Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.

Abstract: The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.

Abstract: The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.