Abstract: A data storage device is provided. The data storage device includes a flash memory, a dynamic random access memory (DRAM), and a controller. The flash memory stores a logical-to-physical mapping (L2P) table which is divided into a plurality of group-mapping tables. The DRAM stores a first set of the group-mapping tables. The controller loads a second set of the group mapping tables from the flash memory to the DRAM to replace the first set of the group-mapping tables using a predetermined replacement mechanism, and each group-mapping table of the second set has a corresponding column in an access information table that includes a flag and an access count. In response to the corresponding column of a specific group-mapping table in the second set not being zero, the controller excludes the specific group-mapping table from the predetermined replacement mechanism.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, forming first and second semi-cured resin layers, stacking a first assembly of the first carrier, the first metal film, the first copper film and the first semi-cured resin layer on a second assembly of the second carrier, the second metal film, the second copper film and the second semi-cured resin layer, and vacuum hot pressing the first and second assemblies so as to complete cure and integrate the first and second semi-cured resin layers.

Abstract: A method of forming a bump includes performing wet etching a bonding pad on the wafer, and then sequentially forming an under ball metallurgy layer and a bump. Hillocks on the bonding pad can be removed after the wet etching process, and the bump has a planar or concave surface, whereby no nodules are formed on the bump.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, forming first and second semi-cured resin layers, stacking a first assembly of the first carrier, the first metal film, the first copper film and the first semi-cured resin layer on a second assembly of the second carrier, the second metal film, the second copper film and the second semi-cured resin layer, and vacuum hot pressing the first and second assemblies so as to complete cure and integrate the first and second semi-cured resin layers.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, sandwiching a prepreg containing a curable resin body, between a first assembly of the first carrier, the first metal film and the first copper film, and a second assembly of the second carrier, the second metal film and the second copper film, and vacuum hot pressing the prepreg and the first and second assemblies so as to completely cure the curable resin body of the prepreg to form a cured resin body that is bonded to the first and second copper films of the first and second assemblies.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second copper films on first and second carriers, sandwiching a prepreg containing a curable resin body, between a first assembly of the first carrier and the first copper film, and a second assembly of the second carrier and the second copper film, and vacuum hot pressing the prepreg and the first and second assemblies so as to completely cure the curable resin body of the prepreg to form a cured resin body that is bonded to the first and second copper films of the first and second assemblies.

Abstract: A conducting roller for an electroplating apparatus, includes: a conductive shaft having one end for making an electrical connection; a rotatable conductive sleeve provided coaxially around the conductive shaft with an annular space formed between the conductive shaft and the conductive sleeve; a plurality of rollable conductive elements disposed in the annular space; a rotatable first closure member which closes one end of the annular space, the first closure member being connected to the conductive shaft in a rotatable relationship and fixed to the conductive sleeve for simultaneous rotation; a drive member drivingly sleeved on the first closure member; a rotatable second closure member which closes another end of the annular space, the second closure member being connected to the conductive sleeve for simultaneous rotation and rotatably sleeved around the conductive shaft; and a tubular cover provided around the second closure member and fixed immovably to the conductive shaft.

Abstract: A roller electrode includes an elongated hollow roller, a stationary shaft, and an electrically conductive fluid. The hollow roller and the stationary shaft are electrically conductive. The hollow roller has an inner surface which confines an interior chamber. The stationary shaft is provided coaxially in the interior chamber of the hollow roller and is journalled to the hollow roller. The stationary shaft has an end section which extends out of the interior chamber for connection to a power supply. The fluid is provided in the interior chamber around the stationary shaft to provide a stable electrical connection between the stationary shaft and the hollow roller.