Patents by Inventor Chien-Feng Huang
Chien-Feng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250089164Abstract: An electronic device including a die and a connection structure electrically connected to the die is disclosed. The connection structure includes a first insulating layer including an opening, a second insulating layer, a first metal element disposed between the first insulating layer and the second insulating layer, a second metal element disposed in the opening and electrically connected to the first metal element, and a conductive element. The second metal element is electrically connected between the conductive element and the first metal element. A first surface and a second surface of the first insulating layer are contacted with the first metal element and the conductive element respectively. The first insulating layer includes first filling elements, the second insulating layer includes second filling elements, and in a cross-sectional view, a second maximum size of the second filling elements is greater than a first maximum size of the first filling elements.Type: ApplicationFiled: November 26, 2024Publication date: March 13, 2025Applicant: Innolux CorporationInventors: Cheng-Chi WANG, Chin-Ming HUANG, Chien-Feng LI, Chia-Lin YANG
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Publication number: 20250085751Abstract: A thermal power budget optimization method includes acquiring sensor log information from a plurality of sensors of a heating device, generating a virtual surface temperature of the heating device according to the sensor log information, setting a target surface temperature of the heating device, and dynamically adjusting a thermal power budget of the heating device according to the virtual surface temperature and the target surface temperature over time.Type: ApplicationFiled: July 29, 2024Publication date: March 13, 2025Applicant: MEDIATEK INC.Inventors: Yu-Chia Chang, Chien-Chih Huang, Ta-Chang Liao, Chia-Feng Yeh, Ching-Lin Hsiao, Wei-Te Wu
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Patent number: 12250834Abstract: A power device includes: a semiconductor layer, a well region, a body region, a gate, a source, a drain, a first salicide block (SAB) layer and a second SAB layer. The first SAB layer is formed on a top surface of the semiconductor layer, and is located between the gate and the drain, wherein a part of the well is located vertically below and in contact with the first SAB layer. The second SAB layer is formed vertically above and in contact with the first SAB layer.Type: GrantFiled: May 5, 2022Date of Patent: March 11, 2025Assignee: RICHTEK TECHNOLOGY CORPORATIONInventors: Kuo-Hsuan Lo, Chien-Hao Huang, Chu-Feng Chen, Wu-Te Weng
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Publication number: 20250078770Abstract: An electronic device includes a substrate, a first transistor, a second transistor, an electronic unit and a conductor. The first transistor is disposed on the substrate and comprises an oxide semiconductor layer. The second transistor is disposed on the substrate and comprises a silicon semiconductor layer. The electronic unit is disposed on the substrate and electrically connected to the second transistor. The conductor is electrically connected to the oxide semiconductor layer and the silicon semiconductor layer.Type: ApplicationFiled: November 18, 2024Publication date: March 6, 2025Inventors: Sheng-Feng HUANG, Chien-Feng SHIH
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Patent number: 12245515Abstract: Semiconductor structure and methods of forming the same are provided. An exemplary method includes providing a substrate having a first region and a second region, forming an array of memory cells over the first region of the substrate, and forming a memory-level dielectric layer around the array of memory cells. Each of the memory cells includes, from bottom to top, a bottom electrode, a memory material layer stack, and a top electrode. The exemplary method also includes forming a metal line directly interfacing a respective row of top electrodes of the array of memory cells. The metal line also directly interfaces a top surface of the memory-level dielectric layer.Type: GrantFiled: September 1, 2021Date of Patent: March 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Feng Yin, Min-Kun Dai, Chien-Hua Huang, Chung-Te Lin
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Publication number: 20250056162Abstract: The present disclosure provides a voice coil structure, a method for manufacturing the voice coil structure, and a loudspeaker. The voice coil structure includes a first insulation layer, a first wiring layer, a second insulation layer, at least one second wiring layer, and a third insulation layer. The second insulation layer extends to wiring gaps of the first wiring layer. The third insulation layer extends to wiring gaps of the at least one second wiring layer. Each of the first wiring layer and the at least one second wiring layer has a winding structure. The first wiring layer is electrically connected in series or in parallel with the at least one second wiring layer and forming two output terminals.Type: ApplicationFiled: December 20, 2023Publication date: February 13, 2025Inventors: TSENG-FENG WEN, Chien-Kai Wen, Chun-Han Huang, Chung-Hsien Tseng
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Patent number: 12218449Abstract: An electrical connector includes an insulating body with multiple accommodating slots, and multiple terminals accommodated in the accommodating slots. Each terminal has an elastic arm, a floating contact portion and a conducting portion. The elastic arm and the floating contact portion are provided at an interval. One end of the elastic arm is connected with the floating contact portion through an insulating block. When each terminal is mated with a first electronic component and a second electronic component, the conducting portion is electrically connected to the first electronic component, the floating contact portion is electrically connected to the second electronic component, the elastic arm provides an elastic force such that the floating contact portion moves downward, and the floating contact portion and the conducting portion are directly electrically connected.Type: GrantFiled: September 1, 2022Date of Patent: February 4, 2025Assignee: LOTES CO., LTDInventors: Zuo Feng Jin, Chang Wei Huang, Chien Chih Ho
