Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A method for a 3D computer graphics shading process compiler, utilized to generate hardware machine code corresponding to a script is disclosed. The method includes the following steps. Operation mapping code indicating an operation of the script, and argument mapping code indicating an argument associated with the operation is provided. The hardware machine code is generated by performing a bitwise OR operation to the operation mapping code and the argument mapping code.

Abstract: A graphics processing unit (GPU) context switching system is provided. The GPU renders digital 3D images based on register values therein. A video random access memory (VRAM) temporarily stores the images before the images are output to a display. A driver controls the GPU. Upon receiving a first request for rendering an image from a first application, the driver generates register values corresponding to the first application according to the first request and writes the register values to the registers of the GPU. Upon receiving a second request for rendering an image from another application, the GPU stores the register values as a first backup in the VRAM.

Abstract: A method for a 3D computer graphics shading process compiler, utilized to generate hardware machine code corresponding to a script is disclosed. The method includes the following steps. Operation mapping code indicating an operation of the script, and argument mapping code indicating an argument associated with the operation is provided. The hardware machine code is generated by performing a bitwise OR operation to the operation mapping code and the argument mapping code.