Abstract: A manufacturing method of a semiconductor device comprises the steps of: providing a transparent substrate; forming a gate electrode on the transparent substrate; forming a gate insulation layer covering the gate electrode; forming an oxide semiconductor layer on the gate insulation layer and at least partially over the gate electrode; forming an etching stop layer over the gate electrode and at least covering a part of the oxide semiconductor layer, wherein the etching stop layer includes an opening; forming an electrode layer at the opening and on a part of the etching stop layer; and applying a low-resistance treatment to a part of the oxide semiconductor layer uncovered by the etching stop layer and the electrode layer to form a pixel electrode.

Abstract: A method for manufacturing a semiconductor device is provided. The method comprises the steps of: providing a transparent substrate having a visible region and an invisible region; forming a gate and at least an alignment mark coplanarly on the transparent substrate, wherein the gate is located in the visible region and the alignment mark is located in the invisible region; forming a gate insulation layer to cover the gate and cover the alignment mark; forming an oxide semiconductor layer on the gate insulation layer above the gate; and forming an etching stop layer above the gate and the alignment mark.

Abstract: A manufacturing method of a semiconductor device comprises the steps of: providing a transparent substrate; forming a gate electrode on the transparent substrate; forming a gate insulation layer covering the gate electrode; forming an oxide semiconductor layer on the gate insulation layer and at least partially over the gate electrode; forming an etching stop layer over the gate electrode and at least covering a part of the oxide semiconductor layer, wherein the etching stop layer includes an opening; forming an electrode layer at the opening and on a part of the etching stop layer; and applying a low-resistance treatment to a part of the oxide semiconductor layer uncovered by the etching stop layer and the electrode layer to form a pixel electrode.

Abstract: A manufacturing method of a semiconductor device comprises the steps of: providing a transparent substrate; forming a gate electrode on the transparent substrate; forming a gate insulation layer covering the gate electrode; forming an oxide semiconductor layer on the gate insulation layer and at least partially over the gate electrode; forming an etching stop layer over the gate electrode and at least covering a part of the oxide semiconductor layer, wherein the etching stop layer includes an opening; forming an electrode layer at the opening and on a part of the etching stop layer; and applying a low-resistance treatment to a part of the oxide semiconductor layer uncovered by the etching stop layer and the electrode layer to form a pixel electrode.

Abstract: A method for manufacturing a semiconductor device is provided. The method comprises the steps of: providing a transparent substrate having a visible region and an invisible region; forming a gate and at least an alignment mark coplanarly on the transparent substrate, wherein the gate is located in the visible region and the alignment mark is located in the invisible region; forming a gate insulation layer to cover the gate and cover the alignment mark; forming an oxide semiconductor layer on the gate insulation layer above the gate; and forming an etching stop layer above the gate and the alignment mark.

Abstract: A circuit stack structure is provided. The circuit stack structure includes a conductor layer having metal wires arranged at intervals, propping portions respectively disposed in a gap between any two of the neighboring metal wires, and a protective layer covering the metal wires and the propping portions. The propping portions are electrically isolated with the metal wires. With supporting by the propping portions, all regions of a top surface of the protective layer corresponding to one of the propping portions are coplanar with all regions of the top surface of the protective layer corresponding to each of the metal wires.

Abstract: The present invention provides a pixel structure including a substrate, a thin-film transistor disposed on the substrate, a first insulating layer covering the thin-film transistor and the substrate, a common electrode, a connecting electrode, a second insulating layer, and a pixel electrode. The thin-film transistor includes a drain electrode. The first insulating layer has a first opening exposing the drain electrode. The common electrode and the connecting electrode are disposed on the first insulating layer. The connecting electrode extends into the first opening to be electrically connected to the drain electrode. The connecting electrode is electrically insulated from the common electrode. The second insulating layer covers the first insulating layer, the common electrode, the connecting electrode, and has a second opening exposing the connecting electrode. The pixel electrode is disposed on the second insulating layer and electrically connected to the connecting electrode through the second opening.

