Patents by Inventor Chien-Feng Wei

Chien-Feng Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure
    Patent number: 7459770
    Abstract: A lead frame structure is provided, which includes a die pad having a first mounting portion and a second mounting portion separated from the first mounting portion by a gap. The first and second mounting portions are formed with corresponding blocking surfaces bordering the gap, so as to allow a flow rate of an encapsulating resin flowing through the gap during a molding process to be reduced by the blocking surfaces, such that different portions of the encapsulating resin respectively flowing above, in and below the die pad can have substantially the same flow rate, thereby preventing bonding wires from being deformed to cause short circuit and avoiding formation of voids. A semiconductor package with the lead frame structure is also provided.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: December 2, 2008
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Wen-Shan Tsai, Chien-Feng Wei, Hung-Wen Liu, Ming Cheng Lin, Lien-Chen Chiang
  • Lead frame structure and semiconductor package integrated with the lead frame structure
    Publication number: 20070111395
    Abstract: A lead frame structure is provided, which includes a die pad having a first mounting portion and a second mounting portion separated from the first mounting portion by a gap. The first and second mounting portions are formed with corresponding blocking surfaces bordering the gap, so as to allow a flow rate of an encapsulating resin flowing through the gap during a molding process to be reduced by the blocking surfaces, such that different portions of the encapsulating resin respectively flowing above, in and below the die pad can have substantially the same flow rate, thereby preventing bonding wires from being deformed to cause short circuit and avoiding formation of voids. A semiconductor package with the lead frame structure is also provided.
    Type: Application
    Filed: September 27, 2006
    Publication date: May 17, 2007
    Inventors: Wen-Shan Tsai, Chien-Feng Wei, Hung-Wen Liu, M.C. Lin, Lien-Chen Chiang