Abstract: A semiconductor memory device includes a stack of alternating insulating layers and first conductive layers disposed over a substrate; a plurality of memory cell strings penetrating the stack over the substrate, each memory cell string comprising a central portion extending through the stack, a semiconductor layer surrounding the central portion, and a ferroelectric layer surrounding the semiconductor layer, and the central portion comprising a channel isolation structure and a second conductive layer and a third conductive layer at two sides of the channel isolation structure; and a plurality of cell isolation structures penetrating the conductive layers and the insulating layers over the substrate and disposed between two memory cell strings, each cell isolation structure comprising a top portion and a bottom portion adjoined to the top portion and different from the top portion.

Abstract: Provided is a reticle pod with a detachable supporting mechanism, which is suitable for a dual pod, including an outer pod and an inner pod received therein, the inner pod including: a base, and at least a supporting mechanism, mounted on the base. The supporting mechanism includes: a supporting assembly, connected to a mounting interface of the base, the supporting assembly includes a seat, at least one limiting post, and a mounting hole, the at least one limiting post connects to the seat, the mounting hole penetrates the base and not a circular hole; and a supporting element, having a matching structure, so that the supporting element detachably received in the mounting hole.

Abstract: A door device includes a door body and a substrate retaining assembly. The substrate retaining assembly is disposed on a side of the door body. The substrate retaining assembly includes a retaining body and a plurality of retaining members. The retaining members are disposed on the retaining body and arranged at intervals. Each of the retaining members includes two elastic arms and a clamping structure. The clamping structure includes a clamping body, a clamping groove, and at least one relief portion. The clamping body is connected between the two elastic arms. The clamping groove is located on the clamping body and is communicated with adjacent ends of the elastic arms. The relief portion and the clamping groove are communicated to each other.

Abstract: A memory cell structure includes a transistor structure and a capacitor structure, where the capacitor structure includes a hydrogen absorption layer. The hydrogen absorption layer absorbs hydrogen, which prevents or reduces the likelihood of the hydrogen diffusing into an underlying metal-oxide channel of the transistor structure. In this way, the hydrogen absorption layer minimizes and/or reduces the likelihood of hydrogen contamination in the metal-oxide channel, which may enable a low current leakage to be achieved for the memory cell structure and reduces the likelihood of data corruption and/or failure of the memory cell structure, among other examples.

Abstract: A three-dimensional memory device and a manufacturing method thereof are provided. The three-dimensional memory device includes first and second stacking structures, isolation pillars, gate dielectric layers, channel layers and conductive pillars. The stacking structures are laterally spaced apart from each other. The stacking structures respectively comprises alternately stacked insulating layers and conductive layers. The isolation pillars laterally extend between the stacking structures. The isolation pillars further protrude into the stacking structures, and a space between the stacking structures is divided into cell regions. The gate dielectric layers are respectively formed in one of the cell regions, and cover opposing sidewalls of the stacking structures and sidewalls of the isolation pillars. The channel layers respectively cover an inner surface of one of the gate dielectric layers.

Abstract: An inspection system and an inspection method for at least one supporting beam include the steps of setting a lateral surface of one supporting beam as a reference point for detecting an offset amount; applying a predetermined force respectively to the supporting beams in sequence in a moving direction; detecting the offset amount of the supporting beam as applied by the predetermined force; and, acquiring an inspection result by a calculation based on the reference point and the offset amount. The inspection system includes a pushing member, a driving module, and an offset sensor. The pushing member is used for applying a predetermined force to the supporting beam. The driving module connects to the pushing member for driving the pushing member to move toward the supporting beam. The offset sensor is used for detecting an offset amount of the supporting beam as applied by the predetermined force.

Abstract: A door locking mechanism and semiconductor container using the same include door panel, cover, and locking module. The door panel has a first stop structure. The cover and the door panel define an accommodating space for receiving the locking module. The locking module includes rotating member, holding member, and elastic member. The elastic member is disposed on the holding member and has a second stop structure near the first stop structure. The elastic member is disposed between the holding and the rotating member. The elastic member is compressed when a force is applied to the holding member, and the second stop structure detaches from a limitation state with the first stop structure for allowing a rotating operation of the rotating member. The elastic member elastically restores when the force is removed, and the second stop structure returns to the limitation state for limiting the rotating operation.

