Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: An inductor structure with height limit, which comprises: a conductor formed in a bent shape, and is set with a plurality of bending-portions, wherein a first connecting-pin and a second connecting-pin are respectively set at two ends of the conductor; a first magnetic core set with a first combining-surface, wherein the first combining-surface forms a concave groove to accommodate the conductor; and a second magnetic core set with a second combining-surface, wherein the second combining-surface forms a second concave groove to accommodate the conductor; wherein the second combining-surface is combined on the first combining-surface; wherein the conductor is sheathed and set between the first magnetic core and the second magnetic core, and is set with the first connecting-pin and the second connecting-pin exposedly. Therefore, the present invention can increase the magnetic (coupling) route length under the height limit to produce an effect of increasing the inductance value and current.

Abstract: The large-current inductor includes a first core member having a first winding piece, a second winding piece, a first indentation, and a second indentation; a second core member having a third winding piece, a fourth winding piece, a third indentation, and a fourth indentation; a third core member attached and joined to first lateral sides of the first and second core members; and a fourth core member attached and joined to second lateral sides of the first and second core members. A first coil member winds around the first and third winding pieces, and has its ends embedded into the first and third indentations. A second coil member winds around the second and fourth winding pieces, and has its ends embedded into the second and fourth indentations. The inductor enhances efficiency of energy storage by mutual inductance, and limits large current flow by leakage inductance.

Abstract: The large-current inductor includes a first core member having a first winding piece, a second winding piece, a first indentation, and a second indentation; a second core member having a third winding piece, a fourth winding piece, a third indentation, and a fourth indentation; a third core member attached and joined to first lateral sides of the first and second core members; and a fourth core member attached and joined to second lateral sides of the first and second core members. A first coil member winds around the first and third winding pieces, and has its ends embedded into the first and third indentations. A second coil member winds around the second and fourth winding pieces, and has its ends embedded into the second and fourth indentations. The inductor enhances efficiency of energy storage by mutual inductance, and limits large current flow by leakage inductance.

Abstract: The multiple winding inductor assembly includes a first core piece, a second core piece, a first conductor, and a first core assembly. The first core assembly includes a third core piece and a second conductor. The first and second conductors, together with the first, second, and third core pieces, form multiple inductors that, when working individually, do not cause mutual inductance on those not at work, thereby avoiding energy consumption. In addition, the inductor assembly may be extended in only one direction when cascading more inductors, facilitating circuit design and layout, and the configuration of the inductor assembly on the circuit board.