Abstract: A method for manufacturing chip package includes the steps below. A wafer having an upper surface and a lower surface opposite thereto is provided, in which conductive bumps are disposed on the upper surface. The upper surface of the wafer is diced to form trenches. A first insulation layer exposing the conductive bumps is formed on the upper surface and in the trenches. A surface treatment layer is formed on the conductive bumps, and a top surface of the surface treatment layer is higher than that of the first insulation layer. The wafer is thinned from the lower surface toward the upper surface to expose the first insulation layer in the trenches. A second insulation layer is formed below the lower surface. The first and second insulation layers are diced along a center of each trench to form chip packages.

Abstract: A method for manufacturing chip package is disclosed. The method includes providing a wafer having conductive bumps disposed on a first surface; forming a first adhesion layer and a first carrier board; thinning the wafer; forming a first insulating layer; forming a second adhesion layer and a second carrier board; heating the first adhesion layer to a first temperature to remove the first carrier board and the first adhesion layer; forming trenches; forming a third adhesion layer and a third carrier board; heating the second adhesion layer to a second temperature to remove the second carrier board and the second adhesion layer; forming a second insulating layer filing the trenches; heating the third adhesion layer to a third temperature to remove the third carrier board and the third adhesion layer; and dicing the first insulating layer and the second insulating layer along each trench.

Abstract: A method of manufacturing chip package is disclosed. The method includes providing a wafer having a first surface and a second surface, in which the wafer includes conductive bumps disposed on the first surface; thinning the wafer from the second surface toward the first surface; dicing the wafer to form chips, in which each chip has a third surface and a fourth surface, and at least one of the conductive bumps is disposed on the third surface; disposing the chips on a substrate, such that the conductive bumps are disposed between the substrate and the third surface, in which any two adjacent of the chips are spaced apart by a gap ranging from 50 ?m to 140 ?m; forming an insulating layer filling the gaps and covering the chips; and dicing the insulating layer along each gap to form a plurality of chip packages.

Abstract: A method for manufacturing chip package includes the steps below. A wafer having an upper surface and a lower surface opposite thereto is provided, in which conductive bumps are disposed on the upper surface. The upper surface of the wafer is diced to form trenches. A first insulation layer exposing the conductive bumps is formed on the upper surface and in the trenches. A surface treatment layer is formed on the conductive bumps, and a top surface of the surface treatment layer is higher than that of the first insulation layer. The wafer is thinned from the lower surface toward the upper surface to expose the first insulation layer in the trenches. A second insulation layer is formed below the lower surface. The first and second insulation layers are diced along a center of each trench to form chip packages.

Abstract: A method for manufacturing chip package is disclosed. The method includes providing a wafer having an upper surface and a lower surface opposite thereto, in which the wafer comprises a plurality of conductive pads disposed on the upper surface; dicing the upper surface of the wafer to form a plurality of trenches; forming a patterned photoresist layer on the upper surface and in the trenches; forming a plurality of conductive bumps disposed correspondingly on the conductive pads; thinning the wafer from the lower surface toward the upper surface, such that the patterned photoresist layer in the trenches is exposed from the lower surface; forming an insulating layer under the lower surface; and dicing the patterned photoresist layer and the insulating layer along each trench to form a plurality of chip packages.

Abstract: The present invention discloses a method of forming an optical sheet. The method comprises: providing a mold having a first surface; forming a plurality of first concave shapes on the first surface of the mold such that the first surface of the mold is changed to a second surface of the mold; forming a plurality of second shapes on the plurality of first concave shapes such that the second surface of the mold is changed to a third surface of the mold; and using the third surface of the mold to emboss a film on a substrate to form a composite structure corresponding to the combination of the plurality of first concave shapes and the plurality of second shapes.

Abstract: The present invention discloses an optical assembly used in the backlight module. The optical assembly comprises: a first optical film having a first surface; an adhesive layer having a second surface and a third surface opposite to the second surface, wherein the second surface of the adhesive layer is disposed on the first surface of the first optical film; and a diffusing sheet having a fourth surface comprising a plurality of first microstructures and a plurality of second microstructures, wherein each of the plurality of second microstructures extends along a first direction, wherein the maximum height of the plurality of second microstructures is greater than that of the plurality of first microstructures so as to bond the plurality of second microstructures to the third surface of the adhesive layer.

Abstract: The present invention discloses an optical assembly used in the backlight module. The optical assembly comprises: a first optical film having a first surface; an adhesive layer having a second surface and a third surface opposite to the second surface, wherein the second surface of the adhesive layer is disposed on the first surface of the first optical film; and a diffusing sheet having a fourth surface comprising a plurality of first microstructures and a plurality of second microstructures, wherein each of the plurality of second microstructures extends along a first direction, wherein the maximum height of the plurality of second microstructures is greater than that of the plurality of first microstructures so as to bond the plurality of second microstructures to the third surface of the adhesive layer.

Abstract: The present invention discloses a method of forming an optical sheet. The optical sheet comprises a substrate and a film. The substrate has a first surface and a second surface opposite to the first surface. The film has a third surface and a fourth surface opposite to the third surface. The third surface of the film is on the first surface of the substrate. The fourth surface of the film comprises a structure corresponding to a combination of a plurality of first convex shapes and a plurality of second convex or concave shapes superimposed on the plurality of first convex shapes.

