Patents by Inventor Chien Fang

Chien Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12382478
    Abstract: A capability allocation method employed by a wireless fidelity (Wi-Fi) device includes: during association between the Wi-Fi device and another Wi-Fi device, setting up a first capability allocation of a first non-AP station (STA); and after the first non-AP STA associates with a first AP, changing the first capability allocation of the first non-AP STA in the absence of re-association. Each of the Wi-Fi device and the another Wi-Fi device includes a plurality of stations. The first AP is affiliated to the another Wi-Fi device. The first non-AP STA is affiliated to the Wi-Fi device.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: August 5, 2025
    Assignee: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Shen-Po Lin, Yongho Seok
  • Publication number: 20250211993
    Abstract: Techniques pertaining to protecting integrity of medium access control (MAC) header and data with relaxed receiver requirement in wireless communications are described. An apparatus (e.g., a station (STA)) transmits one or more MAC protocol data units (MPDUs). The apparatus then receives a protected acknowledgement. The apparatus detects a man in the middle (MITM) attack based on a time synchronization function (TSF) or signature in the protected acknowledgement.
    Type: Application
    Filed: December 17, 2024
    Publication date: June 26, 2025
    Inventors: Li-Hsiang Sun, Gabor Bajko, Chien-Fang Hsu, James Chih-Shi Yee, Yonggang Fang, Kai Ying Lu
  • Publication number: 20250199059
    Abstract: An exemplary work press assembly for a test handler includes a presser and a guide frame. The presser is configured to secure a device under test (DUT) and press the DUT into a socket for testing. The guide frame is configured to receive guide pins of the socket. The presser extends through an opening of the guide frame, and the guide frame is sandwiched between a first presser portion and a second presser portion. The presser is formed of a first material having a first coefficient of thermal expansion (CTE), and the guide frame is formed from a second material having a second CTE that is less than the first CTE. In some embodiments, a thermal insulation layer(s) separates the presser from the guide frame. In some embodiments, a spacing between sidewalls of the presser and sidewalls of the guide frame is configured to accommodate thermal expansion of the presser.
    Type: Application
    Filed: March 3, 2025
    Publication date: June 19, 2025
    Inventors: Yi-Neng Chang, Ting-Yu Chiu, Chien Fang Huang, Shin-Han You
  • Publication number: 20250201607
    Abstract: A package shuttle includes a lower shuttle assembly including a first lower shuttle structural element, an array of conductive plates located over the first lower shuttle structural element, and at least one second lower shuttle structural element including an array of shuttle openings therethrough. The array of shuttle openings overlies the array of conductive plates and is configured to accommodate an array of semiconductor packages therein. The package shuttle may further include an upper shuttle assembly including an carrier substrate and an array of package clamps attached to a bottom surface of the carrier substrate. The array of package clamps is configured to mate with the lower shuttle assembly such that the lower shuttle assembly is secure against lateral movement relative to the upper shuttle assembly upon mating of the lower shuttle assembly with the upper shuttle assembly.
    Type: Application
    Filed: January 2, 2024
    Publication date: June 19, 2025
    Inventors: Shin-Han You, Ting-Yu Chiu, Yi-Neng Chang, Chien Fang Huang
  • Publication number: 20250191945
    Abstract: A transport case is configured to hold a plurality of wafers for transport of the wafers. The transport case includes a plurality of slots each configured to receive and hold a respective wafer. The transport case includes a sensor system configured to measure the positions or orientations of wafers within the slots or during loading into the slots. The transport case includes a communication system configured to transmit sensor data from the sensor system to an external control system.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 12, 2025
    Inventors: Chung-Hsien LIAO, Chia-Yu TANG, Jui-Mu CHO, Chien-Fang LIN
  • Publication number: 20250133396
    Abstract: A first access point (AP) in a multiple access points (MAP) system of a wireless network is provided. The MAP system further includes a second AP. The first AP includes a transceiver and a control circuit. The transceiver transmits and receives frames over the wireless network. The control circuit transmits a protected frame to a non-AP station associated to the second AP, and receives a response frame in response to the protected frame from the non-AP station.
    Type: Application
    Filed: October 16, 2024
    Publication date: April 24, 2025
    Inventors: Chien-Fang HSU, Hao-Hua KANG, Chih-Chun KUO
  • Patent number: 12284552
    Abstract: A method of traffic flow management with stream classification service (SCS) and associated apparatus are provided, where the wireless communications system may include a first device and a second device. The method may include: carrying and sending a first descriptor element in a first request frame, requesting for a SCS stream from the first device, wherein the first descriptor element is related to the SCS, wherein the first request frame includes a first indication, indicating whether the second device agrees that the SCS stream and any other stream from the first device to the second device share a same traffic identifier (TID).
