Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: A matte film for hot pressing and a manufacturing method thereof are provided. The manufacturing method includes steps of forming at least one polyester composition into an unstretched polyester thick film and stretching the unstretched polyester thick film in a machine direction (MD) and a transverse direction (TD). The polyester composition includes 81% to 97.9497% by weight of a polyester resin, 0.02% to 2% by weight of an antioxidative ingredient, 0.0003% to 1% by weight of a nucleating agent, 0.01% to 2% by weight of a flow aid, 0.01% to 2% by weight of a polyester modifier, 0.01% to 2% by weight of an inorganic filler, and 2% to 10% by weight of silica particles. The polyester resin has an intrinsic viscosity between 0.60 dl/g and 0.80 dl/g.

Abstract: A water-repellent earphone is formed of a main body and a water-repellent breathable member. The main body includes a receiving space for accommodating a speaker. The speaker partitions the receiving space to make a rear chamber. The main body includes a drainage tunnel communication with a first opening and a second opening, both of which are located on an external surface of the main body. The main body further includes a venthole communicating with the drainage tunnel and the rear chamber. The water-repellent breathable member is formed and located at the venthole. In light of the structure mentioned above, the drainage tunnel can help the earphone quickly expel the moisture to prevent the moisture from damage to the speaker and to boost the frequency response and acoustic performance within the low-frequency range.

Abstract: A water-repellent earphone is formed of a main body and a water-repellent breathable member. The main body includes a receiving space for accommodating a speaker. The speaker partitions the receiving space to make a rear chamber. The main body includes a drainage tunnel communication with a first opening and a second opening, both of which are located on an external surface of the main body. The main body further includes a venthole communicating with the drainage tunnel and the rear chamber. The water-repellent breathable member is formed and located at the venthole. In light of the structure mentioned above, the drainage tunnel can help the earphone quickly expel the moisture to prevent the moisture from damage to the speaker and to boost the frequency response and acoustic performance within the low-frequency range.

Abstract: A tuning fork quartz crystal resonator includes a base, a first resonating arm, and a second resonating arm. The base has a generally planar fifth main surface and a generally planar sixth main surface opposite to each other, and has a fifth side surface and a sixth side surface opposite to each other. The first resonating arm is connecting to one side of the base. The second resonating arm is connecting to the same side of the base. A concave of continuous curved surface is formed one each on the fifth side surface and the sixth side surface of the base respectively.

Abstract: A tuning fork quartz crystal resonator includes a base, a first resonating arm, and a second resonating arm. The base has a generally planar fifth main surface and a generally planar sixth main surface opposite to each other, and has a fifth side surface and a sixth side surface opposite to each other. The first resonating arm is connecting to one side of the base. The second resonating arm is connecting to the same side of the base. A recess is formed on the fifth main surface, and the recess is sized and configured such that a first width near the first resonating arm and the second resonating arm is greater than a second width away from the first resonating arm and the second resonating arm.

Abstract: A tuning fork quartz crystal resonator has a base and two resonating arms extended in parallel from the same side of the base. Each resonating arm has asymmetric grooves on its upper and bottom surface, and the via-hole to reliably connect the top and bottom electrode. The asymmetric groove design can simplify the manufacturing process and lower the manufacturing cost. The base has continuous concave on both side surfaces and a recess on the main surface. The energy of ultrasonic wave propagating via the base mounting pads into the ceramic package can be reduced. This unique tuning fork quartz crystal resonator can prevent dramatic reduction of the Q value, and retain the outstanding quality of the resonator.

Abstract: A headphone includes a hanger and two speaker units respectively disposed at the two ends of the hanger. Each speaker unit includes a first shell; a second shell engaged with the first shell, a first air passage being formed between the first shell and the second shell, a second air passage being formed on the second shell, the second air passage having an opening direction different from an opening direction of the first air passage; a cover engaged with the second shell and having a plurality of holes on the cover; and a speaker disposed between the first shell and the second shell. When the speaker outputs sound, airflows generated by the speaker are exhausted through the first air passage, the second air passage and the holes so that the amount of air exhaust is stable and the output audio is of high quality.

Abstract: An in-ear earphone with a capacitive sensing function is provided. The earphone includes a case, a speaker, a circuit board, and a capacitive sensing unit. The case has an extension tube and an accommodating portion. An ear tip is sleeved on the extension tube. The accommodating portion accommodates the speaker, the circuit board, and the capacitive sensing unit. A sound emitting surface of the speaker faces the extension tube. The circuit board is electrically connected to the speaker, and a sensing chip is disposed on the circuit board. The capacitive sensing unit includes a sensor and a conducting element. The sensor is electrically connected to the sensing chip through the conducting element. When the extension tube is inserted into an ear canal of a user, the sensor returns a sensing signal to the sensing chip, and the sensing chip sends a control signal to control sound output of the speaker.

