Patents by Inventor Chien-Chien Tsai

Chien-Chien Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060172526
    Abstract: A method for improving edge peeling defect is disclosed in this invention. According to this invention, a wafer can be kept from the edge peeling defect of the prior art by introducing a step for removing the weakly adhesive films and the metal structures at the wafer edge after forming a metal interconnect layer on the wafer. Thus, this invention can raise the yield of semiconductor manufacturing, and reduce the pollution chance of the chamber of the semiconductor manufacture.
    Type: Application
    Filed: January 13, 2006
    Publication date: August 3, 2006
    Inventors: Chia-Lin Hsu, Shu-Hsien Lee, Chien-Chien Tsai, Hsiao-Ling Lu
  • Publication number: 20050085163
    Abstract: A method for improving edge peeling defect is disclosed in this invention. According to this invention, a wafer can be kept from the edge peeling defect of the prior art by introducing a step for removing the weakly adhesive films and the metal structures at the wafer edge after forming a metal interconnect layer on the wafer. Thus, this invention can raise the yield of semiconductor manufacturing, and reduce the pollution chance of the chamber of the semiconductor manufacture.
    Type: Application
    Filed: October 16, 2003
    Publication date: April 21, 2005
    Inventors: Chia-Lin Hsu, Shu-Hsien Lee, Chien-Chien Tsai, Hsiao-Ling Lu