Abstract: An apparatus is provided. The apparatus includes a wafer storage device having an inlet through which a gas flows into a wafer storage chamber of the wafer storage device. A first portion of the gas exits the wafer storage chamber of the wafer storage device through an outlet of the wafer storage device. A second portion of the gas exits the wafer storage chamber of the wafer storage device through one or more discontinuities of the wafer storage device to a space external to the wafer storage device. The apparatus includes an exhaust device arranged relative to the wafer storage device to conduct a measure of the second portion of the gas away from the space.

Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes a magnetic tunneling junction (MTJ) and a spin Hall electrode (SHE). The MTJ includes a free layer, a reference layer and a barrier layer lying between the free layer and the reference layer. The SHE is in contact with the MTJ, and configured to convert a charge current to a spin current for programming the MTJ. The SHE is formed of an alloy comprising at least one heavy metal element and at least one light transition metal element. The heavy metal element is selected from metal elements with one or more valence electrons filling in 5d orbitals, and the light transition metal element is selected from transition metal elements with one or more valence electrons partially filling in 3d orbitals.

Abstract: Semiconductor structures and methods of forming the same are provided. An exemplary semiconductor structure includes a substrate, a dielectric layer over the substrate, memory cells disposed in the dielectric layer, and a metal line above the memory cells. Each of the memory cells includes, from bottom to top, a bottom electrode, a memory material layer stack, and a top electrode. A bottom surface of the metal line has a continuously flat portion that directly interfaces each of the top electrodes of the memory cells.

Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes a magnetic tunneling junction (MTJ) and a spin Hall electrode (SHE). The MTJ includes a free layer, a reference layer and a barrier layer lying between the free layer and the reference layer. The SHE is in contact with the MTJ, and configured to convert a charge current to a spin current for programming the MTJ. The SHE is formed of an alloy comprising at least one heavy metal element and at least one light transition metal element. The heavy metal element is selected from metal elements with one or more valence electrons filling in 5 d orbitals, and the light transition metal element is selected from transition metal elements with one or more valence electrons partially filling in 3 d orbitals.

Abstract: A three-dimensional integrated structure and the manufacturing method(s) thereof are described. The three-dimensional integrated structure includes a substrate having conductive features therein, and a component array disposed over the substrate and on the conductive features. The component array includes a metallic material layer and capacitor structures separated by the metallic material layer. Each of the capacitor structures includes a first metallic pillar, a first dielectric sheath surrounding the first metallic pillar, a second metallic sheath surrounding the first dielectric sheath, and a second dielectric sleeve surrounding the second metallic sheath. The metallic material layer laterally encapsulates the capacitor structures.

Abstract: A disclosed method of manufacturing a capacitor structure includes forming an alternating dielectric stack comprising first dielectric layers and second dielectric layers on a substrate and forming a trench through the alternating stack of first dielectric layers and second dielectric layers. The disclosed method includes etching the first dielectric layers from the trench to form notches between the second dielectric layers and forming a bottom electrode layer covering the first dielectric layers and the second dielectric layers. The disclosed method includes forming a third dielectric layer over the bottom electrode layer and forming a top electrode layer over the third dielectric layer.

Abstract: A fan management system includes a fan and a server. The fan includes a driving circuit, and the driving circuit is configured for driving the fan. The fan operates in an operation mode. The server is connected to the fan and is configured for controlling the operation of the fan. The driving circuit outputs a digital label signal when the fan operates abnormally, and the server obtains a production history, an operation information and a warning message of the fan through the digital label signal. The server adjusts the operation mode of the fan according to the warning message simultaneously.

Abstract: A power device includes: a semiconductor layer, a well region, a body region, a gate, a sub-gate, a source, a drain, and an electric field adjustment region. The sub-gate is formed above a top surface of the semiconductor layer, wherein a portion of the well region is located vertically beneath the sub-gate. The sub-gate is not directly connected to the gate. The electric field adjustment region has a conductivity type which is opposite to that of the well region. The electric field adjustment region is formed beneath and not in contact with the top surface of the semiconductor layer. The electric field adjustment region is located in the well region of the semiconductor layer, and at least a portion of the electric field adjustment region is located vertically beneath the sub-gate.

Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first substrate and through vias formed through the first substrate. The package further includes redistribution layers formed over the first substrate and connected to the through vias and a first pillar layer formed over the redistribution layers. The package further includes a first barrier layer formed over the first pillar layer and a first cap layer formed over the first barrier layer. The package further includes an underfill layer formed over the redistribution layers and surrounding the first pillar layer, the first barrier layer, and the first cap layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first sidewall surface of the first pillar layer and a second sidewall surface of the first cap layer.

Abstract: A server includes a first server unit, a second server unit, a hinge and a connecting element. The second server unit is disposed on the first server unit and is electrically connected to the first server unit. The second server unit is pivoted to the first server unit through the hinge. The connecting element is disposed between the first server unit and the second server unit. The connecting element has a first connection end and a second connection end, wherein the first connection end is connected to the first server unit, and the second connection end is connected to the second server unit. A server system including a rack and at least one server is also provided.

