Abstract: A workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.

Abstract: In an embodiment, a workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.

Abstract: A system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured to carry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that is carried in the factory interface or the deposition tool.

Abstract: In an embodiment, a workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.

Abstract: In an embodiment, a workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.

Abstract: A system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured to carry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that is carried in the factory interface or the deposition tool.

Abstract: In an embodiment, a workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.

Abstract: A semiconductor structure includes a semiconductor substrate, a dielectric layer, a buffer layer, at least one recess, and at least one conductor. The dielectric layer is present on the semiconductor substrate. The buffer layer is present between the semiconductor substrate and the dielectric layer. The recess extends into the semiconductor substrate through the dielectric layer and the buffer layer, in which the buffer layer has a removing rate with respect to an etching process for forming the recess. The removing rate of the buffer layer is between those of the semiconductor substrate and the dielectric layer. The conductor is present in the recess.

Abstract: A semiconductor structure includes a semiconductor substrate, a dielectric layer, a buffer layer, at least one recess, and at least one conductor. The dielectric layer is present on the semiconductor substrate. The buffer layer is present between the semiconductor substrate and the dielectric layer. The recess extends into the semiconductor substrate through the dielectric layer and the buffer layer, in which the buffer layer has a removing rate with respect to an etching process for forming the recess. The removing rate of the buffer layer is between those of the semiconductor substrate and the dielectric layer. The conductor is present in the recess.

Abstract: A method of obtaining a linear curve fitting conversion equation for use with a non-linear measurement system is introduced. The linear curve fitting conversion equation converts a subject value entered into the non-linear measurement system into a measured value for simulating a linear curve. The method includes substituting a known preset input value, an output value generated by entering the preset input value into the non-linear measurement system, and n operator settings falling within the measurement range of the non-linear measurement system into a (n-1)th order polynomial to form simultaneous equations including a number n of polynomials and thereby obtain a fitting parameter for creating the linear curve fitting conversion equation for use with the non-linear measurement system, thereby dispensing with the hassles of processing a large amount of data required for creating a conversion rule.

Abstract: A device for testing a function of a telephone exchange during a production process includes a sending-end module for sending a test criterion, a receiving-end module for receiving a test criterion, an input/output interface module connected to a telephone exchange, a call connection indicating unit, a signal switching unit, and a controlling unit for controlling a test procedure. The device not only tests whether a call can be connected and whether a call can be answered, but analyzes local electrical characteristics of the telephone exchange at the telephone exchange-end. With the device, signals treated by an analog-to-digital conversion process can display various voice information of a voice signal conveyed by the telephone exchange, such that a damaged portion of the telephone exchange can be assessed whenever a test fails, thereby cutting test costs and production costs.

Abstract: The invention relates to mobile phone capable of making internet calls, a system and a method for making internet calls via a computer by the same. The system includes a computer installed with communication software and a mobile phone capable of making internet calls. Moreover, via the system, the method includes the steps of: transmitting related data of a communication software to mobile phone capable of making internet calls by a computer, storing related data of the communication software in the mobile phone capable of making internet calls, and operating the communication software of the computer to phone or answer a phone according to related data of the communication software by the mobile phone. Therefore, the main objective of the invention is to enable users to phone anytime and anywhere easily and enable the information needed by users to be shown completely by a wireless handheld electronic device.

Abstract: An injection molding mechanism capable of shortening an injection molding process is generally applied to a processing process of a power cord, and comprises a material-feeding machine, a storage tank, a compression type material-supplying device, a conveying device and at least one robotic arm. The material-feeding machine, the storage tank and the compression type material-supplying device are arranged in series. The conveying device is a closed-loop conveying platform for conveying molds repeatedly. The robotic arm and the material-feeding machine are located above the conveyance path of the conveying device. In addition, the storage tank and the compression type material-supplying device are connected to the front end of the material-feeding machine to decrease the time spent on melting the plastic materials.

Abstract: A television with a built-in digital video recording device includes: an image receiving unit, receiving digital images from external cameras; an audio/video processing unit, processing the digital images and sound signals picked up by microphones, and outputting audio/video signals; a storage unit, storing the audio/video signals; a central processing unit, receiving and processing the audio/video signals and external television signals; and a display unit, presenting the sound and images of the audio/video signals or the television signals. The television with a built-in digital video recording device of the present invention not only has amusement, security monitoring, and digital video recording functions simultaneously but also has small size and high space efficiency.