Patents by Inventor Chien-Fang Lin
Chien-Fang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240151743Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).Type: ApplicationFiled: February 7, 2023Publication date: May 9, 2024Inventors: Ting-Yu CHIU, Yi-Neng CHANG, Wen-Chun TU, Te-Kun LIN, Chien Fang HUANG
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Publication number: 20240075514Abstract: A rotary cable arranging tool is disclosed. The rotary cable arranging tool is used for untwisting a first and a second cable. The rotary cable arranging tool includes a first annular structure, a first and a second assembly member, and a first and a second hole. The first and the second holes are assembled by the cooperation of the first and the second assemblies so as to be pressed to change a width of an inner diameter. When the first and second cables are in a twisted state, the first and second assemblies are counter-rotated together, so that the first and the second cables are untwisted and enter the first and second holes respectively. Then the first and second holes are tightly combined with the first and second cables, and the first and the second cable are pulled out to be straightened.Type: ApplicationFiled: February 3, 2023Publication date: March 7, 2024Inventors: Chien-Chou Liao, Mei-Fang Lin
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Patent number: 11854769Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.Type: GrantFiled: June 6, 2022Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yung-Shun Hsu, Ching-Yu Chang, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin
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Patent number: 11670490Abstract: The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.Type: GrantFiled: January 8, 2018Date of Patent: June 6, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yung-Shun Hsu, Ching-Yu Chang, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin
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Publication number: 20220301822Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.Type: ApplicationFiled: June 6, 2022Publication date: September 22, 2022Inventors: Yung-Shun HSU, Ching-Yu CHANG, Chiao-Kai CHANG, Wai Hong CHEAH, Chien-Fang LIN
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Patent number: 11361943Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.Type: GrantFiled: October 16, 2020Date of Patent: June 14, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yung-Shun Hsu, Ching-Yu Chang, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin
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Patent number: 11355318Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.Type: GrantFiled: October 16, 2020Date of Patent: June 7, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yung-Shun Hsu, Ching-Yu Chang, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin
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Patent number: 11043388Abstract: The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.Type: GrantFiled: December 26, 2019Date of Patent: June 22, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yung-Shun Hsu, Ching-Yu Chang, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin
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Publication number: 20210043423Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.Type: ApplicationFiled: October 16, 2020Publication date: February 11, 2021Inventors: Yung-Shun HSU, Ching-Yu CHANG, Chiao-Kai CHANG, Wai Hong CHEAH, Chien-Fang LIN
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Publication number: 20210035777Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.Type: ApplicationFiled: October 16, 2020Publication date: February 4, 2021Inventors: Yung-Shun HSU, Ching-Yu CHANG, Chiao-Kai CHANG, Wai Hong CHEAH, Chien-Fang LIN
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Patent number: 10840066Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.Type: GrantFiled: June 13, 2018Date of Patent: November 17, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yung-Shun Hsu, Ching-Yu Chang, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin
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Publication number: 20200135510Abstract: The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.Type: ApplicationFiled: December 26, 2019Publication date: April 30, 2020Inventors: Yung-Shun Hsu, Ching-Yu Chang, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin
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Publication number: 20190385816Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.Type: ApplicationFiled: June 13, 2018Publication date: December 19, 2019Inventors: Yung-Shun Hsu, Ching-Yu Chang, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin
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Patent number: 10365672Abstract: A system includes a cooling device, a memory, and a processor. The cooling device is configured to detect a temperature of a wafer and to provide air to the wafer. The memory is configured to store computer program codes. The processor is configured to execute the computer program codes in the memory to: determine whether the temperature of the wafer meet a predetermined requirement; adjust the temperature of the wafer on condition that the temperature does not meet the predetermined requirement; and control the cooling device to detect the temperature of the wafer again, in order to verify whether an adjusted temperature of the wafer meet predetermined requirement.Type: GrantFiled: February 16, 2017Date of Patent: July 30, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shu-Han Chen, Sheng-Hung Lin, Han-Hsuan Hsu, Chien-Fang Lin
