Abstract: An optocoupler device for receiving a load voltage larger than or equal to 5 KV includes a carrier, a supporting frame connected to the carrier, a light emitter and a light receiver spacedly mounted on the carrier, an electrical isolator at least partially disposed on the supporting frame, a translucent encapsulate, and an opaque encapsulate. The electrical isolator is translucent and has a dielectric strength larger than or equal to 50 KV/mm. A shortest light transmitting path between the light emitter and the light receiver passes through the electrical isolator. The supporting frame, the light emitter, the light receiver, and at least part of the electrical isolator are embedded in the translucent encapsulate, and the translucent encapsulate is embedded in the opaque encapsulate.

Abstract: An optical package structure includes a first conductive frame, a second conductive frame, a light receiver, and a light-permeable package compound. The first and second conductive frames are arranged apart from each other and have a light entrance there-between. The light receiver includes a light receiving region and two soldering portions arranged on a surface thereof. The two soldering portions are respectively arranged at two opposite sides of the light receiving region, and are respectively soldered onto the first and second conductive frames, such that the light receiving region faces the light entrance. At least part of the first conductive frame, at least part of the second conductive frame, and the light receiver are embedded in the light-permeable package compound. The light receiver is configured to receive a light signal traveling through the light-permeable package compound and the light entrance.

Abstract: An optical package structure of a mobile communication device includes a board, electrodes formed on the board, a light emitter and an IC chip both disposed on the board, and a light permeable package body encapsulating the light emitter and the IC chip. The electrodes are respectively arranged on a lower edge portion and two lateral edge portions of the board, and the number of the electrodes on the lower edge portion is larger than that on any of the two lateral edge portions. The light emitter is electrically coupled to at least one of the electrodes. The IC chip includes a light sensor corresponding in position to the light emitter and connecting pads electrically coupled to the electrodes. A distance from the light sensor to the upper edge portion is less than that to the lower edge portion, and is equal to or less than 250 ?m.

Abstract: An optical package structure includes a first conductive frame, a second conductive frame, a light receiver, and a light-permeable package compound. The first and second conductive frames are arranged apart from each other and have a light entrance there-between. The light receiver includes a light receiving region and two soldering portions arranged on a surface thereof. The two soldering portions are respectively arranged at two opposite sides of the light receiving region, and are respectively soldered onto the first and second conductive frames, such that the light receiving region faces the light entrance. At least part of the first conductive frame, at least part of the second conductive frame, and the light receiver are embedded in the light-permeable package compound. The light receiver is configured to receive a light signal traveling through the light-permeable package compound and the light entrance.

Abstract: An optocoupler device for receiving a load voltage larger than or equal to 5KV includes a carrier, a supporting frame connected to the carrier, a light emitter and a light receiver spacedly mounted on the carrier, an electrical isolator at least partially disposed on the supporting frame, a translucent encapsulate, and an opaque encapsulate. The electrical isolator is translucent and has a dielectric strength larger than or equal to 50 KV/mm. A shortest light transmitting path between the light emitter and the light receiver passes through the electrical isolator. The supporting frame, the light emitter, the light receiver, and at least part of the electrical isolator are embedded in the translucent encapsulate, and the translucent encapsulate is embedded in the opaque encapsulate.

Abstract: A driving apparatus and a driving method of a backlight module are provided. The backlight module includes multiple LEDs. The driving apparatus includes at least one thermal sensor, an optical sensor, and a processor. The thermal sensor is for detecting a working temperature of the LEDs. The optical sensor is for detecting brightness and color of the backlight module after a calibration function is enabled, to obtain difference values of the detected brightness and color with respect to predetermined brightness and color. The processor is for providing at least one initial thermal compensation table, to determine working currents of the LEDs associated with the working temperature. The processor further is for calibrating a content of the initial thermal compensation table corresponding with a current working temperature of the LEDs and storing the calibrated thermal compensation table as the initial thermal compensation table after the calibration function is enabled.

