Abstract: An optical measurement apparatus is provided with a light source and guiding module and a receiving module in the present invention. The light source and guiding module, composed of a light source module and a light-guiding apparatus, is used to provide a low-cost area light source and to transfer the area light source to become a linear incident light through the light-guiding apparatus. And the receiving module, composed of a linear or area CCD sensor, is used to provide the linear or area detection for an array-type sample with the help of the light source and guiding apparatus. The present invention will simplify the complexity of the optical mechanism of two-dimension moving and single-point-scanning mode of the conventional optical measurement apparatus.

Abstract: The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.

Abstract: An IC dice mounted on a substrate carrier wherein the IC dice is connected by a plurality of bonding wires to a plurality of corresponding bonding pads on the substrate carrier. The wire bonding layout configuration of the electronic device is improved in the present invention by providing centralized consolidated common voltage pads or bars such that the electric wires connecting the bonding pads to external interface contact points, e.g., the ball grid array (BGA) may be shortened. Additionally, the access widow for wire bonding to the IC dice may be broadened.