Abstract: Reliable connectors configured for easy locking/unlocking. A connector can include a first end configured to mate with a first mating component in a first direction, and a second end configured to mate with a second mating component in a second direction perpendicular to the first direction. The connector can include a locking member configured to move between locked and unlocked positions by a force applied in a third direction perpendicular to both the first and second directions. Such a configuration reduces the risk of interfering with connections between the mated components when applying the force and therefore provide more reliable connectors. The connectors can include a shell with a guiding structure to reduce the risk of damage to lightweight connectors that might otherwise be damaged due to misalignment during mating/unmating. Such a shell can be used with locking members configured for using within electronic systems with densely packed components.

Abstract: A semiconductor device includes a first transistor, a second transistor, a first metal silicide layer, a second metal silicide layer, and an isolation structure. The first transistor includes a first channel layer, a first gate structure, and first source/drain epitaxy structures. The second transistor includes a second channel layer, a second gate structure, and second source/drain epitaxy structures. The first metal silicide layer is over one of the first source/drain epitaxy structures. The second metal silicide layer is over one of the second source/drain epitaxy structures. The isolation structure covers the one of the first source/drain epitaxy structures and the one of the second source/drain epitaxy structures, wherein in a cross-sectional view, the one of the first source/drain epitaxy structures is separated from the isolation structure through the first metal silicide layer, while the one of the second source/drain epitaxy structures is in contact with the isolation structure.

Abstract: An electronic device, including a metal back cover, a ground radiator, a third radiator, and a metal frame including a first cutting opening, a second cutting opening, a first radiator located between the first cutting opening and the second cutting opening, and a second radiator located beside the second cutting opening and separated from the first radiator by the second cutting opening, is provided. An end of a first slot formed between the metal back cover and a first part of the first radiator is communicated with the first cutting opening, and a second slot formed between the metal back cover and a second part of the first radiator and between the metal back cover and the second radiator is communicated with the second cutting opening. The ground radiator connects the metal back cover and the first radiator and separates the first slot from the second slot.

Abstract: A hardcoded credential attack detection and prevention system as disclosed herein distinguishes between legitimate uses and malicious uses to prevent attacks using hardcoded credentials without obstructing legitimate uses that still rely on hardcoded credentials. The system collects publicly disclosed hardcoded credentials and creates network traffic based signatures to detect login attempts corresponding to the publicly disclosed hardcoded credentials. The system then uses the created “login signatures” to detect login attempts corresponding to the hardcoded credentials. While detection with the login signatures occurs inline at individual network devices with visibility of the network traffic, the system obtains relevant network traffic from other network devices to analyze login behavior on a wider scale.

Abstract: This document describes systems and techniques directed at a machine-learning-based greedy optimization mechanism for reducing radio-frequency (RF) tests in production. In aspects, a process capability index is disclosed, the process capability index used to refine a test-set. The test-set includes tests configured to be performed on an electronic device. The process capability index is configured based on upper specification limits and lower specification limits of the electronic device for each test in the test-set, as well as results for each of the tests in the test-set. The process capability index is further configured based on a new upper specification limit and a new lower specification limit of the electronic device for a new test not in the test-set, as well as results for the new test.

Abstract: The present application relates to a composite material and a method for molding the same. Firstly, components to be pressed is disposed in a gas-isolation element, and located between two pressing plates. Next, a plate is disposed based on a location of a prepreg element of the components, and then a hot pressing step is performed. After the hot pressing step, a cooling step is performed, thereby producing the composite material of the present application. A dimension of the composite material can be easily adjusted to meet requirements of various applications.

Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.

Abstract: An antenna module includes a feeding end, multiple first forked radiators, and multiple connecting parts. The first forked radiators are disposed side by side. The connecting parts respectively extend from the feeding end to the first forked radiators. The feeding end, the first forked radiators, and the connecting parts are located on a same plane. The antenna module resonates at a frequency band, and a path length from the feeding end to an end of each of the forked radiators through the corresponding connecting part is ¼ wavelength of the frequency band.

Abstract: An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slit. The antenna module is separated from the metal back cover and disposed far away from the slit. The antenna module includes an antenna radiator, a first ground radiator, and a connection radiator. The antenna radiator includes a first section, a second section, and a third section that are sequentially connected and form bends, and the first section has a feeding end. A first slot is formed between the first ground radiator, the first section, the second section, and a part of the third section. A width and length of the first slot are associated with a center frequency and impedance matching of a high frequency band.

Abstract: An electronic device, including a metal back cover, a front cover, a metal wall, and at least one antenna radiator, is provided. The front cover covers the metal back cover and includes a frame area. The metal wall is disposed between the metal back cover and the front cover, and forms a metal cavity corresponding to the frame area together with the metal back cover. Each of the at least one antenna radiator is disposed in the metal cavity, is connected to a first side wall of the metal back cover, and is spaced apart from the metal wall by a distance.

