Patents by Inventor Chien-Chung Hsu

Chien-Chung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210161006
    Abstract: A direct bonded copper ceramic substrate is provided, which includes a nitride ceramic substrate, a first passivation layer, and a first copper layer. The first passivation layer includes aluminum oxide or silicon oxide doped with another metal. The other metal is titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, or a combination thereof. The aluminum or silicon and the other metal have a weight ratio of 60:40 to 99.5:0.5. The first passivation layer is disposed between the top surface of the nitride ceramic substrate and the first copper layer.
    Type: Application
    Filed: December 19, 2019
    Publication date: May 27, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kai-Hsiang CHUANG, Chien-Chiang HSU, Chien-Chung HSU, Kuo-Chuang CHIU
  • Publication number: 20210127522
    Abstract: A server system comprises a base, a front panel (13) arranged on the base and defining a collecting space; two doors (16) arranged on opposite sides of the base, and being perpendicular to the front panel; two storage cases (171) arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two first corridors are each defined between one of the doors and one of the storage case facing the one door; two circuit boards (18) arranged between the two storage cases, wherein the two circuit boards comprise a plurality of slits, wherein a second corridor is defined between the two circuit boards; a storage cover (121) disposed above the base over the two first corridors, the second corridor, the two storage cases, and the two circuit boards.
    Type: Application
    Filed: October 27, 2020
    Publication date: April 29, 2021
    Inventors: CHIEN-WEN WANG, HAN-CHUNG CHIEN, SHENG-CHAN LIN, PAO-LUNG WANG, TSUNG HSUN CHIANG, HAO-HSIANG HSU
  • Patent number: 10974994
    Abstract: A method of forming a core-shell composite material includes depositing a polysiloxane shell to wrap a ceramic core via chemical vapor deposition for forming a core-shell composite material, wherein the ceramic core is an oxide of metal and silicon, which includes 100 parts by weight of calcium, 50 to 95 parts by weight of iron, 15 to 40 parts by weight of silicon, 2 to 15 parts by weight of magnesium, 2 to 20 parts by weight of aluminum, and 2 to 10 parts by weight of manganese.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: April 13, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Min Yu, Chien-Chung Hsu, Kai-Hsiang Chuang, Ming-Hui Chang
  • Patent number: 9660572
    Abstract: An aluminum frame structure for packaging solar panel, comprising: a vertical support member; an U-shaped member, coupled to the vertical support member while allowing the opening of the U-shaped member to face toward a level direction; and at least one protruding member, disposed inside the U-shaped member, each having at least one protrusion arranged at the opening of the U-shaped member and at a position neighboring to the vertical support member while allowing the gap between the highest point of the at least one protrusion and an imaginary line representing the contact slope to be formed larger than the thickness of the back film, and also enabling the contact area of the at least one protrusion and the contact slope to be at least larger than 50% of the area of the contact slope.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: May 23, 2017
    Assignee: ETERBRIGHT SOLAR CORPORATION
    Inventor: Chien-Chung Hsu
  • Patent number: 9153747
    Abstract: A light-emitting element includes a light-emitting stack which has an active layer, and a non-oxide insulative layer below the light-emitting stack, wherein a refractive index of the non-oxide insulative layer is less than 1.4.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: October 6, 2015
    Assignee: EPISTAR CORPORATION
    Inventors: Wen-Luh Liao, Chien-Chung Hsu, Yao-Ru Chang, Shih-I Chen, Chia-Liang Hsu
  • Publication number: 20150090678
    Abstract: An aluminum frame structure for packaging solar panel, comprising: a vertical support member; an U-shaped member, coupled to the vertical support member while allowing the opening of the U-shaped member to face toward a level direction; and at least one protruding member, disposed inside the U-shaped member, each having at least one protrusion arranged at the opening of the U-shaped member and at a position neighboring to the vertical support member while allowing the gap between the highest point of the at least one protrusion and an imaginary line representing the contact slope to be formed larger than the thickness of the back film, and also enabling the contact area of the at least one protrusion and the contact slope to be at least larger than 50% of the area of the contact slope.