Abstract: A dry cleaning device adapted to clean a container component of a container of a semiconductor manufacturing process and adapted to clean the container component by carbon dioxide snowflakes. The dry cleaning device can first inspect the container component before and after cleaning, clean the container component by carbon dioxide snowflakes according to a predetermined cleaning working set, and forwards the container component to a next workstation once the cleaning of the container component is complete. The dry cleaning device is adapted to clean a container of a semiconductor manufacturing process in a fast and effective manner without involving any liquid solvents.

Abstract: A supporting shelf module includes a plurality of plastic supporting plates parallelly arranged in a height direction, and at least one pair of metal-made connectors located at two opposite ends of the supporting plates in the height direction. The connectors in one pair are correspondingly located in two horizontal planes perpendicular to the height direction. A wafer container is also disclosed, which includes a container body having at least two sets of the supporting shelf modules mounted therein, at least two top retaining brackets and at least two bottom retaining grooves provided on an inward side of a top and a bottom panel of the container body, respectively. The supporting shelf module has upper ends engaged with the top retaining brackets and lower ends engaged with and limited to the bottom retaining grooves in an engaging direction. Thus, the tolerance problem of the conventional wafer shelf can be solved.

Abstract: The present disclosure provides a reticle pod comprising a base and at least one reticle support disposed on the base, the reticle support reticle support is arranged for carrying a reticle and has a resilient means. When the downward pressure applied to the reticle support is less than or equal to a critical value, a height of the reticle support is maintained at a predetermined height; when the downward pressure applied to the reticle support is greater than the critical value, the reticle support absorbs the downward pressure by deforming, and then the reticle support restores to the predetermined height only when the downward pressure is shared by another reticle support.

Abstract: A display panel including a circuit substrate, a plurality of light-emitting elements, a plurality of microlenses, and a plurality of dummy microlenses is provided. The circuit substrate is provided with a plurality of pixel areas. Each of the pixel areas is provided with the light-emitting elements. The plurality of microlenses are disposed on the circuit substrate and respectively overlapped with the light-emitting elements. The plurality of dummy microlenses are disposed between the microlenses and not overlapped with the light-emitting elements.

Abstract: A sensing panel includes a substrate, a first sensor, a second sensor, a first switching element, and a second switching element. The first sensor includes a first metal electrode layer, a light-sensing layer, and a first transparent electrode layer. The first sensor is configured to receive a light and correspondingly generate a first sensing signal. The second sensor includes a second metal electrode layer, an insulating layer, and a second transparent electrode layer. The second sensor is configured to contact an object and generate a second sensing signal based on a capacitance value between the object and the second metal electrode layer. The first metal electrode layer is electrically connected to the second metal electrode layer and is electrically connected to the first switching element and the second switching element. The first transparent electrode layer is electrically connected with the second transparent electrode layer.

Abstract: The present invention provides a wafer container and a gas diffusion device applied in the wafer container. The wafer container includes a shell, and all components included and applied on the shell are made of thermal resistance materials. The gas diffusion device and the wafer container, when assembled together, utilize a coupling structure and a collar as a protection mechanism for the gas diffusion device. The gas diffusion device has a buffering chamber that provides a buffering tolerance and a communicating space for the gas before the gas enters an interior space of the wafer container.

Abstract: A defect inspection method, an inspection system, and a non-transitory computer-readable storage medium are provided. The defect inspection method includes providing a processed image and a reference image of a wafer, both the processed image and the reference image comprising a pattern of interest; determining the processed image as a qualified image in response to a matching ratio that reflects a percentage of correctly aligned features of the pattern of interest between the processed image and the reference image is above a first predetermined threshold; selecting a first feature of the qualified image; selecting a second feature of the reference image corresponding to the first feature of the processed image; comparing the qualified image with the reference image to determine a variation of the first feature with respect to the second feature; and detecting a defect of the wafer based on a comparison of the first and second features.

Abstract: A device produces a dolly zoom effect with automatic focal length adjustment. The device uses a camera to capture an initial image including at least a foreground object and a background. The device includes a size tracking circuit to identify the size of the foreground object in the initial image. The device further includes a focal length control circuit. The focal length control circuit calculates an adjusted focal length of the camera to maintain the size of the foreground object in subsequently captured images.