Abstract: In some examples, a connection apparatus includes a first connector assembly to engage with a second connector assembly, where the first connector assembly is included in one of a support stand and an electronic device, and the second connector assembly is included in another one of the support stand and the electronic device. The first connector assembly includes a floating connector block, an electrical contact on the floating connector block, and a biasing assembly engaged with the floating connector block to urge the floating connector block towards the second connector assembly when the second connector assembly is engaged with the first connector assembly to achieve a spring-loaded engagement of the electrical contact with an electrical contact of the second connector assembly.

Abstract: An light-spreading lens comprises a bottom surface, a light-in surface, a side surface, a light-out surface and a micro structure portion. The light-in surface is defined in a center of the bottom surface and is recessed away from the bottom surface to form a receiving chamber. The side surface is around the bottom surface and is perpendicular to the bottom surface. The light-out surface extends from the side surface along a direction away from the bottom surface. The micro structure portion is formed on the light-out surface and is around a periphery of the light-out surface of near the side surface.

Abstract: A connector includes a first connector and a second connector mounted on an external device. The first connector includes a contact including a contact portion electrically connected to a connection terminal of the second connector by pressing the connection terminal in a predetermined direction; a flexible conductor connected to the contact; a protection member that protects the contact portion by covering a periphery of the contact; a base body that accommodates the contact, the flexible conductor, and the protection member; and an elastic member that is formed separately from the contact and presses the contact and the protection member in a direction opposite to the predetermined direction.

Abstract: The present invention is related to a method for correcting a diffusion image having an artifact, the method comprising: (a) providing a set of diffusion images comprising the diffusion image having the artifact; (b) calculating a first signal intensity of each image in the set of diffusion images; (c) plotting a graph of serial number of slice of the set of diffusion images versus the first signal intensity; (d) calculating a second signal intensity of the diffusion image having the artifact by performing interpolation on the graph; and (e) correcting the diffusion image having the artifact base on the second signal intensity.

Abstract: A connector includes a first connector and a second connector mounted on an external device. The first connector includes a contact including a contact portion electrically connected to a connection terminal of the second connector by pressing the connection terminal in a predetermined direction; a flexible conductor connected to the contact; a protection member that protects the contact portion by covering a periphery of the contact; a base body that accommodates the contact, the flexible conductor, and the protection member; and an elastic member that is formed separately from the contact and presses the contact and the protection member in a direction opposite to the predetermined direction.

Abstract: A clamping and cutting device for frozen material includes a clamping member and a cutting component. The clamping member includes a clamper for clamping frozen materials and a driving component for driving the clamper to open or close. The cutting component is connected to the clamper and includes two driven arms cooperating with the clamper to open and close with the clamper.

Abstract: A hex wrench includes a main body, a handle connected with the main body, a rotary member, a lifting member, a driving member, and a matching member. The rotary member includes an operation portion and a shaft portion. The driving member includes six host driving members and six guest driving members. The matching member includes six matching blocks. The shaft portion passes through the main body. One end of the shaft portion is connected to the operation portion, the other opposite end is connected to the lifting member. One end of each host driving member is rotatably connected with the lifting member, the other end is rotatably connected with a middle portion of a corresponding guest driving member. One end of each guest driving member is rotatably connected with the main body, the other end is rotatably connected to a corresponding matching block.

Abstract: A voice coil motor includes a movable barrel and a spring plate. The movable barrel includes a top end and a number of locating members. Each locating member includes a locating post on the top end, and a blocking portion on the locating post. The spring plate includes a top surface, a bottom surface, and an inner frame. The spring plate defines a through hole passing through the top surface and the bottom surface. The inner frame surrounds the through hole. The inner frame defines a number of locating holes. Each locating hole receives a corresponding locating post. The spring plate is positioned between the blocking portions and the top end. The blocking portions lock the inner frame to the movable barrel. The inner surface of each locating hole defines spaced gaps. Each gap passes through the top and the bottom surfaces.

Abstract: The present disclosure relates to a method for making a mold for forming an anti-flare lens. The lens includes an optically active part and an optically inactive part. In the method, a mold core blank having a bottom surface and a top surface, is provided. The bottom surface is machined into a first surface portion, a second surface portion, and an annular surface portion. The second surface portion is located at a center of the mold core blank. The annular surface portion connects the second surface portion and the first surface portion. The first surface portion is roughened to form a roughened molding surface for forming the optically inactive part. The second surface portion is precisely machined to form a smooth molding surface for forming the optically active part. The annular surface is precisely machined to form a smooth transition surface.

Abstract: An injection molding machine includes a moving platen. The moving platen includes a fixed support and an ejector assembly. The fixed support includes a first and a second adjustment motors, and a first and a second adjustment shafts. The first and second adjustment motors are connected to the first and second adjustment shafts respectively. The ejector assembly includes two guide shells, two drive shafts, two ejector pins, and two guide protrusions. Each guide shell is positioned in the fixed support and receives one drive shaft and one ejector pin. Each drive shaft engages with a corresponding ejector pin and is capable of driving the corresponding ejector pin to move back and forth in the guide shell. Each guide protrusion extends outwards from a corresponding guide shell. Each of the first and second adjustment shafts engages with a corresponding guide protrusion and is capable of moving the corresponding guide protrusion.