Abstract: A Buck-Boost converter includes an input node to receive a supply voltage and a supply current, an output node, an inductor, capacitors including a load capacitor and a helper capacitor, and transistors to configure the Buck-Boost converter to: when the supply voltage is turning ON, operate in a Buck mode to (a) in a first cycle, use the supply current to charge the capacitors and an inductor magnetic field, and (b) in a second cycle, without using the supply current, discharge the inductor and the capacitors through the output node, to limit an inrush current; and when the supply voltage is turning OFF, operate in a Boost mode to (c) in a third cycle, cause the helper capacitor, but not the load capacitor, to charge the magnetic field, and (d) in a fourth cycle, discharge the inductor, and the capacitors, through the output node, to extend a voltage hold-up time.

Abstract: A Buck-Boost converter includes an input node to receive a supply voltage and a supply current, an output node, an inductor, capacitors including a load capacitor and a helper capacitor, and transistors to configure the Buck-Boost converter to: when the supply voltage is turning ON, operate in a Buck mode to (a) in a first cycle, use the supply current to charge the capacitors and an inductor magnetic field, and (b) in a second cycle, without using the supply current, discharge the inductor and the capacitors through the output node, to limit an inrush current; and when the supply voltage is turning OFF, operate in a Boost mode to (c) in a third cycle, cause the helper capacitor, but not the load capacitor, to charge the magnetic field, and (d) in a fourth cycle, discharge the inductor, and the capacitors, through the output node, to extend a voltage hold-up time.

Abstract: A sensor package structure includes a substrate, a sensor chip on the substrate, a ring-shaped support, a light permeable board on the ring-shaped support, and an opaque package body formed on the substrate. A top surface of the sensor chip includes a spacing region and a carrying region surrounding the spacing region. The support is disposed on the carrying region. The light permeable board has a ring-shaped notch recessed from an upper surface thereof, and the notch includes a platform surface at least partially located above the support and a wall surface connected to the platform surface and located above the spacing region. A portion of the opaque package body fills the notch and is defined as a light shielding portion. An inner lateral side of the support is arranged in a projection area formed by orthogonally projecting the platform surface onto the top surface.

Abstract: A sensor package structure includes a substrate, a sensor chip on the substrate, a ring-shaped support, a light permeable board on the ring-shaped support, and an opaque package body formed on the substrate. A top surface of the sensor chip includes a spacing region and a carrying region surrounding the spacing region. The support is disposed on the carrying region. The light permeable board has a ring-shaped notch recessed from an upper surface thereof, and the notch includes a platform surface at least partially located above the support and a wall surface connected to the platform surface and located above the spacing region. A portion of the opaque package body fills the notch and is defined as a light shielding portion. An inner lateral side of the support is arranged in a projection area formed by orthogonally projecting the platform surface onto the top surface.

Abstract: The present disclosure provides a package base core and a sensor package structure. The package base core includes a substrate and at least one stopper, or the package base core includes a substrate, at least one stopper, and a compound. The sensor package structure includes a substrate, a first stopper, a second stopper, a sensing member, a first compound, a second compound, and a translucent member. The stopper (or the first and second stoppers) of the present disclosure is provided to form with a protruding portion on the substrate, so that an overflowing of the compound can be avoided, thereby increasing the reliability of the package base core.

Abstract: The present disclosure provides a package base core and a sensor package structure. The package base core includes a substrate and at least one stopper, or the package base core includes a substrate, at least one stopper, and a compound. The sensor package structure includes a substrate, a first stopper, a second stopper, a sensing member, a first compound, a second compound, and a translucent member. The stopper (or the first and second stoppers) of the present disclosure is provided to form with a protruding portion on the substrate, so that an overflowing of the compound can be avoided, thereby increasing the reliability of the package base core.

Abstract: A method of package for sensor chip includes the steps of: a) providing a sensor chip having a plurality of conducting contacts and a sensing area, b) using an adhesive to bond the sensor chip on a circuit substrate, c) mounting a dam between the sensing area and conducting contacts of the sensor chip, d) connecting metal conducting wires between the conducting contacts of the circuit substrate and the conducting contacts of the sensor chip, and e) molding a molding compound on the circuit substrate and the sensor chip to cover the metal conducting wires and the dam. Thus, the dam can buffer the impact of stress on the sensor chip during the step e). Further, an open type sensing space is defined after the step e), facilitating signal or status sensing and improving the sensor chip package yield rate.

Abstract: A sensor chip protective image sensor packaging method includes the steps of a) installing an image sensor chip in a circuit substrate and then covering a passivation layer on a sensing zone of the image sensor chip, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, d) removing the passivation layer, and e) mounting a light transmissive cover in the encapsulation over the sensing zone of the image sensor chip. Thus, the passivation layer protects the sensing zone of the image sensor chip against contamination and damage prior before having been protected by the cover, and therefore, this image sensor chip packaging method has high-yield performance.

Abstract: A image sensor packaging method includes the steps of: a) installing an image sensor chip in a circuit substrate and then covering a light transmissive cover on the image sensor chip over a sensing zone of the image sensor chip and then covering a passivation layer on the light transmissive cover, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, and d) removing the passivation layer. Thus, the light transmissive cover and the passivation layer protect the sensing zone of the image sensor chip and the light transmissive cover against contamination and damage, and therefore, this image sensor chip packaging method has high-yield performance.

Abstract: A fluid reactor having a thin film with two-dimensionally distributed micro-resistor units includes one flow way, separating ribs, a thin film which is thinner than 100 micrometer, and a catalytic layer. There are multiple micro-resistor units, which is thinner than 60 micrometer each, set on the thin film. A bi-directional control unit is disposed to control these multiple micro-resistor units to shift to a desired mode selected from detecting electrical resistance, voltage, current, temperature, flow speed, and/or heat-up functions at different time. It can be applied to different kinds of fuel cells with different flow-way patterns. Its micro-resistor units have bi-directional functions. It can detect flow speed at a desired location in the flow way. It would not influence its original flow field and structure. Plus, it is easy to be installed.