Abstract: A method for manufacturing pixel structure is provided. A patterned conductor layer including a gate, a scan line and a conductor pattern is formed on a substrate. A gate insulating layer, a metal oxide material layer and an etching stop material layer are formed on the substrate. Using the patterned conductor layer as mask, a patterned photoresist layer is formed on the etching stop material layer through a back exposure process. Using the patterned photoresist layer as mask, a metal oxide channel layer and an etching stop layer are formed above the gate. A source and a drain are formed on the etching stop layer. A passivation layer is formed on the substrate. A halftone mask is used to form a photosensitive layer on the passivation layer. The metal oxide material layer and the etching stop material layer on the scan line and the conductor pattern are removed.

Abstract: The present invention provides a pixel structure including a substrate, a thin-film transistor disposed on the substrate, a first insulating layer covering the thin-film transistor and the substrate, a common electrode, a connecting electrode, a second insulating layer, and a pixel electrode. The thin-film transistor includes a drain electrode. The first insulating layer has a first opening exposing the drain electrode. The common electrode and the connecting electrode are disposed on the first insulating layer. The connecting electrode extends into the first opening to be electrically connected to the drain electrode. The connecting electrode is electrically insulated from the common electrode. The second insulating layer covers the first insulating layer, the common electrode, the connecting electrode, and has a second opening exposing the connecting electrode. The pixel electrode is disposed on the second insulating layer and electrically connected to the connecting electrode through the second opening.

Abstract: A circuit stack structure is provided. The circuit stack structure includes a conductor layer having metal wires arranged at intervals, propping portions respectively disposed in a gap between any two of the neighboring metal wires, and a protective layer covering the metal wires and the propping portions. The propping portions are electrically isolated with the metal wires. With supporting by the propping portions, all regions of a top surface of the protective layer corresponding to one of the propping portions are coplanar with all regions of the top surface of the protective layer corresponding to each of the metal wires.

Abstract: A method for manufacturing pixel structure is provided. A patterned conductor layer including a gate, a scan line and a conductor pattern is formed on a substrate. A gate insulating layer, a metal oxide material layer and an etching stop material layer are formed on the substrate. Using the patterned conductor layer as mask, a patterned photoresist layer is formed on the etching stop material layer through a back exposure process. Using the patterned photoresist layer as mask, a metal oxide channel layer and an etching stop layer are formed above the gate. A source and a drain are formed on the etching stop layer. A passivation layer is formed on the substrate. A halftone mask is used to form a photosensitive layer on the passivation layer. The metal oxide material layer and the etching stop material layer on the scan line and the conductor pattern are removed.

Abstract: A display device and a fabrication method thereof are provided. The display device includes a first metal layer disposed on a display area and a peripheral area. An insulating layer covers the first metal layer. A patterned semiconductor layer is disposed on the insulating layer at the display area. A second metal layer is disposed on the patterned semiconductor layer and the insulating layer at the peripheral area. A transparent conductive layer directly covers the second metal layer. A protective layer completely covers the second metal layer, the patterned semiconductor layer and the transparent conductive layer. The protective layer includes a first portion, a second portion and a through hole, wherein the first portion has a height which is higher than a height of the second portion.

Abstract: An array substrate, liquid crystal display for the same and manufacturing method thereof are described. The array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of contact pads, a passivation layer and transparent conducting layer. The substrate has a first display region, a second display region and a first non-display region. The contact pads are disposed in the first non-display region. The transparent conducting layer disposed in the passivation layer includes a first pixel electrode, a second pixel electrode and a plurality of comb electrode. The first pixel electrode and second pixel electrode are disposed in the first display region and the second display region wherein the widths of the first pixel electrodes either are equal to or approximate the widths of the second pixel electrodes. The comb electrodes are disposed in the first non-display region and connected to the contact pads.

