Abstract: The present disclosure relates to an integrated circuit (IC) that includes a boundary region defined between a low voltage region and a high voltage region, and a method of formation. In some embodiments, the integrated circuit comprises an isolation structure disposed in the boundary region of the substrate. A first polysilicon component is disposed directly on an upper surface of the substrate alongside the isolation structure. A boundary dielectric layer is disposed on the isolation structure. A second polysilicon component is disposed on the sacrifice dielectric layer.

Abstract: A fingerprint recognition apparatus with dynamically adjustable power levels of light-emitting modules is introduced, including: a touch detecting module detecting a touch coordinate and a touch area of a finger on a panel; a plurality of light-emitting modules emitting light to the finger on the panel; a processing module coupling to the touch detecting module and the plurality of light-emitting modules and outputting a setting value according to the touch coordinate, the touch area and positions of the plurality of light-emitting modules; a light-emitting power adjusting module adjusting power levels of the plurality of light-emitting modules according to the setting value; and an image outputting module outputting the fingerprint according to the fingerprint image.

Abstract: A fingerprint identification device and method are provided. The fingerprint identification device includes a touch-sensing panel, a fingerprint sensor, and a processing circuit. The fingerprint sensing area of the fingerprint sensor is located in the touch-sensing area of the touch-sensing panel. The processing circuit senses the touch area of an object in the touch-sensing area via the touch-sensing panel when the object contacts the touch-sensing area of the touch-sensing panel. The processing circuit senses the fingerprint of the object via the fingerprint sensor to obtain a fingerprint template. The processing circuit determines the finger attribute of the object based on the physical characteristics of the touch area. The processing circuit selects the registered template related to the finger attribute from a plurality of registered templates according to the finger attribute, so as to perform fingerprint matching on the fingerprint template.

Abstract: A fingerprint identification device and method are provided. The fingerprint identification device includes a touch-sensing panel, a fingerprint sensor, and a processing circuit. The fingerprint sensing area of the fingerprint sensor is located in the touch-sensing area of the touch-sensing panel. The processing circuit senses the touch area of an object in the touch-sensing area via the touch-sensing panel when the object contacts the touch-sensing area of the touch-sensing panel. The processing circuit senses the fingerprint of the object via the fingerprint sensor to obtain a fingerprint template. The processing circuit determines the finger attribute of the object based on the physical characteristics of the touch area. The processing circuit selects the registered template related to the finger attribute from a plurality of registered templates according to the finger attribute, so as to perform fingerprint matching on the fingerprint template.

Abstract: A panel fabricating method is provided. A first substrate having at least two first units arranged along a first direction is provided, wherein each first unit has a first display region and a terminal region sequentially arranged along the first direction. A second substrate having at least two second units arranged along the first direction is provided, wherein each second unit has a second display region and a removal region sequentially arranged along the first direction. The first substrate and the second substrate are stacked so that each first display region is opposite to each second display region and each terminal region is opposite to each removal region, so as to form a plurality of panels. The second substrate is cut in a discontinuous manner along the first direction to form at least one first discontinuous cut portion, wherein the first discontinuous cut portion is partially overlapped with the removal region.

Abstract: Amounting apparatus used to fasten a PCB (10) with through holes (12) includes a supporting board (20) and a plurality of clips (30) mounted on the PCB. The supporting board has a plurality of standoffs (22) corresponding to the through holes of the PCB. Each of the clips includes a resilient portion (34) and defines a mounting opening (35) for having the standoffs sliding therein. When the standoffs press on the resilient portions of the clips, the PCB is clamped on the supporting board.

Abstract: An adjusting assembly for adjustably connecting a monitor (50) to a base (60), includes a first rotate assembly (10) connected with the base, a second rotate assembly (20) connected with the monitor, a support arm (30) connected with the first rotate assembly and the second rotate assembly, and a pair of transmission straps (80). The transmission straps alter the rotation of the first rotate assembly in one direction to the rotation of the second assembly in an opposite direction. The first rotate assembly generates a first torsional moment. The monitor generates a first gravity moment opposite to the first torsional moment. When the monitor rotates relative to the support arm, the first rotate assembly generates a second torsional moment to counteract a second gravity moment of the monitor relative to the support arm.

Abstract: A monitor adjusting apparatus include a monitor (10), a base (20) and an adjusting device (30). The adjusting device includes a first pivot assembly (40) connected with the monitor, a second pivot assembly (50) connected with the base, and a connecting assembly (70) mounted between the first pivot assembly and the second pivot assembly. The first pivot assembly generates a friction moment. The monitor generates a first gravity moment opposite to the friction moment. The second pivot assembly generates a twist moment. The monitor and the connecting assembly generate a second gravity moment opposite to the twist moment. The monitor stays at any obliquity under a balance of the friction moment and the first gravity moment, and stays at any height under a balance of the twist moment and the second gravity moment.

Abstract: A fixing apparatus is for fixing a motherboard (60) in a chassis (20). The chassis includes a supporting board (30). The supporting plate includes a number of clips (36, 38), and a screw hole (391). The motherboard (60) defines a number of through holes (62) corresponding to a number of standoff (40) disposed on the supporting plate, a number of apertures (64), and a fixing hole (66). The through holes each include a circular hole (622), and a slot (624). The standoffs each comprise a head (42), a neck (44), and a base (46). The clips each include a shoulder (367, 387), and a catch (366, 386). The standoffs and the clips engage the through hole and the apertures of the supporting plate to attach the motherboard in the chassis. A stud extends through the fixing hole and engages the screw hole to secure the motherboard in the chassis.

Abstract: Amounting apparatus used to fasten a PCB (10) with through holes (12) includes a supporting board (20) and a plurality of clips (30) mounted on the PCB. The supporting board has a plurality of standoffs (22) corresponding to the through holes of the PCB. Each of the clips includes a resilient portion (34) and defines a mounting opening (35) for having the standoffs sliding therein. When the standoffs press on the resilient portions of the clips, the PCB is clamped on the supporting board.

Abstract: A fixing apparatus is for fixing a motherboard (60) in a chassis (20). The chassis includes a supporting board (30). The supporting plate includes a number of clips (36, 38), and a screw hole (391). The motherboard (60) defines a number of through holes (62) corresponding to a number of standoff (40) disposed on the supporting plate, a number of apertures (64), and a fixing hole (66). The through holes each include a circular hole (622), and a slot (624). The standoffs each comprise a head (42), a neck (44), and a base (46). The clips each include a shoulder (367, 387), and a catch (366, 386). The standoffs and the clips engage the through hole and the apertures of the supporting plate to attach the motherboard in the chassis. A stud extends through the fixing hole and engages the screw hole to secure the motherboard in the chassis.