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Publication number: 20190103295Abstract: The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.Type: ApplicationFiled: January 8, 2018Publication date: April 4, 2019Inventors: Yung-Shun Hsu, Ching-Yu Chang, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin
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Publication number: 20180166309Abstract: A system includes a cooling device, a memory, and a processor. The cooling device is configured to detect a temperature of a wafer and to provide air to the wafer. The memory is configured to store computer program codes. The processor is configured to execute the computer program codes in the memory to: determine whether the temperature of the wafer meet a predetermined requirement; adjust the temperature of the wafer on condition that the temperature does not meet the predetermined requirement; and control the cooling device to detect the temperature of the wafer again, in order to verify whether an adjusted temperature of the wafer meet predetermined requirement.Type: ApplicationFiled: February 16, 2017Publication date: June 14, 2018Inventors: Shu-Han Chen, Sheng-Hung Lin, Han-Hsuan Hsu, Chien-Fang Lin
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Patent number: 7635417Abstract: A semiconductor apparatus for processing a wafer comprises a stage, a fluid supply unit, and a cleaning unit. The stage supports the wafer. The fluid supply unit provides a first fluid, wherein the fluid supply unit is moveable between a second position and a first position. The cleaning unit provides a second fluid, wherein when the fluid supply unit is in the first position, the fluid supply unit provides the first fluid toward the wafer, and when the fluid supply unit is in the second position, the cleaning unit blows the second fluid toward a surface of the fluid supply unit to clean the surface thereof.Type: GrantFiled: May 5, 2006Date of Patent: December 22, 2009Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.Inventors: Chien-Fang Lin, Jen-Chih Lu
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Patent number: 7313262Abstract: An apparatus and method for visualization of process conditions in a process chamber or chambers, particularly during the fabrication of integrated circuits on substrates in the process chambers. The apparatus includes an inspection chamber which is installed adjacent to a process chamber. A camera provided in the inspection chamber is used to view the interior of the process chamber as the etching, chemical vapor deposition or other process is carried out in the process chamber. A video monitor is typically connected to the camera for viewing images from the camera. In the event that a defect-precipitating event occurs in the process chamber, such as a mechanical malfunction or accumulation of excessive levels of polymer deposition on the chamber walls, the event is displayed on the monitor in real-time.Type: GrantFiled: August 6, 2003Date of Patent: December 25, 2007Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chien-Fang Lin, Chung-Yuan Lin
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Publication number: 20070256633Abstract: A semiconductor apparatus for processing a wafer comprises a stage, a fluid supply unit, and a cleaning unit. The stage supports the wafer. The fluid supply unit provides a first fluid, wherein the fluid supply unit is moveable between a second position and a first position. The cleaning unit provides a second fluid, wherein when the fluid supply unit is in the first position, the fluid supply unit provides the first fluid toward the wafer, and when the fluid supply unit is in the second position, the cleaning unit blows the second fluid toward a surface of the fluid supply unit to clean the surface thereof.Type: ApplicationFiled: May 5, 2006Publication date: November 8, 2007Inventors: Chien-Fang Lin, Jen-Chih Lu
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Publication number: 20050031187Abstract: An apparatus and method for visualization of process conditions in a process chamber or chambers, particularly during the fabrication of integrated circuits on substrates in the process chambers. The apparatus includes an inspection chamber which is installed adjacent to a process chamber. A camera provided in the inspection chamber is used to view the interior of the process chamber as the etching, chemical vapor deposition or other process is carried out in the process chamber. A video monitor is typically connected to the camera for viewing images from the camera. In the event that a defect-precipitating event occurs in the process chamber, such as a mechanical malfunction or accumulation of excessive levels of polymer deposition on the chamber walls, the event is displayed on the monitor in real-time.Type: ApplicationFiled: August 6, 2003Publication date: February 10, 2005Inventors: Chien-Fang Lin, Chung-Yuan Lin