Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A welding filler feed-forward maintaining device is provided with a sliding block on a sliding rail mechanism, wherein the sliding jail mechanism is an end shaft of a working space, which is suitable tor use of the end arm of a robot arm, and a main bracket is vertically erected to pivot on the sliding block via a pivoting seat, and the main bracket extends to a welding head at one end, and an end of a solder conduit for soldering is bent toward the soldering tip, and a discharge port for leading the solder is furnished, and a pivoting drive assembly coupled to the pivoting seat is further disposed on the sliding block and is configured to drive the pivoting seat to pivot the main bracket in order to keep the discharge port in front of the weld head along the varying welding direction.