Abstract: The present invention discloses a method of forming an optical sheet. The method comprises: providing a mold having a first surface; forming a plurality of first concave shapes on the first surface of the mold such that the first surface of the mold is changed to a second surface of the mold; forming a plurality of second shapes on the plurality of first concave shapes such that the second surface of the mold is changed to a third surface of the mold; and using the third surface of the mold to emboss a film on a substrate to form a composite structure corresponding to the combination of the plurality of first concave shapes and the plurality of second shapes.

Abstract: The present invention discloses a method of forming an optical sheet. The optical sheet comprises a substrate and a film. The substrate has a first surface and a second surface opposite to the first surface. The film has a third surface and a fourth surface opposite to the third surface. The third surface of the film is on the first surface of the substrate. The fourth surface of the film comprises a structure corresponding to a combination of a plurality of first convex shapes and a plurality of second convex or concave shapes superimposed on the plurality of first convex shapes.

Abstract: The present invention discloses a sheet winding structure to reduce indentation transfer occurring because of sheet thickness or adhesive colloidality of the innermost layer of the sheet. The sheet winding structure comprises: a winding core having an outer surface, wherein the outer surface of the winding core comprises a recess thereon; and a sheet winded over the outer surface of the winding core, wherein a beginning portion of the sheet is disposed in the recess.

Abstract: The present invention discloses a sheet winding structure to reduce indentation transfer occurring because of sheet thickness or adhesive colloidality of the innermost layer of the sheet. The sheet winding structure comprises: a winding core having an outer surface, wherein the outer surface of the winding core comprises a recess thereon; and a sheet winded over the outer surface of the winding core, wherein a beginning portion of the sheet is disposed in the recess.

Abstract: A paper container includes a body and a contact layer. The body includes a bottom wall and a side wall. The side wall includes a covering portion and a supporting portion. An end of the covering portion surrounds the bottom wall so as to form an interior space. The supporting portion is integrally connected with the end of the covering portion and extends outwardly. The contact layer surrounds the covering portion. The contact layer includes a rugged inner surface and a fiat outer surface. The rugged inner surface includes a plurality of protruding portions formed thereon, and the protruding portions are adhered to the covering portion so as to form a plurality of air channels between the covering portion and the contact layer.

Abstract: A heart rate alarm system includes an article of clothing, at least two conductive units, at least one alarm device, a heart rate measurement unit, a first transmission unit, a second transmission unit, and an operation unit. The at least two conductive units are coupled to each other through at least one conductive fibric. The heart rate measurement unit measures a heart rate through the at least two conductive units, and generates a control signal and a heart rate value according to the heart rate. The first transmission unit transmits the control signal to the at least one alarm device and transmits the heart rate value. The at least one alarm device generates at least one alarm signal according to the control signal. The operation unit calculates a heart beat period, a heart physiological age, indicators of autonomic nervous system, and/or a calorie consumption indicator.

Abstract: A blood pressure measurement system includes an article of clothing, an occluding cuff, a blood pressure measurement unit, a first transmission module, and an operation module. The clothing includes tarpaulin. The occluding cuff is disposed at an inner side of the tarpaulin. The blood pressure measurement unit is disposed at the inner side of the tarpaulin for measuring blood pressure of a user to generate a blood pressure measurement result of the user, controlling a removable inflation module to inflate the occluding cuff, controlling a deflate valve to deflate the occluding cuff, and transmitting the blood pressure measurement result. The first transmission module is used for receiving the blood pressure measurement result. The operation module is coupled to the first transmission module for calculating diastolic blood pressure, systolic blood pressure, and/or pulses of the user according to the blood pressure measurement result.

Abstract: A fabrication method for hollow integration rod suitable for high temperature operation, comprising the steps: (a) pre-fixing a set of mirrors to be a hollow integration rod by a light curable adhesive (such as UV curable adhesive); and (b) fixing those mirrors permanently by an inorganic adhesive. Wherein the mirrors can be a High Reflective Mirror with dielectric thin films, or it could be a High Reflective Mirror made of metallic thin film and coating a dielectric thin films by deposition for enhancing the reflection and protection purpose; for a all dielectric film, since there are multi-layer of thin dielectric films been deposited thereon, to prevent the warpage or distortion due to film stress in deposition process, several layers of thin film of silicon oxide SiOx can be pre-deposited on the backside of the mirror to balance.

Abstract: An optical amplifier includes an optical fiber having a core doped with transition metal ions, and at least one glass cladding enclosing the core. By using the fiber, the optical amplifier of the invention has a gain bandwidth of more than 300 nm including 1300-1600 nm band in low-loss optical communication.

Abstract: A wireless transmission apparatus including a signal output/input port and an antenna module is provided. The antenna module is used for receiving and transmitting wireless signals satisfying a transmission standard IEEE 802.11. The antenna module is electrically connected to the signal output/input port. Furthermore, the antenna module is rotated with respect to the signal output/input port. The antenna module has two degrees of freedom in rotation directions, such that it is easy to adjust the position of antenna module so that the wireless transmission apparatus has a good signal receiving quality.