Patents by Inventor Chien-Chung Hsu
Chien-Chung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11966077Abstract: A light emission apparatus includes a laser diode configured to emit a light; a laser driver electrically coupled to the laser diode, the laser driver being configured to drive the laser diode to generate the light; and an optical module arranged to receive the light emitted by the laser diode, the optical module comprising at least one optical element and being configured to adjust the light and emits a transmitting light; wherein the transmitting light emits from the optical module with an illumination angle and the optical module adjusts the light to vary the illumination angle.Type: GrantFiled: July 8, 2019Date of Patent: April 23, 2024Assignee: Artilux, Inc.Inventors: Yun-Chung Na, Chien-Lung Chen, Chieh-Ting Lin, Yu-Yi Hsu, Hui-Wen Chen, Bo-Jiun Chen, Shih-Tai Chuang
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Publication number: 20240096929Abstract: A method of making a semiconductor device includes forming a circuit layer over a substrate. The method further includes depositing an insulator over the substrate. The method further includes patterning the insulator to define a test line trench, a first trench, and a second trench, wherein the first trench is on a portion of the substrate exposed by the circuit layer. The method further includes filling the test line trench to define a test line electrically connected to the circuit layer. The method further includes filling the first trench and the second trench to define a capacitor.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Yan-Jhih HUANG, Chun-Yuan HSU, Chien-Chung CHEN, Yung-Hsieh LIN
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Patent number: 11773028Abstract: A method of removing fluoride ion from waste liquid is provided, which includes providing a calcium source and a plurality of ceramic particles to a waste liquid containing fluoride ion for forming a plurality of calcium fluoride layers wrapping the ceramic particles. The calcium fluoride layers are connected to form a calcium fluoride bulk. The ceramic particles are embedded in the calcium fluoride bulk. The ceramic particles and the calcium fluoride bulk have a weight ratio of 1:4 to 1:20.Type: GrantFiled: September 29, 2020Date of Patent: October 3, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Sheng-Min Yu, Sheng-Yi Chiu, Chien-Chung Hsu
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Patent number: 11767271Abstract: A porous material including a composite oxide body containing calcium oxide, iron oxide, and silica, and a plurality of inter-connecting microchannel structures is provided. A preparing method of porous material is further provided. With the inter-connecting microchannel structures of the porous material and the advantages of high porosity and large specific surface area, the porous material has a bright prospect in the fields of catalysts, filters, adsorption materials, and fuel carriers.Type: GrantFiled: September 21, 2020Date of Patent: September 26, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ming-Hui Chang, Sheng-Min Yu, Hsiu-Hsia Lee, Chien-Chung Hsu
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Patent number: 11076483Abstract: A direct bonded copper ceramic substrate is provided, which includes a nitride ceramic substrate, a first passivation layer, and a first copper layer. The first passivation layer includes aluminum oxide or silicon oxide doped with another metal. The other metal is titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, or a combination thereof. The aluminum or silicon and the other metal have a weight ratio of 60:40 to 99.5:0.5. The first passivation layer is disposed between the top surface of the nitride ceramic substrate and the first copper layer.Type: GrantFiled: December 19, 2019Date of Patent: July 27, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kai-Hsiang Chuang, Chien-Chiang Hsu, Chien-Chung Hsu, Kuo-Chuang Chiu
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Publication number: 20210221746Abstract: A porous material including a composite oxide body containing calcium oxide, iron oxide, and silica, and a plurality of inter-connecting microchannel structures is provided. A preparing method of porous material is further provided. With the inter-connecting microchannel structures of the porous material and the advantages of high porosity and large specific surface area, the porous material has a bright prospect in the fields of catalysts, filters, adsorption materials, and fuel carriers.Type: ApplicationFiled: September 21, 2020Publication date: July 22, 2021Inventors: Ming-Hui Chang, Sheng-Min Yu, Hsiu-Hsia Lee, Chien-Chung Hsu