Abstract: A reflection sensing system comprising a body, an illuming module and a detecting module. The body is made of LCP. The illuming module includes a first accommodating space and an LED, and the detecting module includes a light detector. The first accommodating space is disposed in the body and has a first opening at one end. In the first accommodating space, the neighboring region relative to the first opening is parabolic or approximately parabolic. At an end at an inner side of the first accommodating space near the light detector, at least one cross-section near the first opening is not parabolic or approximately parabolic. The LED is disposed at the focus of the first accommodating space and aligned towards the first opening. The light detector of the detecting module is disposed in the body and generates a sensing signal after receiving light.

Abstract: A surface light source structure having a circuit board, a first light emitting diode (LED) array, and a second LED array is provided. The first and second LED arrays are assembled on the circuit board. Each LED rows of the two LED arrays has a plurality of LED units connected in series. The LED rows of the first LED array are connected in parallel. The LED rows of the second LED array are connected in parallel. The LED rows of the second LED array are intersected between the LED rows of the first LED array. Positive-to-negative directions of the LED units of the first and second LED array are arranged in opposite directions.

Abstract: A light source control method and a light source control device are used for controlling a light source. The light source control device includes a position detecting sensor and a microcontroller. The light source control method includes steps of generating a first signal according to an object touching a position of the position detecting sensor, and generating a control signal according to a light source adjustable parameter set corresponding to the first signal for controlling an illuminating status of the light source. The light source adjustable parameter set includes a plurality of color value components. The control signal is generated by the microcontroller according to the color value components.

Abstract: In a feedback circuit of a power supply, an electrical level of an output voltage is stabilized corresponding to changes of an electrical level of a pulse width modulation signal, and effects, which are caused by spikes, on passive elements are decreased to a lowest degree. The electrical level of the output voltage is stabilized by storing a voltage corresponding to a low-to-high electrical level of the PWM signal with a capacitor, by discharging the stored voltage with a high-to-low electrical level of said PWM signal, and by regulating a discharging path of the stored voltage with a diode, which is not conducted. The abovementioned disposition may be utilized on various power-consuming devices, a duty cycle of each of which is controlled with a PWM signal, for stabilizing output voltages of said power-consuming devices, and for reducing effects, which are caused by spikes, on passive elements inside said power-consuming devices.

Abstract: A driving apparatus and a driving method of a backlight module are provided. The backlight module includes multiple LEDs. The driving apparatus includes at least one thermal sensor, an optical sensor, and a processor. The thermal sensor is for detecting a working temperature of the LEDs. The optical sensor is for detecting brightness and color of the backlight module after a calibration function is enabled, to obtain difference values of the detected brightness and color with respect to predetermined brightness and color. The processor is for providing at least one initial thermal compensation table, to determine working currents of the LEDs associated with the working temperature. The processor further is for calibrating a content of the initial thermal compensation table corresponding with a current working temperature of the LEDs and storing the calibrated thermal compensation table as the initial thermal compensation table after the calibration function is enabled.

Abstract: A light source control method and a light source control device are used for controlling a light source. The light source control device includes a position detecting sensor and a microcontroller. The light source control method includes steps of generating a first signal according to an object touching a position of the position detecting sensor, and generating a control signal according to a light source adjustable parameter set corresponding to the first signal for controlling an illuminating status of the light source. The light source adjustable parameter set includes a plurality of color value components. The control signal is generated by the microcontroller according to the color value components.

Abstract: A liquid crystal display module and an integrated driving board thereof are disclosed. The driving board includes a substrate, a circuit pattern, a timing clock driver, a light emitting diode (LED) driving module, a color management module and a photosensitive chip. The circuit pattern is disposed on the surface of the substrate. The timing clock driver, the LED driving module, the color management module and the photosensitive chip are disposed on the substrate and electrically coupled to the circuit pattern. The LED driving module is electrically coupled to the timing clock driver. The color management module is electrically coupled to the LED driving module. The photosensitive chip is electrically coupled to the color management module.

