Patents by Inventor Chien-Chiao CHEN

Chien-Chiao CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe card and signal path switching module assembly
    Patent number: 10753960
    Abstract: A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: August 25, 2020
    Assignee: MPI CORPORATION
    Inventors: Hao Wei, Chia-Nan Chou, Chien-Chiao Chen, Chia-An Yu, Yu-Hao Chen
  • PROBE CARD AND SIGNAL PATH SWITCHING MODULE ASSEMBLY
    Publication number: 20190120877
    Abstract: A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.
    Type: Application
    Filed: October 11, 2018
    Publication date: April 25, 2019
    Inventors: Hao WEI, Chia-Nan CHOU, Chien-Chiao CHEN, Chia-An YU, Yu-Hao CHEN