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Publication number: 20210188715Abstract: A method of removing fluoride ion from waste liquid is provided, which includes providing a calcium source and a plurality of ceramic particles to a waste liquid containing fluoride ion for forming a plurality of calcium fluoride layers wrapping the ceramic particles. The calcium fluoride layers are connected to form a calcium fluoride bulk. The ceramic particles are embedded in the calcium fluoride bulk. The ceramic particles and the calcium fluoride bulk have a weight ratio of 1:4 to 1:20.Type: ApplicationFiled: September 29, 2020Publication date: June 24, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Sheng-Min YU, Sheng-Yi CHIU, Chien-Chung HSU
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Publication number: 20210161006Abstract: A direct bonded copper ceramic substrate is provided, which includes a nitride ceramic substrate, a first passivation layer, and a first copper layer. The first passivation layer includes aluminum oxide or silicon oxide doped with another metal. The other metal is titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, or a combination thereof. The aluminum or silicon and the other metal have a weight ratio of 60:40 to 99.5:0.5. The first passivation layer is disposed between the top surface of the nitride ceramic substrate and the first copper layer.Type: ApplicationFiled: December 19, 2019Publication date: May 27, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kai-Hsiang CHUANG, Chien-Chiang HSU, Chien-Chung HSU, Kuo-Chuang CHIU
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Patent number: 10974994Abstract: A method of forming a core-shell composite material includes depositing a polysiloxane shell to wrap a ceramic core via chemical vapor deposition for forming a core-shell composite material, wherein the ceramic core is an oxide of metal and silicon, which includes 100 parts by weight of calcium, 50 to 95 parts by weight of iron, 15 to 40 parts by weight of silicon, 2 to 15 parts by weight of magnesium, 2 to 20 parts by weight of aluminum, and 2 to 10 parts by weight of manganese.Type: GrantFiled: December 19, 2019Date of Patent: April 13, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Sheng-Min Yu, Chien-Chung Hsu, Kai-Hsiang Chuang, Ming-Hui Chang
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Patent number: 9660572Abstract: An aluminum frame structure for packaging solar panel, comprising: a vertical support member; an U-shaped member, coupled to the vertical support member while allowing the opening of the U-shaped member to face toward a level direction; and at least one protruding member, disposed inside the U-shaped member, each having at least one protrusion arranged at the opening of the U-shaped member and at a position neighboring to the vertical support member while allowing the gap between the highest point of the at least one protrusion and an imaginary line representing the contact slope to be formed larger than the thickness of the back film, and also enabling the contact area of the at least one protrusion and the contact slope to be at least larger than 50% of the area of the contact slope.Type: GrantFiled: August 4, 2014Date of Patent: May 23, 2017Assignee: ETERBRIGHT SOLAR CORPORATIONInventor: Chien-Chung Hsu
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Patent number: 9153747Abstract: A light-emitting element includes a light-emitting stack which has an active layer, and a non-oxide insulative layer below the light-emitting stack, wherein a refractive index of the non-oxide insulative layer is less than 1.4.Type: GrantFiled: June 11, 2014Date of Patent: October 6, 2015Assignee: EPISTAR CORPORATIONInventors: Wen-Luh Liao, Chien-Chung Hsu, Yao-Ru Chang, Shih-I Chen, Chia-Liang Hsu
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Publication number: 20150090678Abstract: An aluminum frame structure for packaging solar panel, comprising: a vertical support member; an U-shaped member, coupled to the vertical support member while allowing the opening of the U-shaped member to face toward a level direction; and at least one protruding member, disposed inside the U-shaped member, each having at least one protrusion arranged at the opening of the U-shaped member and at a position neighboring to the vertical support member while allowing the gap between the highest point of the at least one protrusion and an imaginary line representing the contact slope to be formed larger than the thickness of the back film, and also enabling the contact area of the at least one protrusion and the contact slope to be at least larger than 50% of the area of the contact slope.Type: ApplicationFiled: August 4, 2014Publication date: April 2, 2015Inventor: CHIEN-CHUNG HSU
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Publication number: 20150014721Abstract: A light-emitting element includes a light-emitting stack which has an active layer, and a non-oxide insulative layer below the light-emitting stack, wherein a refractive index of the non-oxide insulative layer is less than 1.4.Type: ApplicationFiled: June 11, 2014Publication date: January 15, 2015Inventors: Wen-Luh LIAO, Chien-Chung HSU, Yao-Ru CHANG, Shih-I CHEN, Chia-Liang HSU