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Publication number: 20250029918Abstract: A three-dimensional integrated structure and the manufacturing method(s) thereof are described. The three-dimensional integrated structure includes a substrate having conductive features therein, and a component array disposed over the substrate and on the conductive features. The component array includes a metallic material layer and capacitor structures separated by the metallic material layer. Each of the capacitor structures includes a first metallic pillar, a first dielectric sheath surrounding the first metallic pillar, a second metallic sheath surrounding the first dielectric sheath, and a second dielectric sleeve surrounding the second metallic sheath. The metallic material layer laterally encapsulates the capacitor structures.Type: ApplicationFiled: October 8, 2024Publication date: January 23, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yun-Feng Kao, Chien-Hao Huang, Gao-Ming Wu, Katherine H CHIANG
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Patent number: 10072818Abstract: An light-spreading lens comprises a bottom surface, a light-in surface, a side surface, a light-out surface and a micro structure portion. The light-in surface is defined in a center of the bottom surface and is recessed away from the bottom surface to form a receiving chamber. The side surface is around the bottom surface and is perpendicular to the bottom surface. The light-out surface extends from the side surface along a direction away from the bottom surface. The micro structure portion is formed on the light-out surface and is around a periphery of the light-out surface of near the side surface.Type: GrantFiled: July 5, 2017Date of Patent: September 11, 2018Assignee: ScienBiziP Consulting(Shenzhen)Co., Ltd.Inventor: Chien-Feng Huang
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Patent number: 9979112Abstract: A connector includes a first connector and a second connector mounted on an external device. The first connector includes a contact including a contact portion electrically connected to a connection terminal of the second connector by pressing the connection terminal in a predetermined direction; a flexible conductor connected to the contact; a protection member that protects the contact portion by covering a periphery of the contact; a base body that accommodates the contact, the flexible conductor, and the protection member; and an elastic member that is formed separately from the contact and presses the contact and the protection member in a direction opposite to the predetermined direction.Type: GrantFiled: March 21, 2017Date of Patent: May 22, 2018Assignee: ACES ELECTRONICS CO., LTD.Inventors: Nobukazu Kato, Chien-Feng Huang, Hiroaki Hashimoto
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Patent number: 9916648Abstract: The present invention is related to a method for correcting a diffusion image having an artifact, the method comprising: (a) providing a set of diffusion images comprising the diffusion image having the artifact; (b) calculating a first signal intensity of each image in the set of diffusion images; (c) plotting a graph of serial number of slice of the set of diffusion images versus the first signal intensity; (d) calculating a second signal intensity of the diffusion image having the artifact by performing interpolation on the graph; and (e) correcting the diffusion image having the artifact base on the second signal intensity.Type: GrantFiled: January 10, 2017Date of Patent: March 13, 2018Assignee: NATIONAL TAIWAN UNIVERSITYInventors: Wen-Yih Isaac Tseng, Chien-Feng Huang
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Publication number: 20170288332Abstract: A connector includes a first connector and a second connector mounted on an external device. The first connector includes a contact including a contact portion electrically connected to a connection terminal of the second connector by pressing the connection terminal in a predetermined direction; a flexible conductor connected to the contact; a protection member that protects the contact portion by covering a periphery of the contact; a base body that accommodates the contact, the flexible conductor, and the protection member; and an elastic member that is formed separately from the contact and presses the contact and the protection member in a direction opposite to the predetermined direction.Type: ApplicationFiled: March 21, 2017Publication date: October 5, 2017Applicant: ACES ELECTRONICS CO., LTD.Inventors: Nobukazu Kato, Chien-Feng Huang, Hiroaki Hashimoto
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Patent number: 9403283Abstract: A clamping and cutting device for frozen material includes a clamping member and a cutting component. The clamping member includes a clamper for clamping frozen materials and a driving component for driving the clamper to open or close. The cutting component is connected to the clamper and includes two driven arms cooperating with the clamper to open and close with the clamper.Type: GrantFiled: December 30, 2009Date of Patent: August 2, 2016Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: Chien-Feng Huang
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Patent number: 8601912Abstract: A hex wrench includes a main body, a handle connected with the main body, a rotary member, a lifting member, a driving member, and a matching member. The rotary member includes an operation portion and a shaft portion. The driving member includes six host driving members and six guest driving members. The matching member includes six matching blocks. The shaft portion passes through the main body. One end of the shaft portion is connected to the operation portion, the other opposite end is connected to the lifting member. One end of each host driving member is rotatably connected with the lifting member, the other end is rotatably connected with a middle portion of a corresponding guest driving member. One end of each guest driving member is rotatably connected with the main body, the other end is rotatably connected to a corresponding matching block.Type: GrantFiled: December 30, 2010Date of Patent: December 10, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chien-Feng Huang, Zih-Wei Wang
