Patents by Inventor Chien-Chou Hsu

Chien-Chou Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984516
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: May 14, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Patent number: 11967652
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 23, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Publication number: 20220300231
    Abstract: A data transmitting method of a display device, which applies to a transmitting device and the display device. The transmitting device includes a first transmitting module. The display device includes a processing module, a second transmitting module, a storage module, and a display module. The data transmission method includes steps of: select a file on the transmitting device; compress the file to form a compressed file; send the compressed file to the display device via the first transmitting module; receive the compressed file by the second transmitting module of the display device; decompress the compressed file by the processing module to obtain the file; write the file into the storage module by the processing module and correspondingly displaying on the display module based on the file. In this way, a time for transmitting the file could be effectively reduced.
    Type: Application
    Filed: March 17, 2021
    Publication date: September 22, 2022
    Applicant: WINSTAR DISPLAY CO., LTD.
    Inventors: CHIA-HSIANG NI, WEN-WEI CHUNG, YU-CHANG SONG, CHIEN-CHOU HSU, WEN-HAO LIAO, YU-PIN LIAO
  • Publication number: 20070287203
    Abstract: A method and system of automatic beam energy control. First, a substrate is provided. Next, hydrogen content of the substrate is measured to determine whether hydrogen content exceeds a critical hydrogen content limit. A warning is issued when hydrogen content exceeds a critical hydrogen content limit. Substrate thickness is measured when hydrogen content does not exceed a critical hydrogen content limit. A database comprising a plurality of beam energy values individually absorbed by substrates of different thicknesses is provided. An appropriate beam energy level corresponding to the measured thickness is provided by the database. Finally, beam energy is delivered to the substrate accordingly.
    Type: Application
    Filed: August 22, 2007
    Publication date: December 13, 2007
    Inventors: Long-Sheng LIAO, Chien-Chou Hsu, Yi-Chang Tsao
  • Patent number: 7303981
    Abstract: A method for forming a polysilicon structure is provided. An amorphous silicon structure with a first amorphous silicon region and a second amorphous silicon region is formed in a first region and a second region of a substrate, respectively. The first amorphous silicon region is thinner than the second amorphous silicon region. The amorphous silicon structure is crystallized to form the polysilicon structure with a first polysilicon region and a second polysilicon region corresponding to the first amorphous silicon region and the second amorphous silicon region.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: December 4, 2007
    Assignee: AU Optronics Corp.
    Inventors: Chien-Chou Hsu, Tsung-Yi Hsu
  • Publication number: 20070176180
    Abstract: A method for forming a polysilicon structure is provided. An amorphous silicon structure with a first amorphous silicon region and a second amorphous silicon region is formed in a first region and a second region of a substrate, respectively. The first amorphous silicon region is thinner than the second amorphous silicon region. The amorphous silicon structure is crystallized to form the polysilicon structure with a first polysilicon region and a second polysilicon region corresponding to the first amorphous silicon region and the second amorphous silicon region.
    Type: Application
    Filed: March 22, 2007
    Publication date: August 2, 2007
    Applicant: AU OPTRONICS CORP.
    Inventors: Chien-Chou Hsu, Tsung-Yi Hsu
  • Publication number: 20070166898
    Abstract: A method for forming a polysilicon structure is provided. An amorphous silicon structure with a first amorphous silicon region and a second amorphous silicon region is formed in a first region and a second region of a substrate, respectively. The first amorphous silicon region is thinner than the second amorphous silicon region. The amorphous silicon structure is crystallized to form the polysilicon structure with a first polysilicon region and a second polysilicon region corresponding to the first amorphous silicon region and the second amorphous silicon region.
    Type: Application
    Filed: March 22, 2007
    Publication date: July 19, 2007
    Applicant: AU OPTRONICS CORP.
    Inventors: Chien-Chou Hsu, Tsung-Yi Hsu
  • Publication number: 20070024812
    Abstract: A projector for projecting a first image on a screen according to first image data comprises a wireless access module for receiving signals, and an editing module for editing the received signals into second image data so as to display a second image on the screen. The first image and the second image being overlapped and displayed on the screen.
    Type: Application
    Filed: July 27, 2006
    Publication date: February 1, 2007
    Inventors: Jih-Hwa Chung, Chien-Chou Hsu
  • Publication number: 20060006390
    Abstract: A method for forming a polysilicon structure is provided. An amorphous silicon structure with a first amorphous silicon region and a second amorphous silicon region is formed in a first region and a second region of a substrate, respectively. The first amorphous silicon region is thinner than the second amorphous silicon region. The amorphous silicon structure is crystallized to form the polysilicon structure with a first polysilicon region and a second polysilicon region corresponding to the first amorphous silicon region and the second amorphous silicon region.
    Type: Application
    Filed: November 30, 2004
    Publication date: January 12, 2006
    Inventors: Chien-Chou Hsu, Tsung-Yi Hsu
  • Publication number: 20040241889
    Abstract: A method and system of automatic beam energy control. First, a substrate is provided. Next, hydrogen content of the substrate is measured to determine whether hydrogen content exceeds a critical hydrogen content limit. A warning is issued when hydrogen content exceeds a critical hydrogen content limit. Substrate thickness is measured when hydrogen content does not exceed a critical hydrogen content limit. A database comprising a plurality of beam energy values individually absorbed by substrates of different thicknesses is provided. An appropriate beam energy level corresponding to the measured thickness is provided by the database. Finally, beam energy is delivered to the substrate accordingly.
    Type: Application
    Filed: December 30, 2003
    Publication date: December 2, 2004
    Applicant: AU Optronics Corp.
    Inventors: Long-Sheng Liao, Chien-Chou Hsu, Yi-Chang Tsao