Abstract: A method of forming a semiconductor device includes forming source/drain regions on opposing sides of a gate structure, where the gate structure is over a fin and surrounded by a first dielectric layer; forming openings in the first dielectric layer to expose the source/drain regions; selectively forming silicide regions in the openings on the source/drain regions using a plasma-enhanced chemical vapor deposition (PECVD) process; and filling the openings with an electrically conductive material.

Abstract: A container feeding device includes a casing and first and second latch members. The casing defines a lower retaining space for receiving a plurality of containers that are stacked on one another. The first latch member is operable to enter the lower retaining space for supporting a bottommost container, or leave the lower retaining space to release the bottommost container. The second latch member enters the lower retaining space to support a second bottommost container when the bottommost container is released by the first latch member.

Abstract: A tool set includes a tool holder, a tool and a tool rack. The tool has a groove unit. The tool holder has a latch unit that engages the groove unit. The tool rack includes a rack body and a blocking member. When the tool holder is moved away from the rack body after the tool is moved into the rack body by the tool holder and after the blocking member moves to a blocking position, the tool is blocked by the blocking member so that the latch unit is separated from the groove unit and that the tool holder is separated from the tool.

Abstract: A memory structure including a substrate, a first doped region, a second doped region, a first gate, a second gate, a first charge storage structure, and a second charge storage structure is provided. The first gate is located on the first doped region. The second gate is located on the second doped region. The first charge storage structure is located between the first gate and the first doped region. The first charge storage structure includes a first tunneling dielectric layer, a first dielectric layer, and a first charge storage layer. The second charge storage structure is located between the second gate and the second doped region. The second charge storage structure includes a second tunneling dielectric layer, a second dielectric layer, and a second charge storage layer. The thickness of the second tunneling dielectric layer is greater than the thickness of the first tunneling dielectric layer.

Abstract: A mounting frame for being mounted with either one of first and second screwdrivers, includes a main frame, a mounting seat, and first and second mounting plates. The mounting seat has a plate attachment hole set. The first mounting plate has a first seat attachment hole set operable to be connected to the plate attachment hole set, and a first driver attachment hole set for the first screwdriver to be attached thereto. The second mounting plate has a second seat attachment hole set operable to be connected to the plate attachment hole set, and a second driver attachment hole set for the second screwdriver to be attached thereto.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.

Abstract: A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A TV decoder. The decoder comprises a converter producing a plurality of first bits by sampling a base-band TV signal within a sampling period, and transmitting the first bits in groups, wherein the first bits in each one of the groups undergo parallel transmission through a plurality of first signals, and a demodulator receives the first bits and produces a plurality of second bits controlling the first signals, wherein the second bits are sequentially transmitted through a second signal input to the converter.

Abstract: A TV decoder. The decoder comprises a converter producing a plurality of first bits by sampling a base-band TV signal within a sampling period, and transmitting the first bits in groups, wherein the first bits in each one of the groups undergo parallel transmission through a plurality of first signals, and a demodulator receives the first bits and produces a plurality of second bits controlling the first signals, wherein the second bits are sequentially transmitted through a second signal input to the converter.

Abstract: A VGA to TV data transformation system uses a background-based adaptive flicker reduction method. Information in a picture displayed on a screen of a monitor is divided as graphic and video information. Graphic information which includes cursor, graphic data, and sub-picture of video data in video information is prone to flicker. A background-based adaptive flicker reduction is applied to pixels in regions containing graphic information. A current pixel and the adjacent pixels directly above and below the current pixel are used to compute Mean and Diff values. The background state of a current pixel is determined by comparing the Mean value with a threshold value. The background state, the Mean value and the Diff value are then used to select a flicker reduction mode that may be strong reduction, median reduction, mild reduction or no reduction. An anti-flicker pixel is generated according to the flicker reduction mode.

Abstract: In an image scaling method and apparatus that uses adaptive edge enhancement, a plurality of sets of gradient threshold values and enhancement threshold values correspond respectively to predetermined enhancement modes. The enhancement mode corresponding to a mean pixel value for a one-dimensional pixel array that includes a center pixel to be updated and neighboring pixels of the center pixel is determined so that one of the sets of gradient threshold values and enhancement threshold values corresponding to the selected enhancement mode can be selected. After a sharpness value is computed by adding together absolute values of differences between values of the center pixel and each of the neighboring pixels, one of the enhancement threshold values in the selected set is selected by comparing the sharpness value with the gradient threshold values in the selected set.

Abstract: The present invention generally relates to the conversion of a picture data in an interlaced format to a progressive format, and more particularly, to an adaptive edge-based scan line interpolation method and apparatus for improving the picture quality in a display system. The present invention provides a method and apparatus for converting interlaced scanning images to progressive images by using simple motion detection procedure and adaptive edge-interpolation. Therefore, the present invention is capable of performing the interlaced-to-progressive conversion with less hardware and buffer cost. Besides, the present invention performs the motion detection by examining the 1-D (one-dimension) pixel array at the adjacent fields. Therefore, the computation of the interlaced-to-progressive conversion of the present invention is less complex than the prior art. Furthermore, the video image of the present invention has a sharper video image with edge preservation and flicker reduction.

Abstract: An adaptive anti-flicker data conversion system for converting picture data in a video graphic adapter for displaying on a television. The conversion system reduces flickers adaptively according to the luminance of a pixel and neighboring pixels one line above and below. Contrast difference and mean value are defined based on the luminance of three neighboring pixels. A contrast ratio is computed by dividing the contrast difference by the mean value. Three threshold values are defined for examining the contrast ratio and selecting an appropriate anti-flicker filter. Pixels having higher contrast ratio are processed with filters having stronger anti-flicker effect. The adaptive anti-flicker method reduces flickers without blurring every pixel in the picture data.