Abstract: An electronic device is provided. The electronic device includes a first dielectric layer, an electronic element, an encapsulant, and a second dielectric layer. The first dielectric layer has a first coefficient of thermal expansion (CTE). The electronic element is disposed over the first dielectric layer. The encapsulant encapsulates the electronic element and has a second CTE. The second dielectric layer is disposed over the encapsulant and having a third CTE. The second CTE ranges between the first CTE and the third CTE.

Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).

Abstract: A close-end fuel cell and an anode bipolar plate thereof are provided. The anode bipolar plate includes an airtight conductive frame and a conductive porous substrate disposed within the airtight conductive frame. In the airtight conductive frame, an edge of a first side has a fuel inlet, and an edge of a second side has a fuel outlet. The conductive porous substrate has at least one flow channel, where a first end of the flow channel communicates with the fuel inlet, a second end of the flow channel communicates with the fuel outlet. The flow channel is provided with a blocking part near the fuel inlet to divide the flow channel into two areas.

Abstract: A memory device, includes a memory array for storing a plurality of vector data each of which has an MSB vector and a LSB vector. The memory array includes a plurality of memory units each of which has a first bit and a second bit. The first bit is used to store the MSB vector of each vector data, the second bit is used to store the LSB vector of each vector data. A bit line corresponding to each vector data executes one time of bit-line-setup, and reads the MSB vector and the LSB vector of each vector data according to the bit line. The threshold voltage distribution of each memory unit is divided into N states, where N is a positive integer and N is less than 2 to the power of 2, and the effective bit number stored by each memory unit is less than 2.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.

Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.

Abstract: A driving assistant method applied to a first moving vehicle is provided. The method includes capturing an image of a license plate of a second moving vehicle when the first moving vehicle is moving, and identifying a first area of the license plate in the captured image. Basic information of the second moving vehicle are obtained according to a size of the first area. Once a safe distance is determined according to driving information of the first moving vehicle and the basic information of the second moving vehicle, a warning message is transmitted when the distance between the first moving vehicle and the second moving vehicle is less than the safe distance.

Abstract: A method for providing assistance in driving includes capturing an image of a second moving vehicle when a first moving vehicle is moving and obtaining basic information of the second moving vehicle according to the image thereof, the basic information of the second moving vehicle comprising weight information of the second moving vehicle. Driving information of the first moving vehicle is obtained, and a safe distance between the first moving vehicle and the second moving vehicle is determined according to the driving information of the first moving vehicle and the basic information of the second moving vehicle. The current distance between the first moving vehicle and the second moving vehicle is detected, and a warning is output if the distance between the first moving vehicle and the second moving vehicle is less than the safe distance.

Abstract: A method for providing assistance in driving includes capturing an image of a second moving vehicle when a first moving vehicle is moving and obtaining basic information of the second moving vehicle according to the image thereof, the basic information of the second moving vehicle comprising weight information of the second moving vehicle. Driving information of the first moving vehicle is obtained, and a safe distance between the first moving vehicle and the second moving vehicle is determined according to the driving information of the first moving vehicle and the basic information of the second moving vehicle. The current distance between the first moving vehicle and the second moving vehicle is detected, and a warning is output if the distance between the first moving vehicle and the second moving vehicle is less than the safe distance.

Abstract: A driving assistant method applied to a first moving vehicle is provided. The method includes capturing an image of a license plate of a second moving vehicle when the first moving vehicle is moving, and identifying a first area of the license plate in the captured image. Basic information of the second moving vehicle are obtained according to a size of the first area. Once a safe distance is determined according to driving information of the first moving vehicle and the basic information of the second moving vehicle, a warning message is transmitted when the distance between the first moving vehicle and the second moving vehicle is less than the safe distance.

Abstract: The door moving mechanism of a cutting machine includes an upright support, a machine body adjacent to the upright support and a horizontal guide rail mounted on the machine body immediately above the upright support. A connecting rod slidably provided on the guide rail has a first end connected to a door, and a second rod has a first end pivotally connected to a second end of the first rod and a second end pivotally connected to a second end of the connecting rod. The first rod has a first and second lobed part formed adjacent to the pivot point and cooperatively defining a receiving space between them. A push rod is provided on a casing movably mounted on the upright support and has a free end extending into the receiving space to push one of the lobed parts when the casing travels up and down along the upright support.