Abstract: A chip package structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a chip, a molding layer and a package cover. The conductive substrate has first and second board surfaces opposite to each other, and a die-bonding region is defined on the first board surface. The chip is disposed on the first board and located in the die-bonding region, and is electrically connected to the conductive substrate. The molding layer is disposed on the first board surface and surrounds the die-bonding region and the chip. The package cover is disposed on the molding layer, and the package cover, the molding layer and the conductive substrate jointly define an enclosed space surrounding the chip. Two of the conductive substrate, the molding layer and the package cover are connected to each other through a mortise-tenon joint structure.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; forming a mirror ink on the substrate; placing a chip upside-down on the substrate; forming soldering wires coupled with the chip and the substrate; forming a support body on the substrate; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process in which the package layer and the substrate are cut to form the chip package structure.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; forming a support body on the substrate; providing at least one reflecting member at a periphery of the support body; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process to form the chip package structure.

Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.

Abstract: Techniques for suggesting targeting criteria for a content delivery campaign are provided. An affinity score representing an affinity between the attribute values of each pair of multiple pairs of attribute values is computed. First input indicating a particular attribute value for a particular attribute type is received through a user interface for creating a content delivery campaign. The user interface includes fields for inputting attribute values for multiple attribute types that includes the particular attribute type. In response to the first input and based on affinity scores associated with the particular attribute value, a set of suggested attribute values is identified. The user interface is updated to include the set of suggested attribute values. Second input indicating a selection of a particular suggested attribute value is received. The particular suggested attribute value is added to the content delivery campaign.

Abstract: A global manager communicates with various local managers to receive and process video queries. The video queries identify components that process live video streams, placement options for where the components of the video query may be executed, and various video query plans. The video query plans include options such as framerate and video quality. As the global manager processes the video queries, the global manager determines an initial set of video query configurations that identify a video query plan and placement option for each component of a given video query. Using the initial set of video query configurations, the global manager then determines an optimal set of video query configurations for the received set of video queries. The global manager communications instructions to the local managers to execute the components of the video queries using the video query plans and placement options from the optimal set of video query configurations.

Abstract: A global manager communicates with various local managers to receive and process video queries. The video queries identify components that process live video streams, placement options for where the components of the video query may be executed, and various video query plans. The video query plans include options such as framerate and video quality. As the global manager processes the video queries, the global manager determines an initial set of video query configurations that identify a video query plan and placement option for each component of a given video query. Using the initial set of video query configurations, the global manager then determines an optimal set of video query configurations for the received set of video queries. The global manager communications instructions to the local managers to execute the components of the video queries using the video query plans and placement options from the optimal set of video query configurations.