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Patent number: 8503120Abstract: A voice coil motor includes a movable barrel and a spring plate. The movable barrel includes a top end and a number of locating members. Each locating member includes a locating post on the top end, and a blocking portion on the locating post. The spring plate includes a top surface, a bottom surface, and an inner frame. The spring plate defines a through hole passing through the top surface and the bottom surface. The inner frame surrounds the through hole. The inner frame defines a number of locating holes. Each locating hole receives a corresponding locating post. The spring plate is positioned between the blocking portions and the top end. The blocking portions lock the inner frame to the movable barrel. The inner surface of each locating hole defines spaced gaps. Each gap passes through the top and the bottom surfaces.Type: GrantFiled: March 23, 2011Date of Patent: August 6, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chien-Feng Huang
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Patent number: 8454864Abstract: The present disclosure relates to a method for making a mold for forming an anti-flare lens. The lens includes an optically active part and an optically inactive part. In the method, a mold core blank having a bottom surface and a top surface, is provided. The bottom surface is machined into a first surface portion, a second surface portion, and an annular surface portion. The second surface portion is located at a center of the mold core blank. The annular surface portion connects the second surface portion and the first surface portion. The first surface portion is roughened to form a roughened molding surface for forming the optically inactive part. The second surface portion is precisely machined to form a smooth molding surface for forming the optically active part. The annular surface is precisely machined to form a smooth transition surface.Type: GrantFiled: December 23, 2010Date of Patent: June 4, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chien-Feng Huang
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Patent number: 8449286Abstract: An injection molding machine includes a moving platen. The moving platen includes a fixed support and an ejector assembly. The fixed support includes a first and a second adjustment motors, and a first and a second adjustment shafts. The first and second adjustment motors are connected to the first and second adjustment shafts respectively. The ejector assembly includes two guide shells, two drive shafts, two ejector pins, and two guide protrusions. Each guide shell is positioned in the fixed support and receives one drive shaft and one ejector pin. Each drive shaft engages with a corresponding ejector pin and is capable of driving the corresponding ejector pin to move back and forth in the guide shell. Each guide protrusion extends outwards from a corresponding guide shell. Each of the first and second adjustment shafts engages with a corresponding guide protrusion and is capable of moving the corresponding guide protrusion.Type: GrantFiled: December 21, 2010Date of Patent: May 28, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chien-Feng Huang
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Patent number: 8404961Abstract: A mold includes a first mold half, a second mold half opposite to the first mold half, and a thermoelectric generator. The thermoelectric generator includes a high temperature conductive portion, a semiconductor electricity-generating portion, and a low temperature conductive portion. The high temperature conductive portion is positioned in contact with the first mold half and configured to conduct heat from the first mold half to the semiconductor electricity-generating portion. The low temperature conductive portion is exposed to the air. The semiconductor electricity-generating portion is sandwiched between the high temperature conductive portion and the low temperature conductive portion, and positioned in contact with the high temperature conductive portion and the low temperature conductive portion; the semiconductor electricity-generating portion is configured for forming a voltage difference.Type: GrantFiled: March 29, 2010Date of Patent: March 26, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chien-Feng Huang
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Patent number: 8371630Abstract: An auxiliary carrying device for carrying an object includes a strap, a handle, and a lacing assembly. The strap surrounds the object and includes a fixing end and a free end. The free end defines a number of through holes along the length thereof. Two ends of the handle are connected to the strap. The lacing assembly includes a connecting element and an adjusting element. The connecting element is fixed to the fixing end. The adjusting element is connected to the connecting element and comprises a post. The post is capable of inserting one of the through holes to connect the free end with the connecting element.Type: GrantFiled: December 23, 2010Date of Patent: February 12, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chien-Feng Huang, Zih-Wei Wang
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Patent number: 8353539Abstract: A pipe connector for connecting to a first pipe includes a second pipe and a fastener. The second pipe has a number of connection sections of difference outer diameters, one of which is fittingly coupled to the first pipe. The fastener sleeves on the first pipe and the second pipe and fastens the first pipe to the second pipe.Type: GrantFiled: December 23, 2010Date of Patent: January 15, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chien-Feng Huang, Zih-Wei Wang