan flip-flop includes a data input terminal, a scan input terminal, a flip-flop circuit, a first transistor and a plurality of second transistors. A gate of the first transistor is coupled to the scan input terminal, gates of the second transistors are commonly coupled to an enabling signal, drains and sources of the first transistor and the second transistors are serially coupled to the flip-flop circuit, so as to increase a delay between the scan input terminal and the flip-flop circuit.