Patents by Inventor Chien-Hsiang Liu

Chien-Hsiang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7554805
    Abstract: The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: June 30, 2009
    Assignee: Shuttle Inc.
    Inventors: Chien-Hsiang Liu, Fun-Son Yeh, Brian Chang
  • Publication number: 20080316706
    Abstract: The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.
    Type: Application
    Filed: June 25, 2007
    Publication date: December 25, 2008
    Inventors: Chien-Hsiang Liu, Fun-Son Yeh, Brian Chang