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: April 22, 2025
    Assignee: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Gabor Bajko
  • Publication number: 20250102568
    Abstract: A test system and method of testing are provided. In some embodiments, a system for testing an integrated circuit package includes a device tester. The device tester includes a socket, a cylinder head unit engageable with the socket, and a pressure regulator. The socket includes a first pressure cylinder configured to engage a first region of the integrated circuit package and a second pressure cylinder configured to engage a second region of the integrated circuit package. The pressure regulator is configured to provide at gas at a first pressure to the first pressure cylinder and to provide the gas at a second pressure different than the first pressure to the second pressure cylinder.
    Type: Application
    Filed: September 25, 2023
    Publication date: March 27, 2025
    Inventors: Ting-Yu CHIU, Yi-Neng Chang, Shin-Han You, Chien Fang Huang
  • Patent number: 12262431
    Abstract: During association between an access point (AP) multi-link device (MLD) and a non-AP MLD, the non-AP MLD indicates a first capability allocation of a first combination of affiliated stations for a first combination of enabled links on the non-AP MLD, and indicates a second capability allocation of a second combination of affiliated stations for a second combination of enabled links on the non-AP MLD. For example, the first combination of affiliated stations and the second combination of affiliated stations have different numbers of stations in the non-AP MLD, and the first combination of enabled links and the second combination of enabled links have different numbers of enabled links. Hence, during the association between the non-AP MLD and the AP MLD, capabilities of different non-AP station combinations corresponding to different enabled link combinations supported by the non-AP MLD are signaled to the AP MLD.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: March 25, 2025
    Assignee: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Yongho Seok, James Chih-Shi Yee
  • Patent number: 12245334
    Abstract: A physical protocol data unit (PPDU) transmission method includes: setting parameters of each of a plurality of links for enabling the plurality of links to have different capacity for PPDU transmission, wherein parameters of one link are different from parameters of another link, and highest capacity supported by the one link is higher than highest capacity supported by the another link; aligning an ending time instant of transmission of a first PPDU transmitted via the one link with an ending time instant of transmission of a second PPDU transmitted via the another link through setting a content that is carried by the first PPDU transmitted via the one link; and transmitting PPDUs via the plurality of links, wherein one PPDU is transmitted via each of the plurality of links, and the PPDUs include the first PPDU and the second PPDU.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: March 4, 2025
    Assignee: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Yongho Seok, James Chih-Shi Yee
  • Patent number: 12241929
    Abstract: An exemplary work press assembly for a test handler includes a presser and a guide frame. The presser is configured to secure a device under test (DUT) and press the DUT into a socket for testing. The guide frame is configured to receive guide pins of the socket. The presser extends through an opening of the guide frame, and the guide frame is sandwiched between a first presser portion and a second presser portion. The presser is formed of a first material having a first coefficient of thermal expansion (CTE), and the guide frame is formed from a second material having a second CTE that is less than the first CTE. In some embodiments, a thermal insulation layer(s) separates the presser from the guide frame. In some embodiments, a spacing between sidewalls of the presser and sidewalls of the guide frame is configured to accommodate thermal expansion of the presser.
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: March 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Neng Chang, Ting-Yu Chiu, Chien Fang Huang, Shin-Han You
  • Publication number: 20250043420
    Abstract: The thin film deposition system includes: a deposition chamber, a precursor source container containing a precursor source; and a precursor conduit. The precursor conduit is elongated and extends between a proximate end and a distal end, and the proximate end is coupled to an outlet of the precursor source container, and the distal end is coupled to an inlet of the deposition chamber.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 6, 2025
    Inventors: Chung Hsien Liao, Jui-Mu Cho, Chien-Fang Lin
  • Publication number: 20250048452
    Abstract: Various schemes pertaining to coordinated time-division multiple-access (C-TDMA) protocols, transmission opportunity (TXOP) sharing modes for time allocation, and exchange of parameters in multi-access point (multi-AP) systems are described. An apparatus (e.g., a sharing access point (AP)) acquires a TXOP. The apparatus also triggers one or more shared APs to participate in C-TDMA communications with respectively associated stations (STAs) within the TXOP.
    Type: Application
    Filed: July 30, 2024
    Publication date: February 6, 2025
    Inventors: Samat Shabdanov, Po-Chun Fang, Cheng-Chien Su, James Chih-Shi Yee, Chien-Fang Hsu, You-Wei Chen, Chung-Ta Ku, Weisung Tsao, Po-Yuen Cheng
  • Publication number: 20250046633
    Abstract: A semiconductor processing system is provided. The semiconductor processing system includes a first chamber arranged to perform a first semiconductor process; a second chamber arranged to perform a second semiconductor process; a cooling chamber having a pedestal; and a plurality of non-contact temperature sensors mounted in the cooling chamber, and arranged to measure a temperature of a wafer disposed on the pedestal. In one aspect, the first chamber is arranged to transfer the wafer to the cooling chamber upon completion of the first semiconductor process in the first chamber. In another aspect, the cooling chamber is arranged to measure the temperature of the wafer in the cooling chamber and arranged to transfer the wafer to the second chamber when the temperature of wafer is at a target temperature, or pause processing of the wafer when the temperature of the wafer is not at the target temperature.
