Abstract: An electronic device including a metal casing and at least one antenna module is provided. The metal casing includes at least one window. The at least one antenna module is disposed in the at least one window. The at least one antenna module includes a first radiator and a second radiator. The first radiator includes a feeding end, a first ground end joined to the metal casing, a second ground end, a first portion extending from the feeding end to the first ground end, and a second portion extending from the feeding end to the second ground end. A first coupling gap is between the second radiator and the first portion. A second coupling gap is between at least part of the second radiator and the metal casing, and the second radiator includes a third ground end joined to the metal casing.

Abstract: An antenna module includes a first metal plate and a frame body. The frame body surrounds the first metal plate. The frame body includes a first antenna radiator, a second antenna radiator, a third antenna radiator, a first breakpoint and a second breakpoint. The first antenna radiator includes a first feeding end and excites a first frequency band. The second antenna radiator includes a second feeding end and excites a second frequency band. The third antenna radiator includes a third feeding end and excites a third frequency band. The first breakpoint is located between the first antenna radiator and the second antenna radiator. The second breakpoint is located between the second antenna radiator and the third antenna radiator. An electronic device including the above-mentioned antenna module is also provided.

Abstract: A foldable electric bicycle includes a foldable body, a first sensing object, a motor, a motor controller, and a first sensor. The foldable body includes a first frame, a second frame, and a latch. The first frame is foldably connected to the second frame to make the first frame operably unfolded to a safe state or folded to a folded state relative to the second frame. The first sensing object is disposed on the latch. The latch is disposed on the second frame. The first sensor is disposed on the first frame. When the first sensor cannot sense the first sensing object, the motor controller turns off the motor.

Abstract: A semiconductor device includes a single-layered dielectric layer, a conductive line, a conductive via and a conductive pad. The conductive line and the conductive via are disposed in the single-layered dielectric layer. The conductive pad is extended into the single-layered dielectric layer to electrically connected to the conductive line.

Abstract: An antenna module includes first to third radiators and a ground radiator. The first radiator includes first and second sections and excites at a first frequency band. An extension direction of the first section, including a feeding end, is not parallel to an extension direction of the second section. The second radiator includes third and fourth sections. The third section extends from an intersection of the first and second sections. The third section excites at a second frequency band. The third radiator is disposed beside the first radiator and away from the second radiator. The ground radiator is disposed on one side of the first, second, and third radiators, and includes a ground end. The fourth section of the second radiator is connected to the third section and the ground radiator. The third radiator is connected to the ground end.

Abstract: A surge protection system includes a receptacle body, at least one power output jack, a power obtaining device, at least one surge protection module, a microcontroller unit, and a surge detection circuit. The at least one surge protection module includes a housing, a memory element, and a surge protection circuit that includes a surge absorption element and a thermal fuse connected in series and parallel. The surge absorption element absorbs a surge inputted from an external power supply, and the memory element records a number of surges carried by the surge absorption element. When the surge enters the surge protection system from the external power supply, the surge absorption element absorbs the surge, and the surge detection circuit outputs a signal to the microcontroller unit that writes the number of surges carried by the surge absorption element into the memory element.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: The disclosure provides an electronic device, including a circuit board, multiple semiconductor components, a first light reflecting structure, and a second light reflecting structure. The circuit board includes a substrate, and the substrate may have a first surface and at least one side surface. The multiple semiconductor components are disposed on the first surface. The first light reflecting structure is disposed on the first surface. The second light reflecting structure is disposed on the first surface and the at least one side surface.

Abstract: An antenna module includes a first antenna radiator including a feeding terminal, a second antenna radiator, a first ground radiator, a second ground radiator and a capacitive element. The second antenna radiator is disposed on one side of the first antenna radiator, and a first gap is formed between a main portion of the second antenna radiator and the first antenna radiator. The first ground radiator is disposed on another side of the first antenna radiator, and a second gap is formed between the first antenna radiator and the first antenna radiator. The second ground radiator is disposed between the second antenna radiator and the first ground radiator, and a third gap is formed between the second ground radiator and a first branch of the second antenna radiator. The capacitive element is disposed on the third gap and connects the second antenna radiator and the second ground radiator.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: An integrated circuit (IC) structure includes a substrate having several regions, several semiconductor devices formed at the substrate and respectively within the regions, and an ultra-deep (UD) trench isolation structure formed in the substrate. The substrate has a top surface and a bottom surface oppositely, and the UD trench isolation structure formed in the substrate surrounds peripheries of each of the regions for structurally and physically isolating the semiconductor devices within different regions. The UD trench isolation structure penetrates the substrate by extending from the top surface of the substrate to the bottom surface of the substrate.

Abstract: A gate driving device and an operating method are provided. The gate driving device includes a plurality of gate driving circuits and a control circuit. The gate driving circuits generate a plurality of gate driving signals having different timing. The control circuit is coupled to a plurality of candidate gate driving circuits among the gate driving circuits. The control circuit selects one of the candidate gate driving circuits as an initial stage gate driving circuit per one scanning cycle. A series connection mode between the gate driving circuits is changed in response to a scan selection signal.

Abstract: Methods and systems for dry etching are disclosed. The methods and systems use a showerhead with a perforated plate. The perforated plate includes a primary solid zone having no holes; a first annular zone comprising a first plurality of holes with a first total hole area; a secondary solid zone having no holes; a second annular zone comprising a second plurality of holes with a second total hole area; a third annular zone comprising a third plurality of holes with a third total hole area; and a fourth annular zone comprising a fourth plurality of holes with a fourth total hole area. The third total hole area is greater than the first total hole area and less than the second total hole area, and the fourth total hole area is greater than the second total hole area. Dry etched wafers using these systems have improved edge uniformity and improved yield.

Abstract: A method of damping mechanical vibration includes applying on a source of mechanical vibration a formulation including an aqueous polymer emulsion prepared by an emulsion polymerization reaction of at least one emulsion-polymerizable monomer and a support resin.

Abstract: A micro-speaker includes a frame, a diaphragm on the frame, a magnetic structure and a voice coil in the frame, and upper side of the voice coil is fixedly connected to the diaphragm. The magnetic structure is arranged below the voice coil. A voice coil balance system is arranged in the frame, which is composed of two symmetrically arranged dampers, which are respectively arranged below two ends of the long axis of the voice coil, and fixed with glue. The damper includes a first end portion, a second end portion and a cantilever connecting the first end portion and the second end portion. The cantilever extended from the first end portion has a curved shape, with at least one arc greater than or equal to 180 degrees, and at least one inflection point that makes the curved cantilever turn from convex to concave or from concave to convex.