Patents by Inventor Chien-Hsiang CHOU

Chien-Hsiang CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board and method of manufacturing the same
    Patent number: 11637060
    Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: April 25, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Chun-Hao Chen, Chia-Lung Lin, Chien-Hsiang Chou, Yi-Lin Chiang, Chien-Chen Lin
  • WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220199513
    Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.
    Type: Application
    Filed: March 11, 2022
    Publication date: June 23, 2022
    Inventors: Chun-Hao CHEN, Chia-Lung LIN, Chien-Hsiang CHOU, Yi-Lin CHIANG, Chien-Chen LIN