Patents by Inventor Chien-Chou Hou

Chien-Chou Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of etching uniform silicon layer
    Patent number: 7271102
    Abstract: A method of etching a silicon layer to avoid non-uniformity. First, a patterned silicon layer is provided. Next, an etching buffer layer is conformally formed on the surface and the top layer of the patterned silicon layer. Finally, the etching buffer layer and the patterned silicon layer are etched until the thickness of the patterned silicon layer is reduced. The conformal oxide layer provides etching resistance as an etching buffer layer, such that the etching rate is uniform on the whole subject matter, thereby, reducing the thickness of the patterned silicon layer uniformly after etching.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: September 18, 2007
    Assignee: AU Optronics Corporation
    Inventors: Chien-Chou Hou, Ching-Te Huang, Li-Wei Hwang, Shih-Kun Chen
  • Method of etching uniform silicon layer
    Publication number: 20040106286
    Abstract: A method of etching a silicon layer to avoid non-uniformity. First, a patterned silicon layer is provided. Next, an etching buffer layer is conformally formed on the surface and the top layer of the patterned silicon layer. Finally, the etching buffer layer and the patterned silicon layer are etched until the thickness of the patterned silicon layer is reduced. The conformal oxide layer provides etching resistance as an etching buffer layer, such that the etching rate is uniform on the whole subject matter, thereby, reducing the thickness of the patterned silicon layer uniformly after etching.
    Type: Application
    Filed: June 20, 2003
    Publication date: June 3, 2004
    Applicant: AU Optronics Corp.
    Inventors: Chien-Chou Hou, Ching-Te Huang, Li-Wei Hwang, Shih-Kun Chen