Patents by Inventor Chien-Fu Chu

Chien-Fu Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of cleaning reaction chamber, method of forming protection film and protection wafer
    Patent number: 7732009
    Abstract: A method of cleaning a reaction chamber having a wafer holder is provided. First, the reaction chamber is cleaned by a cleaning gas. Next, a protection film is formed on the inner surface of the reaction chamber, wherein a gap is formed between the protection wafer and the wafer holder, and a cooling gas is guided therebetween simultaneously.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: June 8, 2010
    Assignee: United Microelectronics Corp.
    Inventors: Chih-Jen Mao, Chun-Hung Hsia, Ta-Ching Yang, Chun-Cheng Yu, Chien-Fu Chu, Kuo-Wei Yang, Chun-Han Chuang, Hui-Shen Shih
  • METHOD OF CLEANING REACTION CHAMBER, METHOD OF FORMING PROTECTION FILM AND PROTECTION WAFER
    Publication number: 20080075852
    Abstract: A method of cleaning a reaction chamber having a wafer holder is provided. First, the reaction chamber is cleaned by a cleaning gas. Next, a protection film is formed on the inner surface of the reaction chamber, wherein a gap is formed between the protection wafer and the wafer holder, and a cooling gas is guided therebetween simultaneously.
    Type: Application
    Filed: September 26, 2006
    Publication date: March 27, 2008
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Jen Mao, Chun-Hung Hsia, Ta-Ching Yang, Chun-Cheng Yu, Chien-Fu Chu, Kuo-Wei Yang, Chun-Han Chuang, Hui-Shen Shih
  • Chemical mechanical polishing device including a polishing pad and cleaning method thereof and method for planarization
    Publication number: 20070066187
    Abstract: A chemical mechanical polishing device used to polish a wafer according to the present invention includes a polishing table, a polishing pad, a slurry supply device, a wafer carrier and a high-pressure liquid cleaning device. The polishing pad is disposed on the polishing table to polish the wafer. The slurry supply device is disposed on the polishing table to supply the slurry. In addition, the wafer carrier is disposed the polishing table to carry the wafer in such a manner that the wafer is brought into contact with the polishing pad. Besides, the high-pressure cleaning device is disposed on the polishing table to remove the impurities on the polishing pad by high-pressure liquid.
    Type: Application
    Filed: September 22, 2005
    Publication date: March 22, 2007
    Inventors: Chih-Chiang Yang, Peng-Yih Peng, Chin-Yung Liu, Chien-Fu Chu, Wen-Shan Lin, Chia-Yuan Hsieh