Abstract: A device includes a first conductive line as an input line. The device further includes a second conductive line as an output line, wherein the first conductive line and the second conductive line are in a same level of the integrated circuit. The device further includes a first passive isolation structure between the first conductive line and the second conductive line, wherein the first passive isolation structure and the second conductive line are each positioned at an integer multiple of an interval between the first conductive line and the first passive isolation structure.

Abstract: A method of modifying an integrated circuit layout includes determining whether a first conductive line and a second conductive line are subject to a parasitic capacitance above a parasitic capacitance threshold. The method further includes adjusting the integrated circuit layout by moving the first conductive line in the integrated circuit layout in response to determining to move the first conductive line. The method further includes inserting an isolation structure between the first and second conductive lines in the integrated circuit layout in response to determining not to move the first conductive line.

Abstract: A controller of a buck-boost conversion circuit and a mode switching method thereof are provided. The controller control operations of multiple switches of the buck-boost conversion circuit to convert an input voltage into an output voltage and provide an output current. The controller includes a slope compensation circuit, a control loop, and a mode switching circuit. The slope compensation circuit generates a slope compensation signal according to a mode switching signal of a current cycle. The control loop is coupled to the slope compensation circuit and the switches respectively, and is configured to generate multiple switch control signals according to the slope compensation signal, a feedback voltage related to the output voltage, and a current sense signal related to the output current to control the operations of the switches respectively. The mode switching circuit is coupled to the slope compensation circuit and the control loop.

Abstract: A method of modifying an integrated circuit layout includes determining whether a first conductive line and a second conductive line are subject to a parasitic capacitance above a parasitic capacitance threshold. The method further includes adjusting the integrated circuit layout by moving the first conductive line in the integrated circuit layout in response to determining to move the first conductive line. The method further includes inserting an isolation structure between the first and second conductive lines in the integrated circuit layout in response to determining not to move the first conductive line.

Abstract: A method of making an integrated circuit includes operations to identify reverse signal nets of the circuit layout, determine the parasitic capacitance in conductive lines, and determine how to adjust an integrated circuit layout to reduce the parasitic capacitance of the conductive lines to the reverse signal net. The method further includes an operation to determine whether to move one of the conductive lines in the integrated circuit layout, an operation to determine whether to insert an isolation structure between the conductive lines of the reverse signal net having parasitic capacitance, and operations to adjust the layout by moving a conductive line.

Abstract: A method includes reserving a routing track within a cell, the cell includes signal lines for connection to elements within the cell, the cell further includes a plurality of routing tracks, the reserved routing track is one of the plurality of routing tracks, and the reserved routing track is free of the signal lines. The method includes placing the cell in a chip-level layout, wherein the chip-level layout includes a plurality of power rails. The method includes determining whether any of the plurality of power rails overlaps with any of the plurality of routing tracks other than the reserved routing track. The method includes adjusting a position of the cell in the chip-level layout in response to a determination that at least one power rail of the plurality of power rails overlaps with at least one routing track of the plurality of routing tracks other than the reserved routing track.

Abstract: A system and method for transistor placement in a standard cell layout includes identifying a plurality of transistors in a circuit. A drain terminal of each of the plurality of transistors is connected to an output of the circuit. The system and method also include determining that a first transistor and a second transistor of the plurality of transistors satisfy a merging priority, combining an active region of the first transistor and the second transistor to form a mega transistor having a common active region, and replacing the first transistor and the second transistor in the standard cell layout of the circuit with the mega transistor. The common active region combines the active region of a first drain terminal of the first transistor and a second drain terminal of the second transistor.

Abstract: A method of making an integrated circuit includes operations to identify reverse signal nets of the circuit layout, determine the parasitic capacitance in conductive lines, and determine how to adjust an integrated circuit layout to reduce the parasitic capacitance of the conductive lines to the reverse signal net. The method further includes an operation to determine whether to move one of the conductive lines in the integrated circuit layout, an operation to determine whether to insert an isolation structure between the conductive lines of the reverse signal net having parasitic capacitance, and operations to adjust the layout by moving a conductive line.

Abstract: A method of making an integrated circuit includes operations to identify reverse signal nets of the circuit layout, determine when the conductive lines to the reverse signal net have parasitic capacitance, and determine how to adjust an integrated circuit layout to reduce the parasitic capacitance of the conductive lines to the reverse signal net. The method further includes an operation to determine whether to move one of the conductive lines in the integrated circuit layout, and an operation to determine whether to insert an isolation structure between the conductive lines of the reverse signal net having parasitic capacitance.

Abstract: A method of making an integrated circuit includes operations to identify reverse signal nets of the circuit layout, determine when the conductive lines to the reverse signal net have parasitic capacitance, and determine how to adjust an integrated circuit layout to reduce the parasitic capacitance of the conductive lines to the reverse signal net. The method further includes an operation to determine whether to move one of the conductive lines in the integrated circuit layout, and an operation to determine whether to insert an isolation structure between the conductive lines of the reverse signal net having parasitic capacitance.

