Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: An antenna module includes first to third radiators and a ground radiator. The first radiator includes first and second sections and excites at a first frequency band. An extension direction of the first section, including a feeding end, is not parallel to an extension direction of the second section. The second radiator includes third and fourth sections. The third section extends from an intersection of the first and second sections. The third section excites at a second frequency band. The third radiator is disposed beside the first radiator and away from the second radiator. The ground radiator is disposed on one side of the first, second, and third radiators, and includes a ground end. The fourth section of the second radiator is connected to the third section and the ground radiator. The third radiator is connected to the ground end.

Abstract: An insole/sole structure contains: a top pad, two massage column modules, a form pad, and a bottom pad. The top pad includes at least one accommodation groove. A respective one of the at least one massage column module includes a holding portion and multiple flexible massaging columns. The respective one massage column module is connected on the top pad by using the holding portion. The multiple flexible massaging columns are held on the holding portion to correspond to a profile of a respective one accommodation groove. A profile of the foam pad and a profile of the bottom pad correspond to a profile of the top pad, such that when the foam pad and the bottom pad are connected, the foam pad and the bottom pad are closed, and the respective one massage column module is limited between the top pad and the foam pad.

Abstract: A Taiko wafer ring cut process method is provided. The Taiko wafer ring cut process method includes the following steps. A Taiko wafer is disposed on the platform. The Taiko wafer is performing by laser ring cutting so that a Taiko ring and an edge portion of the Taiko wafer are separated from a wafer portion of the Taiko wafer. The wafer portion of the Taiko wafer is adhered to a frame.

Abstract: A power supply apparatus (10) suppressing a transient voltage is applied to an input voltage (50). The power supply apparatus (10) includes a power supply circuit (20), a feedback signal generation circuit (30) and a feedback signal control circuit (40). If the power supply circuit (20) stops receiving the input voltage (50), the feedback signal control circuit (40) controls the feedback signal generation circuit (30) to discharge so that the feedback signal generation circuit (30) controls the power supply circuit (20) to decrease an output voltage (60), so that when the power supply circuit (20) receives the input voltage (50) again, the power supply circuit (20) avoids generating an output overvoltage condition for the output voltage (60).

Abstract: A Taiko wafer ring cut process method is provided. The Taiko wafer ring cut process method includes the following steps. A Taiko wafer is disposed on the platform. The Taiko wafer is performing by laser ring cutting so that a Taiko ring and an edge portion of the Taiko wafer are separated from a wafer portion of the Taiko wafer. The wafer portion of the Taiko wafer is adhered to a frame.

Abstract: A crucible includes a crucible body and at least one protrusion. The crucible body has a containing groove. The protrusion is disposed on an outer wall surface of the crucible body. The protrusion protrudes outward from the outer wall of the crucible body. A vapor deposition apparatus includes a metal base and a crucible. The crucible is disposed in the metal base. The crucible includes a crucible body and at least one protrusion. The crucible body has a containing groove, and the containing groove is used for adding a vapor deposition material. The protrusion is disposed on an outer wall surface of the crucible body. The protrusion protrudes outward from the outer wall of the crucible body, and the protrusion abuts the inner wall of the metal base.

Abstract: A power supply apparatus (10) suppressing a transient voltage is applied to an input voltage (50). The power supply apparatus (10) includes a power supply circuit (20), a feedback signal generation circuit (30) and a feedback signal control circuit (40). If the power supply circuit (20) stops receiving the input voltage (50), the feedback signal control circuit (40) controls the feedback signal generation circuit (30) to discharge so that the feedback signal generation circuit (30) controls the power supply circuit (20) to decrease an output voltage (60), so that when the power supply circuit (20) receives the input voltage (50) again, the power supply circuit (20) avoids generating an output overvoltage condition for the output voltage (60).

Abstract: An insole/sole structure contains: a top pad, two massage column modules, a form pad, and a bottom pad. The top pad includes at least one accommodation groove. A respective one of the at least one massage column module includes a holding portion and multiple flexible massaging columns. The respective one massage column module is connected on the top pad by using the holding portion. The multiple flexible massaging columns are held on the holding portion to correspond to a profile of a respective one accommodation groove. A profile of the foam pad and a profile of the bottom pad correspond to a profile of the top pad, such that when the foam pad and the bottom pad are connected, the foam pad and the bottom pad are closed, and the respective one massage column module is limited between the top pad and the foam pad.

