Abstract: A method of forming a wiring pattern is provided. In the method, an adhesive material is coated on a substrate to form an adhesive layer, and then a patterned mask is provided on the adhesive layer, wherein the patterned mask has an opening defining a wiring pattern, and then an electrically conductive paste is filled in the opening, and subsequently the patterned mask is removed so as to form the wiring pattern on the substrate. In the method of the present invention, a wiring pattern is formed by using a screen printing method, but not by using an etching method. As a result, there are no etching contamination issues. Furthermore, the difficulty in etching the finer wiring patterns from the copper foil can be alleviated.

Abstract: A method for manufacturing a flat coaxial cable includes the steps of: providing two composite layers having a first A aperture, a second A aperture, a first B aperture and a second B aperture; adhering the composite layers on a signal wire and exposing the signal wire through the apertures; forming two fill apertures penetrating through the two composite layers and filling a silver paste within the fill apertures; providing two outer cover layers having a first C aperture and a second C aperture, and respectively adhering the two outer cover layers on the two composite layers; and cutting the adhered signal wire, composite layers and outer cover layers along a direction perpendicular to the signal wire. Thus, the flat coaxial cable has two ends formed with a step-like structure defined by the signal wire, the composite layers and the outer cover layers.

Abstract: A method for forming a wiring pattern by laser irradiation includes the steps of coating a light-sensitive material on a substrate to form a light-sensitive layer, irradiating a laser beam on the light-sensitive material of the substrate to form a pattern including an exposed region exposed to laser irradiation and an unexposed region unexposed to laser irradiation, and forming a metallic wiring pattern by immersing the substrate into a solution having a plurality of metallic nano-particles. The metallic nano-particles are easily bonded to the straighter molecular structure of the light-sensitive material in the exposed region for forming a conducting wiring pattern. The laser irradiation method has advantages such as high-power, high-density, high-directionality and monochromaticity, such that product quality can be effectively controlled. Moreover, the laser irradiated light-sensitive material can form a molecular structure that is easily bonded to the metallic particles.

Abstract: A method for forming a wiring pattern by laser irradiation includes the steps of coating a light-sensitive material on a substrate to form a light-sensitive layer, irradiating a laser beam on the light-sensitive material of the substrate to form a pattern including an exposed region exposed to laser irradiation and an unexposed region unexposed to laser irradiation, and forming a metallic wiring pattern by immersing the substrate into a solution having a plurality of metallic nano-particles. The metallic nano-particles are easily bonded to the straighter molecular structure of the light-sensitive material in the exposed region for forming a conducting wiring pattern. The laser irradiation method has advantages such as high-power, high-density, high-directionality and monochromaticity, such that product quality can be effectively controlled. Moreover, the laser irradiated light-sensitive material can form a molecular structure that is easily bonded to the metallic particles.

Abstract: A method of forming a printed circuit by using a printing method is provided. Method of forming the printed circuit, which instead of using the copper etching method, uses an adhesive to adhere to the metal powder, and then to solidify the metal powder. In detail, a patterned silk screen (corresponding to the through pattern of a predetermined printed circuit wiring) and a base material are provided. The adhesive is printed onto the base material using the patterned silk screen, and an adhesive layer which is patterned is formed onto the base material. Then, the metal powder is incorporated into the adhesive layer, and solidified inside the adhesive layer to form the printed circuit.

Abstract: The present invention provides a structure and fabricating method of forming conductive traces on a printed circuit board. The method comprises the steps of (a) providing an insulating substrate; (b) forming grooves on the insulating substrate; and (c) filling a first colloid which has a bridging effect with the insulating substrate into the grooves; and (d) filling a second colloid which reacts with the first colloid into the conductive traces.

Abstract: An electric heater is described. The heater is composed of a plastic or a rubber strip conductor with a heat resistant and electric conductive chemical dispersed therethrough and electric conductors disposed on either side of the strip conductor so that when the electric conductors are coupled to a source of electrical energy current will flow through the strip and generate heat. The strip conductor then is covered with a polyethylene layer which is adhered thereto, and the polyethylene layer in turn is covered by a PVC layer.

Abstract: A process to manufacture control cable comprising feeding of a plurality of parallel conducting wires between an upper and a lower plastic films to be preheated in respective tunnel type heaters, and then formed and cooled by forming rolls, transferred by transmission rolls for cutting along gaps between two consecutive wires at appropriate pitch by roller cutters, the wires so processed are then twisted by a twisting machine, covered with metal foil first, and then braided copper network made by a braiding machine, and finally a PVC insulation layer by a PVC injection machine. The finished product is finally collected by a product collector.