Abstract: An antenna module disposed on a substrate having a first and a second surface opposite to each other includes a microstrip line, a first radiator, a ground radiator and a ground plane. The microstrip line, the first radiator and the ground radiator are disposed on the first surface. The microstrip line includes a first and a second end opposite to each other. The first end includes a first feeding end. The first radiator is connected to the second end of the microstrip line. The ground radiator surrounds the microstrip line and the first radiator and has a first opening and two opposite grounding ends. The first end of the microstrip line is located in the first opening. A gap is formed between each grounding end and the first feeding end. The ground plane is disposed on the second surface. The ground radiator is connected to the ground plane.

Abstract: An image processing circuit performs super-resolution (SR) operations. The image processing circuit includes memory to store multiple parameter sets of multiple artificial intelligence (AI) models. The image processing circuit further includes an image guidance module, a parameter decision module, and an SR engine. The image guidance module operates to detect a representative feature in an image sequence including a current frame and past frames within a time window. The parameter decision module operates to adjust parameters of one or more AI models based on a measurement of the representative feature. The SR engine operates to process the current frame using the one or more AI models with the adjusted parameters to thereby generate a high-resolution image for display.

Abstract: A nebulizer device and a nozzle module are provided. The nebulizer device includes a nebulizer module, the nozzle module, and a control module. The nozzle module includes a main body unit and a guide unit. The main body unit can be detachably connected to the nebulizer module. The main body unit has a plurality of openings penetratingly formed therethrough, an accommodating space, and an output part, and the openings and the output part are in spatial communication with the accommodating space. The main body unit corresponds to an inner wall of the accommodating space and protrudes toward the accommodating space to form a plurality of guiding parts, and each of the guiding parts is adjacent to one of the openings. The guide unit is disposed in the accommodating space and has a recessed part. The control module can be detachably connected to the main body unit.

Abstract: A method for near field communication with a serial transmission microcontroller and an NFC tag device using the same are provided in the present invention. The method includes: providing a serial interface microcontroller; capturing an NFC carrier signal from an NFC LC resonant circuit; performing a frequency division to the NFC carrier signal to obtain a NFC clock signal; filtering the NFC carrier signal from the NFC LC resonant circuit to obtain an envelope signal; sequentially receiving a digital sequence of the envelope signal according to triggering of the NFC clock signal based on a serial transmission protocol; and decoding an NFC data from the digital sequence based on an NFC transmission protocol rule.

Abstract: A molding method of a support rod that first passing a plurality of long fibers through a resin bath for impregnating with resin, then passing the plurality of long fibers impregnated with resin through a bundling hole of a position-constrained vertical plate on a machine to preliminarily form a bundle end; providing a coating layer on the machine, one end of the coating layer obliquely passes through a guiding portion on the position-constrained vertical plate to downwardly contact the bundle end; then placing the one end of the coating layer and the bundle end into a mold cavity of a mold at the same time to form a long rod body; and then cutting the long rod body into multi-segment support rods through a cutting process.

Abstract: An antenna module includes a transceiver chip, a transmitting array antenna, a receiving array antenna, two bandpass filters, and two capacitors. The transmitting array antenna and the receiving array antenna are symmetrically disposed at the two opposite sides of the transceiver chip. One of the bandpass filters is disposed between the transceiver chip and the transmitting array antenna and connected to the transceiver chip and the transmitting array antenna. The other bandpass filter is disposed between the transceiver chip and the receiving array antenna and connected to the transceiver chip and the receiving array antenna. One of the capacitors is disposed between the transmitting array antenna and the corresponding bandpass filter and connected to the transmitting array antenna and the corresponding bandpass filter. The other capacitor is disposed between the receiving array antenna and the corresponding bandpass filter and connected to the receiving array antenna and the corresponding bandpass filter.

Abstract: A gate driving device and an operating method are provided. The gate driving device includes a plurality of gate driving circuits and a control circuit. The gate driving circuits generate a plurality of gate driving signals having different timing. The control circuit is coupled to a plurality of candidate gate driving circuits among the gate driving circuits. The control circuit selects one of the candidate gate driving circuits as an initial stage gate driving circuit per one scanning cycle. A series connection mode between the gate driving circuits is changed in response to a scan selection signal.

Abstract: Methods and systems for dry etching are disclosed. The methods and systems use a showerhead with a perforated plate. The perforated plate includes a primary solid zone having no holes; a first annular zone comprising a first plurality of holes with a first total hole area; a secondary solid zone having no holes; a second annular zone comprising a second plurality of holes with a second total hole area; a third annular zone comprising a third plurality of holes with a third total hole area; and a fourth annular zone comprising a fourth plurality of holes with a fourth total hole area. The third total hole area is greater than the first total hole area and less than the second total hole area, and the fourth total hole area is greater than the second total hole area. Dry etched wafers using these systems have improved edge uniformity and improved yield.

Abstract: A method of damping mechanical vibration includes applying on a source of mechanical vibration a formulation including an aqueous polymer emulsion prepared by an emulsion polymerization reaction of at least one emulsion-polymerizable monomer and a support resin.