Patents by Inventor Chien-Heng Cheng

Chien-Heng Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162038
    Abstract: A photomask structure including a first layout pattern and a second layout pattern is provided. The second layout pattern is located on one side of the first layout pattern. The first layout pattern and the second layout pattern are separated from each other. The first layout pattern has a first edge and a second edge opposite to each other. The second layout pattern has a third edge and a fourth edge opposite to each other. The third edge of the second layout pattern is adjacent to the first edge of the first layout pattern. The second layout pattern includes a first extension portion exceeding an end of the first layout pattern. The first extension portion includes a first protruding portion protruding from the third edge of the second layout pattern. The first protruding portion exceeds the first edge of the first layout pattern.
    Type: Application
    Filed: February 10, 2023
    Publication date: May 16, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Chien Heng Liu, Chia-Wei Huang, Yung-Feng Cheng, Ming-Jui Chen
  • Publication number: 20060238274
    Abstract: A SAW device includes: a SAW chip having a piezoelectric substrate and transmitting and receiving transducers; a circuit board formed with conductive inner contacts, each of which is connected electrically to a respective one of the transmitting and receiving transducers; a first adhesive-confining curb interconnecting the circuit board and the transmitting and receiving transducers and cooperating with the circuit board and the SAW chip to define an enclosed cavity thereamong; a second adhesive-confining curb surrounding the first adhesive-confining curb to define a sealing space therebetween; an adhesive body filling the sealing space; and a molding compound covering the SAW chip and connected sealingly to the second adhesive-confining curb.
    Type: Application
    Filed: April 22, 2005
    Publication date: October 26, 2006
    Applicant: YCL ELECTRONICS CO., LTD.
    Inventors: Sheng-Nan Huang, Wen-Long Leu, Chien-Heng Cheng, Yu-Ching Huang