    Type: Application
    Filed: August 1, 2023
    Publication date: February 6, 2025
    Inventors: Chung Hsien Liao, Po Wen Yang, Jui-Mu Cho, Chien-Fang Lin
  • Patent number: 12177713
    Abstract: A traffic indication signaling method includes: setting a control information subfield in an aggregated control (A-Control) subfield by traffic indication information, wherein the traffic indication information contains timing information of uplink (UL) traffic; and transmitting a frame that includes the A-Control subfield to an access point (AP). For example, the UL traffic is required by a latency sensitive traffic application.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: December 24, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Kai Ying Lu, Yongho Seok, James Chih-Shi Yee
  • Publication number: 20240369620
    Abstract: A method includes: positioning a wafer in a first probe chamber of a first probe apparatus by a robot arm, the first probe apparatus being adjacent a transfer rail, the robot arm, in operation, moving along the transfer rail; testing the wafer by the first probe apparatus; following the testing, transferring the wafer to an environmental buffer attached to the first probe chamber; cooling the wafer in the environmental buffer; and following the cooling, transferring the wafer from the environmental buffer to a second probe chamber of a second probe apparatus by the robot arm, the second probe apparatus being adjacent the transfer rail and offset from the first probe apparatus.
    Type: Application
    Filed: November 9, 2023
    Publication date: November 7, 2024
    Inventors: Jyu-Hua HSIAO, Chin-Yu LIN, Chien Fang HUANG, Kam Heng LEE, Jiun-Rong PAI
  • Publication number: 20240353477
    Abstract: An exemplary work press assembly for a test handler includes a presser and a guide frame. The presser is configured to secure a device under test (DUT) and press the DUT into a socket for testing. The guide frame is configured to receive guide pins of the socket. The presser extends through an opening of the guide frame, and the guide frame is sandwiched between a first presser portion and a second presser portion. The presser is formed of a first material having a first coefficient of thermal expansion (CTE), and the guide frame is formed from a second material having a second CTE that is less than the first CTE. In some embodiments, a thermal insulation layer(s) separates the presser from the guide frame. In some embodiments, a spacing between sidewalls of the presser and sidewalls of the guide frame is configured to accommodate thermal expansion of the presser.
    Type: Application
    Filed: April 21, 2023
    Publication date: October 24, 2024
    Inventors: Yi-Neng Chang, Ting-Yu Chiu, Chien Fang Huang, Shin-Han You
  • Publication number: 20240357688
    Abstract: A method for performing operation mode transition control in a wireless communication system and associated apparatus are provided, where a non-access-point multi-link device (non-AP MLD) is wirelessly linking to a first access point multi-link device (AP MLD). The method includes: transmitting, by the non-AP MLD, a first operation mode notification in a first management frame to the first AP MLD, for a first target operation mode to which the non-AP MLD is going to transit, carrying at least information regarding the first target operation mode, wherein the information is carried in at least one subfield of the first operation mode notification; and transiting, by the non-AP MLD, to the first target operation mode without transmitting additional management information regarding the first target operation mode to the first AP MLD.
    Type: Application
    Filed: April 16, 2024
    Publication date: October 24, 2024
    Applicant: MEDIATEK INC.
    Inventors: I-Cheng Tsai, Chien-Fang Hsu
  • Publication number: 20240340133
    Abstract: A beacon transmission method includes: generating a first beacon frame, and using a first group of tones to send a first physical layer protocol data unit (PPDU) that carries the first beacon frame of a first access point (AP) being one of APs in a multi-AP (MAP) system. A transmission period of the first PPDU overlaps a transmission period of a second PPDU that carries a second beacon frame of a second AP being another of the APs in the MAP system. The first group of tones used by transmission of the first PPDU includes one or more tones that are not included in a second group of tones used by transmission of the second PPDU.
    Type: Application
    Filed: April 9, 2024
    Publication date: October 10, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Hung-Tao Hsieh
  • Publication number: 20240314674
    Abstract: A wireless communication method employed by an access point (AP) includes: negotiating with another AP for setting up a coordinated service period (SP), and sending a first announcement frame inside a first basic service set (BSS) to inform that the coordinated SP has been created. The step of negotiating with the another AP for setting up the coordinated SP includes: receiving a request frame from the another AP, wherein the request frame includes a plurality of SP parameters; and sending a response frame to the another AP. The AP belongs to the first BSS, and the another AP belongs to a second BSS different from the first BSS.
    Type: Application
    Filed: May 31, 2024
    Publication date: September 19, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Chao-Chun Wang, James Chih-Shi Yee