    Type: Application
    Filed: August 4, 2014
    Publication date: April 2, 2015
    Inventor: CHIEN-CHUNG HSU
  • Publication number: 20150014721
    Abstract: A light-emitting element includes a light-emitting stack which has an active layer, and a non-oxide insulative layer below the light-emitting stack, wherein a refractive index of the non-oxide insulative layer is less than 1.4.
    Type: Application
    Filed: June 11, 2014
    Publication date: January 15, 2015
    Inventors: Wen-Luh LIAO, Chien-Chung HSU, Yao-Ru CHANG, Shih-I CHEN, Chia-Liang HSU
  • Patent number: 8610317
    Abstract: A communication circuit and an adapter having the same are provided. The communication circuit includes a coupling circuit and a transceiver module. The coupling circuit is coupled to a DC power line of the adapter to filter a first modulation signal carried on the DC power line or to couple a second modulation signal to the DC power line. The transceiver module is used to receive and demodulate the first modulation signal from the coupling circuit or to output the second modulation signal to the coupling circuit. The adapter is capable of transmitting data and power through the same DC power line.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: December 17, 2013
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventors: Tsung-Yuan Tsai, Chien-Chung Hsu
  • Publication number: 20120147565
    Abstract: A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal conductivity is disclosed. The body has opposite inner surfaces and outer surfaces. The heat conducting member is embedded inside the body and is completely surrounded between the inner surfaces and the outer surfaces. When the electronic device generates heat, the heat is firstly transferred to the heat conducting member from the inner surfaces, and then rapidly and evenly spreads over the heat conducting member. Finally, the heat inside the heat conducting member is uniformly dissipated through the outer surfaces. Accordingly, the heat dissipation and temperature-homogenizing structure may effectively and evenly spread the heat over the outer surfaces for exchanging heat with the ambient.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 14, 2012
    Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GZ) CO., LTD.
    Inventors: Ya-Tung I, Wen-Chi Chen, Chien-Chung Hsu, Yi-Jen Lu, Pao-Hsiu Fan
  • Publication number: 20120069874
    Abstract: A communication circuit and an adapter having the same are provided. The communication circuit includes a coupling circuit and a transceiver module. The coupling circuit is coupled to a DC power line of the adapter to filter a first modulation signal carried on the DC power line or to couple a second modulation signal to the DC power line. The transceiver module is used to receive and demodulate the first modulation signal from the coupling circuit or to output the second modulation signal to the coupling circuit. The adapter is capable of transmitting data and power through the same DC power line.
    Type: Application
    Filed: December 3, 2010
    Publication date: March 22, 2012
    Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventors: Tsung-Yuan TSAI, Chien-Chung Hsu
  • Publication number: 20030127114
    Abstract: A cleaning container and method for using the same for chemically cleaning elongated members including quartz thermocouple sleeves including a first body member and a second body member said first body member and second body member respectively forming a first containing space and a second containing space including a first means for reversibly compressively sealing the first body member and the second body member to a form a combined containing space for sealably holding a cleaning solution level; a cap member disposed at a distal end of the first body member said cap member including a second means for reversibly compressively sealing a first opening in communication with the first containing space; and, a second opening centrally disposed in a distal end of the second containing space said second opening including a third means for reversibly compressively sealing around at least one elongated member penetrating through said second opening.
    Type: Application
    Filed: January 9, 2002
    Publication date: July 10, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Pin Lin, Chung-Ray Chen, Chen-Mei Fan, Chien-Chung Hsu
  • Patent number: 5681301
    Abstract: A disposable absorbent article comprises an absorbent panel and a backing web secured to the panel. A preferred form of the web comprises an apertured film. The web may also include other components on the apertured film, including adhesive. The apertured film is preferably produced from a solid precursor film. The precursor film comprises a copolymer of ethylene and a comonomer polymerized using a single-site metallocene-type polymerization catalyst. The apertured film is formed from the precursor film so that the apertured film has localized deformations and apertures therein. The apertured film exhibits breathability, strength, and flexibility with an elasticity accommodating stretch or elongation and at least partial recovery.
    Type: Grant
    Filed: January 24, 1996
    Date of Patent: October 28, 1997
    Assignee: Johnson & Johnson Worldwide Absorbent Products
    Inventors: Ching-Yun Morris Yang, Mordechai Turi, William Chien-Chung Hsu