Abstract: A heat exchange unit is disclosed. At least one air opening of the heat exchange unit is formed from a sloped surface, enabling the area of the air opening to exceed the cross-sectional area of heat exchange of the heat exchange unit, and further enhancing heat exchange efficiency. A heat exchange device employing the heat exchange unit and a closed electrical apparatus employing the heat exchange device are also disclosed.

Abstract: A manufacturing process of wafer thinning includes a step of wafer-grinding to grind a surface of a wafer to a first predetermined thickness, and a step of wafer-etching to etch the grinded face of the wafer with the first predetermined thickness to a second predetermined thickness.

Abstract: A manufacturing process of wafer thinning includes a step of wafer-grinding to grind a surface of a wafer to a first predetermined thickness, and a step of wafer-etching to etch the grinded face of the wafer with the first predetermined thickness to a second predetermined thickness.

Abstract: An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.

Abstract: An integrated fan includes a centrifugal blade unit and a frame. The centrifugal blade unit has a hub. The frame is used for accommodating the centrifugal blade unit. The frame includes a first casing, a second casing and at least one airflow-guiding plate. The first casing includes a main plate and an airflow inlet, wherein the airflow inlet is disposed in the main plate and aligned with the hub. The second casing is opposed to the main plate of the first casing. The at least one airflow-guiding plate is aslant and externally extended from an edge of the main plate. The airflow-guiding plate, the first casing and the second casing collectively define an airflow output channel. An included angle between an airflow-leaving direction of the airflow output channel and an airflow-entering direction of the airflow inlet is ranged between 90 and 180 degrees.

Abstract: An image sensor for light field devices includes a plurality of sub-microlenses, a space layer, and a plurality of main microlenses. The space layer is disposed on the sub-microlenses, and the main microlenses are disposed on the space layer. The diameter of each of the main microlenses exceeds that of each of the sub-microlenses.

Abstract: An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.

Abstract: A heat exchange device includes a housing, an internal circulating fan, an external circulating fan and a heat exchange unit. The internal and external circulating fans and the heat exchange unit are disposed in the housing. The internal and external circulating fans are disposed at the same side relative to the heat exchange unit. A closed-type electronic apparatus including the heat exchange device is also disclosed.

Abstract: An air-cooled heat exchanger includes a casing, a first heat-exchanging core, a second heat-exchanging core, a first internal driving device, a second internal driving device and an external driving device. The first internal driving device is used for driving a first internally-circulated airflow to flow along a first internal circulation path. The second internal driving device is used for driving a second internally-circulated airflow to flow along a second internal circulation path. The external driving device is used for driving a first externally-circulated airflow to flow along a first external circulation path and driving a second externally-circulated airflow to flow along a second external circulation path. The first heat-exchanging core is configured to perform heat exchange between the first internally-circulated airflow and the first externally-circulated airflow.

Abstract: A heat exchanger is provided. The heat exchanger includes a heat dissipation module, an inner heat-dissipating device and an outer heat-dissipating device. The heat dissipation module includes a body, a plurality of first inlets, a plurality of first outlets, a plurality of second inlets, a plurality of second outlets, a plurality of first flow paths and a plurality of second flow paths, wherein the first flow paths are staggered with the second flow paths, and the first inlets and the first outlets are communicated with the first flow paths, the second inlets and the second outlets are communicated with the second flow paths, the body includes a first surface and a second surface opposite to the first surface, the first inlets and the first outlets are formed on the first surface, and the second inlets and the second outlets are formed on the second surface.

Abstract: An air-cooled heat exchanger includes a casing, a first heat-exchanging core, a second heat-exchanging core, a first internal driving device, a second internal driving device and an external driving device. The first internal driving device is used for driving a first internally-circulated airflow to flow along a first internal circulation path. The second internal driving device is used for driving a second internally-circulated airflow to flow along a second internal circulation path. The external driving device is used for driving a first externally-circulated airflow to flow along a first external circulation path and driving a second externally-circulated airflow to flow along a second external circulation path. The first heat-exchanging core is configured to perform heat exchange between the first internally-circulated airflow and the first externally-circulated airflow.