Abstract: A method includes reserving a routing track within a cell, the cell includes signal lines for connection to elements within the cell, the cell further includes a plurality of routing tracks, the reserved routing track is one of the plurality of routing tracks, and the reserved routing track is free of the signal lines. The method includes placing the cell in a chip-level layout, wherein the chip-level layout includes a plurality of power rails. The method includes determining whether any of the plurality of power rails overlaps with any of the plurality of routing tracks other than the reserved routing track. The method includes adjusting a position of the cell in the chip-level layout in response to a determination that at least one power rail of the plurality of power rails overlaps with at least one routing track of the plurality of routing tracks other than the reserved routing track.

Abstract: A heating apparatus for a nozzle of an injection machine includes a helical-spring shaped heating portion, a first sleeve, and a second sleeve. The first sleeve includes a first blocking portion and forms internal threads. The second sleeve includes a second blocking portion and forms external threads. The heating portion is received in the second sleeve. The internal threads are screwed into the external threads. The first blocking portion and the second blocking portion sandwich the heating portion.

Abstract: A heating apparatus for a nozzle of an injection machine includes a helical-spring shaped heating portion, a first sleeve, and a second sleeve. The first sleeve includes a first blocking portion and forms internal threads. The second sleeve includes a second blocking portion and forms external threads. The heating portion is received in the second sleeve. The internal threads are screwed into the external threads. The first blocking portion and the second blocking portion sandwich the heating portion.

Abstract: An injection mold includes a first plate, a second plate, a movable plate, a ball screw, a ball nut, an injection screw, a transmission shaft, an injection motor, a metering motor, a first driving assembly and a second driving assembly. The ball screw is rotatably supported by the first plate. The ball nut is fixed to the movable plate, and is threadedly engaged with the ball screw. The injection screw is coaxially positioned with the ball screw. The transmission shaft is rotatably supported by the second plate. The injection motor is fixedly mounted on the first plate. The metering motor is fixed mounted on the second plate. The first driving assembly is connected to the injection motor to drive the ball screw. The second driving assembly is connected to the metering motor to rotate the transmission shaft for moving the injection screw.

Abstract: An injection mold includes a first plate, a second plate, a movable plate, a ball screw, a ball nut, an injection screw, a transmission shaft, an injection motor, a metering motor, a first driving assembly and a second driving assembly. The ball screw is rotatably supported by the first plate. The ball nut is fixed to the movable plate, and is threadedly engaged with the ball screw. The injection screw is coaxially positioned with the ball screw. The transmission shaft is rotatably supported by the second plate. The injection motor is fixedly mounted on the first plate. The metering motor is fixed mounted on the second plate. The first driving assembly is connected to the injection motor to drive the ball screw. The second driving assembly is connected to the metering motor to rotate the transmission shaft for moving the injection screw.

Abstract: A high-performance liquid magnetizer including a powerful magnet and a fluid sink. A spiral fluid guide being disposed in the fluid sink. A first opening disposed at the center of the sink and a second opening on one side of the fluid guide. The liquid flowing through the first opening into the fluid guide towards the second opening. The spiral sink extending the magnetization time for the fluid while the revolving direction of the liquid help improve the magnetism field effects.

Abstract: A high-performance liquid magnetizer including a powerful magnet and a fluid sink. A spiral fluid guide being disposed in the fluid sink. A first opening disposed at the center of the sink and a second opening on one side of the fluid guide. The liquid flowing through the first opening into the fluid guide towards the second opening. The spiral sink extending the magnetization time for the fluid while the revolving direction of the liquid help improve the magnetism field effects.

Abstract: A method of fabricating a color filter substrate is described. A black matrix is formed on a substrate. A color photoresist is formed for covering the black matrix. A photomask is located over the substrate, and then an exposure process is performed. The photomask comprises a transparent region, a partial transparent region and a no-transparent region, wherein the partial transparent region is located between the transparent region and the no-transparent region and is also located at the edge of the black matrix. A development process is performed for patterning the color photoresist. Since the exposure process is performed with the photomask via the partial transparent region, the issue that the height difference exists at the edge of the black matrix due to using black resin can be resolved.

Abstract: A display element has a luminescent body formed on a glass substrate, a glass cap with the rim bonded to the rim of the glass substrate, and a sealing layer of frit formed on the bonding region between the glass substrate and the glass cap. In encapsulating, the display element is placed between a pedestal an a pressing plate, and then a high-power laser beam is provided to penetrate the glass cap to focus on the sealing layer, resulting in sintering frit. Also, pressure is applied to the pedestal and the pressing plate.

Abstract: An alignment tool for assembling a rear plate and a frame of a flat display panel is introduced. The rear plate includes a front surface, a rear surface opposing to the front surface for adhering with the frame in an aligning process, and an alignment mark located at the front surface. The alignment mark has a predetermined thickness and is protruded from the front surface. The alignment tool includes a base, a clamp arm and an upper arm. The base further includes a base top surface and an alignment notch. The base top surface is used for contacting with the front surface of the rear plate and the alignment notch has at least two alignment sides for matching with the alignment mark. The clamp arm is protruded from the base, and the upper arm is protruded from the clamp arm and used for aligning with the frame. The upper arm includes an arm lower surface parallel to and spaced apart from the base top surface by a predetermined distance for forming an open space in between.