Abstract: A supporting device includes a base, a fixing structure, a rotating structure, and a supporting structure. The fixing structure is mounted to the base. The rotating structure is rotatably mounted to the fixing structure. The supporting structure is configured to support a portable electronic device. The supporting structure is mounted to the rotating structure and rotates along with the rotating structure relative to the fixing structure.

Abstract: A packaging box includes a box and a main cover connected to the box. The box defines a receiving chamber configured to receive an electronic device. The main cover comprises a first board, a second board, and a third board. The first board is connected to the box. The first, second, and third boards are foldable relative to each other. The main cover is foldable to package the box, or to support the box with an angle formed between the first board and the box, and one side of the box resisting against the third board.

Abstract: A supporting device includes a base, a fixing structure, a rotating structure, and a supporting structure. The fixing structure is mounted to the base. The rotating structure is rotatably mounted to the fixing structure. The supporting structure is configured to support a portable electronic device. The supporting structure is mounted to the rotating structure and rotates along with the rotating structure relative to the fixing structure.

Abstract: A packaging box includes a first case. The first case includes a bottom wall, a first side wall, and a mounting wall. The mounting wall includes a receiving chamber configured to receive an electronic device. The bottom wall, the first side wall, and mounting wall are connected to each other. The mounting wall is supported by the bottom wall and the first side wall and forms an acute angle with the bottom wall.

Abstract: There is provided an integrated circuit includes an output driver and a configurable electrostatic discharging (ESD) power clamp element according to embodiments of the present invention. The output driver includes a first semiconductor element having a first conductivity type and electrically connected to a first power rail; and a second semiconductor element having a second conductivity type different from the first conductivity type and electrically connected to a second power rail. Specifically, the configurable ESD power clamp element is coupled between the first power rail and the second power rail to provide ESD protection when configured in a first hardware state, and forms a portion of the output driver when configured in a second hardware state, thereby increasing the design flexibility of the integrated circuit.

Abstract: A packaging box includes a box and a main cover connected to the box. The box defines a receiving chamber configured to receive an electronic device. The main cover comprises a first board, a second board, and a third board. The first board is connected to the box. The first, second, and third boards are foldable relative to each other. The main cover is foldable to package the box, or to support the box with an angle formed between the first board and the box, and one side of the box resisting against the third board.

Abstract: A packaging box includes a first case. The first case includes a bottom wall, a first side wall, and a mounting wall. The mounting wall includes a receiving chamber configured to receive an electronic device. The bottom wall, the first side wall, and mounting wall are connected to each other. The mounting wall is supported by the bottom wall and the first side wall and forms an acute angle with the bottom wall.

Abstract: There is provided an integrated circuit includes an output driver and a configurable electrostatic discharging (ESD) power clamp element according to embodiments of the present invention. The output driver includes a first semiconductor element having a first conductivity type and electrically connected to a first power rail; and a second semiconductor element having a second conductivity type different from the first conductivity type and electrically connected to a second power rail. Specifically, the configurable ESD power clamp element is coupled between the first power rail and the second power rail to provide ESD protection when configured in a first hardware state, and forms a portion of the output driver when configured in a second hardware state, thereby increasing the design flexibility of the integrated circuit.