Abstract: A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

Abstract: A fabricating method for an earphone includes the steps of: providing a front case and a speaker, the front case having a plurality of securing holes and a accommodating space, the speaker being disposed in the accommodating space; electrically connecting an earphone wire to the speaker; providing a rear case and securing the rear case onto the front case by making use of a plurality of fasteners penetrating through the rear case and fitted into the securing holes of the front case, and thereby the speaker is fixed in the accommodating space by the stop effect of the rear case; and buckling a protecting cover on the rear case to cover the fasteners. The fabricating method can make the produced earphone to be more reliable and thus can effectively avoid from being disassembled caused by an external force or unexpected falling, and therefore the internal components thereof can be effectively protected from damage.

Abstract: A tuning fork quartz crystal resonator has a base and two resonating arms extended in parallel from the same side of the base. Each resonating arm has asymmetric grooves on its upper and bottom surface, and the via-hole to reliably connect the top and bottom electrode. The asymmetric groove design can simplify the manufacturing process and lower the manufacturing cost. The base has continuous concave on both side surfaces and a recess on the main surface. The energy of ultrasonic wave propagating via the base mounting pads into the ceramic package can be reduced. This unique tuning fork quartz crystal resonator can prevent dramatic reduction of the Q value, and retain the outstanding quality of the resonator.

Abstract: The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate respectively, where a plurality of bonding pads is formed on the structure regions in the structure region pattern and is used for being electrically connected to the first metal layer. A plurality of LED dies is arranged on the structure regions in an array, and the LED dies are bonded with the corresponding bonding pads, such that the LED dies are conducted with current via the circuit layout of the first metal layer on the flexible substrate, so as to form a planar light source.

Abstract: A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

Abstract: A fabricating method for an earphone includes the steps of: providing a front case and a speaker, the front case having a plurality of securing holes and a accommodating space, the speaker being disposed in the accommodating space; electrically connecting an earphone wire to the speaker; providing a rear case and securing the rear case onto the front case by making use of a plurality of fasteners penetrating through the rear case and fitted into the securing holes of the front case, and thereby the speaker is fixed in the accommodating space by the stop effect of the rear case; and buckling a protecting cover on the rear case to cover the fasteners. The fabricating method can make the produced earphone to be more reliable and thus can effectively avoid from being disassembled caused by an external force or unexpected falling, and therefore the internal components thereof can be effectively protected from damage.

Abstract: The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate respectively, where a plurality of bonding pads is formed on the structure regions in the structure region pattern and is used for being electrically connected to the first metal layer. A plurality of LED dies is arranged on the structure regions in an array, and the LED dies are bonded with the corresponding bonding pads, such that the LED dies are conducted with current via the circuit layout of the first metal layer on the flexible substrate, so as to form a planar light source.

Abstract: A bendable LED planar light source structure, a flexible substrate therefore, and a manufacturing method thereof are provided. The flexible substrate has metal layers on both sides, where the metal layer on one side has a circuit layout, and the metal layer on the other side has a pattern structure or a whole metal coating with reflecting and scattering characteristics. Meanwhile, bonding pads are provided on the same side or opposite side as the metal layer with the circuit layout, and an array of LED dies is bonded with the bonding pads through wire bonding or flip chip bonding, such that the LED dies are conducted with current through the circuit layout on the flexible substrate, so as to form a planar light source.

Abstract: A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

Abstract: A headphone includes a hanger and two speaker units respectively disposed at the two ends of the hanger. Each speaker unit includes a first shell; a second shell engaged with the first shell, a first air passage being formed between the first shell and the second shell, a second air passage being formed on the second shell, the second air passage having an opening direction different from an opening direction of the first air passage; a cover engaged with the second shell and having a plurality of holes on the cover; and a speaker disposed between the first shell and the second shell. When the speaker outputs sound, airflows generated by the speaker are exhausted through the first air passage, the second air passage and the holes so that the amount of air exhaust is stable and the output audio is of high quality.

Abstract: A resonant DC/AC inverter includes a DC power source providing a DC voltage, a half-bridge power switch circuit electrically connected to the DC power source being operative to convert the DC voltage to an AC voltage, a resonant tank electrically connected between an output of the half-bridge power switch circuit and an input of a load being operative to boost and filter the AC voltage to generate an AC power voltage supplied to the load, and a controller being operative to detect a magnitude of current in the load and a magnitude of a voltage across the load and to generate pulse waveforms for turning on and off the half-bridge power switch circuit, wherein the controller substantially instantaneously varies a frequency of the pulse waveforms and a duty cycle of the pulse waveforms so as to operate the resonant DC/AC inverter near a neighborhood of a resonant frequency of the resonant tank regardless of a conduction state of the load and improve the efficiency of the inverter regardless of the higher DC volt