Abstract: A driven electrode structure of an in-plane switching liquid crystal display is divided into a plurality of sub-regions, each of the sub-regions includes a plurality of sub-driven electrodes, a plurality of intervals is formed between adjacent sub-driven electrodes, so as each of the sub-regions has the intervals, and at least two of the intervals in the sub-regions are different from one another. By changing the width or shape of each sub-driven electrode, at least two of the intervals in the sub-regions are different from one another, so as the Mura condition of the in-plane switching liquid crystal display can be obscure, so as the Mura defect can be minimized uniformly without being visually recognized by human eyes and further improve the visual defect of the Mura.

Abstract: An organic electroluminescent display device includes a bottom substrate, a covering substrate, a pixel controlling unit, a first organic light emitting unit, and a second organic light emitting unit. The covering substrate is disposed oppositely to the bottom substrate. The pixel controlling unit is disposed between the bottom substrate and the covering substrate. The first organic light emitting unit is disposed between the pixel controlling unit and the covering substrate. The second organic light emitting unit is disposed between the pixel controlling unit and the bottom substrate. The pixel controlling unit is electrically connected to the first organic light emitting unit and the second organic light emitting unit.

Abstract: An array substrate, liquid crystal display for the same and manufacturing method thereof are described. The array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of contact pads, a passivation layer and transparent conducting layer. The substrate has a first display region, a second display region and a first non-display region. The contact pads are disposed in the first non-display region. The transparent conducting layer disposed in the passivation layer includes a first pixel electrode, a second pixel electrode and a plurality of comb electrode. The first pixel electrode and second pixel electrode are disposed in the first display region and the second display region wherein the widths of the first pixel electrodes either are equal to or approximate the widths of the second pixel electrodes. The comb electrodes are disposed in the first non-display region and connected to the contact pads.

Abstract: A display device and a fabrication method thereof are provided. The display device includes a first metal layer disposed on a display area and a peripheral area. An insulating layer covers the first metal layer. A patterned semiconductor layer is disposed on the insulating layer at the display area. A second metal layer is disposed on the patterned semiconductor layer and the insulating layer at the peripheral area. A transparent conductive layer directly covers the second metal layer. A protective layer completely covers the second metal layer, the patterned semiconductor layer and the transparent conductive layer. The protective layer includes a first portion, a second portion and a through hole, wherein the first portion has a height which is higher than a height of the second portion.

Abstract: A liquid crystal display includes a thin-film transistor (TFT) array substrate, a color filter substrate and a liquid crystal layer disposed between the TFT array substrate and the color filter substrate. The TFT array substrate includes a first substrate, a plurality of scan lines, a plurality of data lines, a plurality of pixel electrodes and a black matrix layer. The black matrix layer is disposed above the scan lines and the data lines of the TFT array substrate and between the data lines and the pixel electrodes.

Abstract: An electronic device and method to prevent falling of the electronic device include setting one or more alarm means, detecting an acceleration and a moving direction of the electronic device using the three-axis accelerometer, and detecting that the electronic device is in a falling state if the acceleration is larger or equal to the acceleration of gravity and the moving direction is in the gravitational direction. The electronic device and method further include activating one or more of the alarm means if the electronic device is in the falling state or if a clip connected with a strap of the electronic device is not in a tightened state.

Abstract: A method for fabricating a touch sensor structure is disclosed and has steps of forming a conductive layer on a substrate; forming a patterned bridging photo-resist layer on the conductive layer through a half-tone masking process that the bridging photo-resist layer partially covers the conductive layer and has a first portion and a relatively thinner second portion; removing a portion of the conductive layer which is not covered by the bridging photo-resist layer to pattern the conductive layer; and removing the second portion of the bridging photo-resist layer to form a bridging layer and the patterned conductive layer is partially exposed to be a conductive-wire layer. Hence the present invention reduce one masking process during forming conducting wires and bridge structures and provides better production efficiency.