Abstract: Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first conductive structure disposed within a first layer of the semiconductor structure. The semiconductor structure includes a dielectric structure disposed within a second layer of the semiconductor structure, with the second layer being disposed on the first layer. The semiconductor structure includes a second conductive structure disposed within a recessed portion of the dielectric structure that extends to the first conductive structure, with the second conductive structure having a concave recessed portion on a top surface of the second conductive structure. The semiconductor structure includes multiple layers of conductive material disposed within the concave recessed portion of the second conductive structure.

Abstract: Provided is a peptide and method in preventing or treating infections caused by a wide spectrum of pathogens, including bacteria and fungus in hosts such as plants and animals. Methods of preventing or treating plant diseases and infection in animals are also provided.

Abstract: An electronic device includes a first body, a second body and a hinge assembly. The hinge assembly includes a bearing base, a movable base, a first hinge mechanism, a second hinge mechanism and a switching member. The bearing base is connected to the first body and has a first engaging portion. The first hinge mechanism is connected between the movable base and the second body. The second hinge mechanism is connected between the movable base and the bearing base. The first and second hinge mechanisms are connected to adjacent sides of the movable base. The switching member includes a main body slidably connected to the movable base in a switching direction, a second engaging portion engaged with or disengaged from the first engaging portion as the main body moves, and an interference portion entering or exiting the first hinge mechanism as the main body moves.

Abstract: An electronic device includes a first body, a second body and a hinge assembly. The hinge assembly includes a bearing base, a movable base, a first hinge mechanism, a second hinge mechanism and a switching member. The bearing base is connected to the first body and has a first engaging portion. The first hinge mechanism is connected between the movable base and the second body. The second hinge mechanism is connected between the movable base and the bearing base. The first and second hinge mechanisms are connected to adjacent sides of the movable base. The switching member includes a main body slidably connected to the movable base in a switching direction, a second engaging portion engaged with or disengaged from the first engaging portion as the main body moves, and an interference portion entering or exiting the first hinge mechanism as the main body moves.

Abstract: A metal housing (10) includes a base (110) and an outer layer (120). The base is made of a thin metal plate. The outer layer includes a plurality of first sections (121) and second sections (122). The material of the first sections is different from that of the second sections. The first sections and the second sections are arranged on the base in an interleaving manner.

Abstract: A metal housing (10) includes a first metal layer (11) and a second metal layer (12). The material of the first metal layer is selected from the group consisting of stainless steel, titanium and titanium alloy. The material of the second metal layer is selected from the group consisting of aluminum, aluminum alloy and magnesium alloy. The second metal layer is integrally formed with the first metal layer.

Abstract: A metal housing (10) includes a base (110) and an outer layer (120). The base is made of a thin metal plate. The outer layer includes a plurality of first sections (121) and second sections (122). The material of the first sections is different from that of the second sections. The first sections and the second sections are arranged on the base in an interleaving manner.