Abstract: The invention provides a method for preparation of rubidium cesium tungsten bronze particles and a composition of rubidium cesium tungsten bronze particles comprising an organic or inorganic base material, rubidium cesium tungsten bronze particles and additives. The rubidium cesium tungsten bronze particles (RbxCsy)0.33WOz is an alkali metal tungsten oxide material practical for use as a near infrared (NIR) absorbent, thermal mask additive, thermosetting resin or sputtering palladium material. The additive is practical for use in organic or inorganic substrates, such as plastic, paint, enamel, ink, adhesive, ceramic or glass, and prepared, for example, by a plasma torch.

Abstract: The present invention discloses a method for reducing the tilt of a transparent window during manufacturing of an image sensor. The method includes the following steps: providing a semimanufacture of the image sensor; carrying out a preheating process; carrying out an adhesive spreading process; carrying out a transparent window closing process; and carrying out a packaging process. By carrying out the preheating process, the environmental conditions can be stabilized during the adhesive spreading process and the transparent window closing process such that the transparent window can be kept highly flat after combining. By the implementation of the present invention, the chance of tilt and crack of the transparent window during manufacturing of the image sensor can be reduced, thereby achieving the goal for a better yield rate.

Abstract: The present invention discloses a method for reducing the tilt of a transparent window during manufacturing of an image sensor. The method includes the following steps: providing a semimanufacture of the image sensor; carrying out a preheating process; carrying out an adhesive spreading process; carrying out a transparent window closing process; and carrying out a packaging process. By carrying out the preheating process, the environmental conditions can be stabilized during the adhesive spreading process and the transparent window closing process such that the transparent window can be kept highly flat after combining By the implementation of the present invention, the chance of tilt and crack of the transparent window during manufacturing of the image sensor can be reduced, thereby achieving the goal for a better yield rate.

Abstract: An image sensor structure and an integrated lens module thereof are provided. In the image sensor structure with the integrated lens module, the image sensor structure comprises a chip and a lens module. The chip has light-sensing elements, first conducting pads, and a conducting channel. The light-sensing elements are electrically connected to the first conducting pads and the first conducting pads are electrically connected to one end of the conducting channel passing through the chip. The lens module comprises a holder and at least one lens. The holder has a through hole and the lens is embedded in the through hole and integrated with the holder. By using the integrated lens and holder, a manufacturing process of the image sensor structure is simplified and a manufacturing cost of the image sensor structure is reduced.

Abstract: An image sensor structure and an integrated lens module thereof are provided. In the image sensor structure with the integrated lens module, the image sensor structure comprises a chip and a lens module. The chip has light-sensing elements, first conducting pads, and a conducting channel. The light-sensing elements are electrically connected to the first conducting pads and the first conducting pads are electrically connected to one end of the conducting channel passing through the chip. The lens module comprises a holder and at least one lens. The holder has a through hole and the lens is embedded in the through hole and integrated with the holder. By using the integrated lens and holder, a manufacturing process of the image sensor structure is simplified and a manufacturing cost of the image sensor structure is reduced.

Abstract: An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a light-sensing area of a first surface thereof, first conducting pads electrically connected to the light-sensing elements, and a conducting channel passing through the chip and electrically connected to the first conducting pads at one end. The supporting element has an opening, a first coupling surface, and a second coupling surface. The opening corresponds to the light-sensing area and the first coupling surface is combined with the first surface of the chip while the light-transmitting element is combined with the second coupling surface. The supporting element separates the light-transmitting element from the chip by a proper distance, so as to enhance an image sensing accuracy of an image sensor module.