Abstract: A deep learning method of an artificial intelligence model for medical image recognition is provided. The method includes the following steps: obtaining a first image set, where the first image set includes at least two images captured with different parameters; performing image pre-processing on each image of the first image set to obtain a second image set; performing image augmentation on the second image set to obtain a third image set; adding the third image set to a training image data set; and training the artificial intelligence model using the training image data set.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.

Abstract: Provided are a silicon carbide crystal growth device and a quality control method. The device includes: an annealing unit, a crystal growth unit, an atmosphere control unit, and a transport system; the atmosphere control unit provides a gas environment with low water, oxygen and nitrogen; the transport system transports a plurality of target objects after high-temperature purification by the annealing unit to the atmosphere control unit; after assembling silicon carbide seed crystal and silicon carbide powder in a graphite crucible and covering with thermal insulation material to form a container inside the atmosphere control unit, the transport system transports the container to the crystal growth unit. The method uses a weighing system in a chamber of the crystal growth unit to detect a weight change of silicon carbide seed crystal and silicon carbide powder during a crystal growth process through a plurality of weight sensors of the weighing system.

Abstract: An optical element driving mechanism is provided, including a fixed part, a movable part, a metallic member and a driving assembly. The fixed part includes a base. The movable part is movably connected to the fixed part, and carries an optical element, the optical element has an optical axis. The metallic member is disposed on the base, and includes an inner electrical connection part and an outer electrical connection part, the inner electrical connection part and the outer electrical connection part are connected to each other. The driving assembly includes at least one driving magnetic element and drives the movable part to move relative to the fixed part.

Abstract: An antenna module includes two antenna units, two isolation members, and a grounding member. Each antenna unit consists of two feeding ends, two first radiators, and two second radiators. The isolating members are disposed between the first and second portions of each antenna unit. The grounding member is disposed beside the two antenna units and the two isolation members. A first slot is formed among each first radiator, the second radiator, and the grounding member. The two second radiators are connected to the third radiator. A third slot is formed between the second radiator and the second portion. The two antenna units are symmetric to the fourth slot in a mirrored manner, and the two first portions have widths gradually changing along an extending direction of the fourth position.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: An electronic package structure and a chip thereof are provided. The electronic package structure includes a substrate, a chip, a plurality of signal wires, and a core ground wire. The chip disposed on and electrically connected to the substrate has a core wiring region and an input and output pad region located at a top surface thereof. The input and output pad region is located between the core wiring region and an edge of the chip. The chip includes a plurality of signal pads in the input and output region and a core ground pad adjacent to one of the signal pads. The core ground pad located in the core wiring region. The signal wires are respectively connected to the signal pads. The core ground wire connected to the core ground pad is adjacent to and shields one of the signal wires.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: An electronic package structure and a chip thereof are provided. The electronic package structure includes a substrate, a chip, a plurality of signal wires, and a core ground wire. The chip disposed on and electrically connected to the substrate has a core wiring region and an input and output pad region located at a top surface thereof. The input and output pad region is located between the core wiring region and an edge of the chip. The chip includes a plurality of signal pads in the input and output region and a core ground pad adjacent to one of the signal pads. The core ground pad located in the core wiring region. The signal wires are respectively connected to the signal pads. The core ground wire connected to the core ground pad is adjacent to and shields one of the signal wires.

Abstract: A supercharging and stabilizing structure for an all terrain vehicle or a utility vehicle includes an engine body including a cylinder having an intake passage and an outtake passage. A supercharger includes a chamber having an inlet and an outlet. The supercharger further includes a duct at the inlet. An air accumulator is mounted between the cylinder and the supercharger and includes an air chamber. An input side of the air chamber intercommunicates with the outlet and the duct of the supercharger. An intake manifold is connected between an output side of the air chamber and the intake passage. When fuel is added into an engine, a control valve on the duct is closed. During fuel return or idling of the engine, the control valve is opened, and the inlet and the outlet of the supercharger, the air chamber, and the duct intercommunicate with each other to balance pressure.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: A supercharger structure for an all terrain vehicle or a utility vehicle includes an engine body and a supercharging device. The engine body includes a cylinder having an intake passage and an outtake passage. The supercharging device includes a supercharger, a throttle, an intake manifold, and at least one nozzle. The supercharger includes a chamber having an inlet coupled with the throttle and an outlet connected to the intake manifold. The intake manifold and the at least one nozzle intercommunicate with the intake passage. The at least one nozzle is connected to a fuel supply pipe of a vehicle. External air is drawn in by a guiding device in the chamber, flows through the throttle and the inlet into the chamber, and is pressurized. The pressurized air flows through the intake manifold to mix with fuel ejected by the at least one nozzle and then enters the cylinder.

Abstract: A wireless access point system includes a wireless access point (WAP) apparatus, a location-setting module, and a portable electronic device. The location-setting module stores a location list recording a location and an optimum direction corresponding to the location. The portable electronic device has a detection mode and a connection mode. In the detection mode, the portable electronic device controls the WAP apparatus to radiate a wireless signal and change the radiation direction within a specified direction range. The portable electronic device analyzes the wireless signal to obtain the optimum direction having an optimum signal receiving strength, so as to update the location list with the optimum direction and the location corresponding to the optimum direction. In the connection mode, the portable electronic device loads the optimum direction corresponding to the location and controls the radiation direction to be adjusted as the loaded optimum direction.

Abstract: A supercharger structure for an all terrain vehicle or a utility vehicle includes an engine body and a supercharging device. The engine body includes a cylinder having an intake passage and an outtake passage. The supercharging device includes a supercharger, a throttle, an intake manifold, and at least one nozzle. The supercharger includes a chamber having an inlet coupled with the throttle and an outlet connected to the intake manifold. The intake manifold and the at least one nozzle intercommunicate with the intake passage. The at least one nozzle is connected to a fuel supply pipe of a vehicle. External air is drawn in by a guiding device in the chamber, flows through the throttle and the inlet into the chamber, and is pressurized. The pressurized air flows through the intake manifold to mix with fuel ejected by the at least one nozzle and then enters the cylinder.

Abstract: A supercharging and stabilizing structure for an all terrain vehicle or a utility vehicle includes an engine body including a cylinder having an intake passage and an outtake passage. A supercharger includes a chamber having an inlet and an outlet. The supercharger further includes a duct at the inlet. An air accumulator is mounted between the cylinder and the supercharger and includes an air chamber. An input side of the air chamber intercommunicates with the outlet and the duct of the supercharger. An intake manifold is connected between an output side of the air chamber and the intake passage. When fuel is added into an engine, a control valve on the duct is closed. During fuel return or idling of the engine, the control valve is opened, and the inlet and the outlet of the supercharger, the air chamber, and the duct intercommunicate with each other to balance pressure.