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Patent number: 8610317Abstract: A communication circuit and an adapter having the same are provided. The communication circuit includes a coupling circuit and a transceiver module. The coupling circuit is coupled to a DC power line of the adapter to filter a first modulation signal carried on the DC power line or to couple a second modulation signal to the DC power line. The transceiver module is used to receive and demodulate the first modulation signal from the coupling circuit or to output the second modulation signal to the coupling circuit. The adapter is capable of transmitting data and power through the same DC power line.Type: GrantFiled: December 3, 2010Date of Patent: December 17, 2013Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventors: Tsung-Yuan Tsai, Chien-Chung Hsu
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Publication number: 20120147565Abstract: A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal conductivity is disclosed. The body has opposite inner surfaces and outer surfaces. The heat conducting member is embedded inside the body and is completely surrounded between the inner surfaces and the outer surfaces. When the electronic device generates heat, the heat is firstly transferred to the heat conducting member from the inner surfaces, and then rapidly and evenly spreads over the heat conducting member. Finally, the heat inside the heat conducting member is uniformly dissipated through the outer surfaces. Accordingly, the heat dissipation and temperature-homogenizing structure may effectively and evenly spread the heat over the outer surfaces for exchanging heat with the ambient.Type: ApplicationFiled: December 6, 2011Publication date: June 14, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GZ) CO., LTD.Inventors: Ya-Tung I, Wen-Chi Chen, Chien-Chung Hsu, Yi-Jen Lu, Pao-Hsiu Fan
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Publication number: 20120069874Abstract: A communication circuit and an adapter having the same are provided. The communication circuit includes a coupling circuit and a transceiver module. The coupling circuit is coupled to a DC power line of the adapter to filter a first modulation signal carried on the DC power line or to couple a second modulation signal to the DC power line. The transceiver module is used to receive and demodulate the first modulation signal from the coupling circuit or to output the second modulation signal to the coupling circuit. The adapter is capable of transmitting data and power through the same DC power line.Type: ApplicationFiled: December 3, 2010Publication date: March 22, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: Tsung-Yuan TSAI, Chien-Chung Hsu
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Publication number: 20030127114Abstract: A cleaning container and method for using the same for chemically cleaning elongated members including quartz thermocouple sleeves including a first body member and a second body member said first body member and second body member respectively forming a first containing space and a second containing space including a first means for reversibly compressively sealing the first body member and the second body member to a form a combined containing space for sealably holding a cleaning solution level; a cap member disposed at a distal end of the first body member said cap member including a second means for reversibly compressively sealing a first opening in communication with the first containing space; and, a second opening centrally disposed in a distal end of the second containing space said second opening including a third means for reversibly compressively sealing around at least one elongated member penetrating through said second opening.Type: ApplicationFiled: January 9, 2002Publication date: July 10, 2003Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yung-Pin Lin, Chung-Ray Chen, Chen-Mei Fan, Chien-Chung Hsu
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Patent number: 5681301Abstract: A disposable absorbent article comprises an absorbent panel and a backing web secured to the panel. A preferred form of the web comprises an apertured film. The web may also include other components on the apertured film, including adhesive. The apertured film is preferably produced from a solid precursor film. The precursor film comprises a copolymer of ethylene and a comonomer polymerized using a single-site metallocene-type polymerization catalyst. The apertured film is formed from the precursor film so that the apertured film has localized deformations and apertures therein. The apertured film exhibits breathability, strength, and flexibility with an elasticity accommodating stretch or elongation and at least partial recovery.Type: GrantFiled: January 24, 1996Date of Patent: October 28, 1997Assignee: Johnson & Johnson Worldwide Absorbent ProductsInventors: Ching-Yun Morris Yang, Mordechai Turi, William Chien-Chung Hsu