Abstract: A light source driving circuit for a backlight module is disclosed, wherein each driving unit includes a reference resistor, a transistor, a bias resistor and a shunt regulator. The transistor is coupled between an LED string and the reference resistor, and the bias resistor is coupled between an operation voltage and the control terminal of the transistor. The shunt regulator is coupled between the control terminal of the transistor and a common terminal, and the reference pin of the shunt regulator is coupled to the common node between the reference resistor and the transistor.

Abstract: A surface light source structure having a circuit board, a first light emitting diode (LED) array, and a second LED array is provided. The first and second LED arrays are assembled on the circuit board. Each LED rows of the two LED arrays has a plurality of LED units connected in series. The LED rows of the first LED array are connected in parallel. The LED rows of the second LED array are connected in parallel. The LED rows of the second LED array are intersected between the LED rows of the first LED array. Positive-to-negative directions of the LED units of the first and second LED array are arranged in opposite directions.

Abstract: In a feedback circuit of a power supply, an electrical level of an output voltage is stabilized corresponding to changes of an electrical level of a pulse width modulation signal, and effects, which are caused by spikes, on passive elements are decreased to a lowest degree. The electrical level of the output voltage is stabilized by storing a voltage corresponding to a low-to-high electrical level of the PWM signal with a capacitor, by discharging the stored voltage with a high-to-low electrical level of said PWM signal, and by regulating a discharging path of the stored voltage with a diode, which is not conducted. The abovementioned disposition may be utilized on various power-consuming devices, a duty cycle of each of which is controlled with a PWM signal, for stabilizing output voltages of said power-consuming devices, and for reducing effects, which are caused by spikes, on passive elements inside said power-consuming devices.

Abstract: A core logic circuit which works with a CPU and a main graphics accelerator in a computer system is provided. The core logic chip includes a host controller electrically connected to the CPU for receiving a command from the CPU; an auxiliary graphing engine electrically connected to the host controller for receiving and processing the command; and a transmission controller electrically connected to the auxiliary graphing engine for transmitting the command that is processed and outputted by the auxiliary graphing engine to the main graphics accelerator to be further processed.

Abstract: A three-dimensional (3-D) digital image processor and a method for processing a visibility for use in a displaying procedure of a 3-D digital image are disclosed. The 3-D digital image processor includes a depth map generator, a memory device and a rendering engine. The method includes steps of presetting a depth map according to a plurality of pixels received, the depth map storing the pixels and reference depths corresponding thereto, and receiving a pixel data and proceeding a visibility test with reference to the depth map, thereby determining whether to proceed a rendering operation on the 3-D digital image by the pixel data.

Abstract: An anti-aliasing process without sorting the polygons in depth order to improve the image quality in three-dimensional graphics system. This method comprises extra buffer memory than does a typical three-dimensional graphics display system. The Z buffer stores the depth value of nearest pixel in front Z buffer and depth value of secondary nearest pixels in back Z buffer. The color buffer stores foreground color and background color. A weighting value is used and stored in the frame buffer to blend the foreground color and the background nearest color. The weighting value is associated with each pixel, it indicates the percentage of coverage of a pixel. Every pixel in Z buffer test stage will update the depth of the nearest pixel and the depth of the second nearest in Z-buffer, foreground color and background color in the frame buffer and the weighting value according to the result of depth comparison.

Abstract: A core logic circuit for use with a CPU and a main graphics accelerator in a computer system is provided. The core logic chip includes a host controller electrically connected to the CPU for receiving a command from the CPU; an auxiliary graphing engine electrically connected to the host controller fore receiving and processing the command; and a transmission controller electrically connected to the auxiliary graphing engine for transmitting the command processed and outputted by the auxiliary graphing engine to the main graphics accelerator to be further processed.